NL8900480A - Werkwijze en inrichting voor het drogen van substraten na behandeling in een vloeistof. - Google Patents

Werkwijze en inrichting voor het drogen van substraten na behandeling in een vloeistof. Download PDF

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Publication number
NL8900480A
NL8900480A NL8900480A NL8900480A NL8900480A NL 8900480 A NL8900480 A NL 8900480A NL 8900480 A NL8900480 A NL 8900480A NL 8900480 A NL8900480 A NL 8900480A NL 8900480 A NL8900480 A NL 8900480A
Authority
NL
Netherlands
Prior art keywords
liquid
substrates
vapor
shaped member
organic solvent
Prior art date
Application number
NL8900480A
Other languages
English (en)
Dutch (nl)
Original Assignee
Philips Nv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Nv filed Critical Philips Nv
Priority to NL8900480A priority Critical patent/NL8900480A/nl
Priority to EP90200409A priority patent/EP0385536B1/en
Priority to DE69012373T priority patent/DE69012373T2/de
Priority to JP2042302A priority patent/JP3009699B2/ja
Priority to KR1019900002291A priority patent/KR0173449B1/ko
Priority to CN90100958A priority patent/CN1023450C/zh
Publication of NL8900480A publication Critical patent/NL8900480A/nl
Priority to US07/914,654 priority patent/US6012472A/en
Priority to US09/126,621 priority patent/US6139645A/en
Priority to US09/502,724 priority patent/US6170495B1/en
Priority to US09/711,231 priority patent/US6533872B1/en

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0404—Apparatus for fluid treatment for general liquid treatment, e.g. etching followed by cleaning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0408—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S134/00—Cleaning and liquid contact with solids
    • Y10S134/902—Semiconductor wafer

Landscapes

  • Cleaning Or Drying Semiconductors (AREA)
  • Drying Of Solid Materials (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • Weting (AREA)
NL8900480A 1989-02-27 1989-02-27 Werkwijze en inrichting voor het drogen van substraten na behandeling in een vloeistof. NL8900480A (nl)

Priority Applications (10)

Application Number Priority Date Filing Date Title
NL8900480A NL8900480A (nl) 1989-02-27 1989-02-27 Werkwijze en inrichting voor het drogen van substraten na behandeling in een vloeistof.
EP90200409A EP0385536B1 (en) 1989-02-27 1990-02-21 Method and arrangement for drying substrates after treatment in a liquid
DE69012373T DE69012373T2 (de) 1989-02-27 1990-02-21 Verfahren und Vorrichtung zum Trocknen von Substraten nach Behandlung in einer Flüssigkeit.
JP2042302A JP3009699B2 (ja) 1989-02-27 1990-02-22 基板の処理方法
KR1019900002291A KR0173449B1 (ko) 1989-02-27 1990-02-23 기판 처리방법 및 그 장치
CN90100958A CN1023450C (zh) 1989-02-27 1990-02-24 对经液体处理后的基片进行清洁干燥的方法和装置
US07/914,654 US6012472A (en) 1989-02-27 1992-07-15 Method and arrangement for drying substrates after treatment in a liquid
US09/126,621 US6139645A (en) 1989-02-27 1998-07-30 Method and arrangement for drying substrates after treatment in a liquid
US09/502,724 US6170495B1 (en) 1989-02-27 2000-01-14 Apparatus for treating substrates using the marangoni effect
US09/711,231 US6533872B1 (en) 1989-02-27 2000-11-13 Method and arrangement for drying substrates after treatment in a liquid

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
NL8900480A NL8900480A (nl) 1989-02-27 1989-02-27 Werkwijze en inrichting voor het drogen van substraten na behandeling in een vloeistof.
NL8900480 1989-02-27

Publications (1)

Publication Number Publication Date
NL8900480A true NL8900480A (nl) 1990-09-17

Family

ID=19854214

Family Applications (1)

Application Number Title Priority Date Filing Date
NL8900480A NL8900480A (nl) 1989-02-27 1989-02-27 Werkwijze en inrichting voor het drogen van substraten na behandeling in een vloeistof.

Country Status (7)

Country Link
US (4) US6012472A (ja)
EP (1) EP0385536B1 (ja)
JP (1) JP3009699B2 (ja)
KR (1) KR0173449B1 (ja)
CN (1) CN1023450C (ja)
DE (1) DE69012373T2 (ja)
NL (1) NL8900480A (ja)

Families Citing this family (102)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL8900480A (nl) * 1989-02-27 1990-09-17 Philips Nv Werkwijze en inrichting voor het drogen van substraten na behandeling in een vloeistof.
JPH06103686B2 (ja) * 1989-11-24 1994-12-14 シー エフ エム テクノロジーズ，インコーポレイテッド 表面乾燥処理方法および装置
NL9000484A (nl) * 1990-03-01 1991-10-01 Philips Nv Werkwijze voor het in een centrifuge verwijderen van een vloeistof van een oppervlak van een substraat.
JPH04215878A (ja) * 1990-03-14 1992-08-06 Seiko Epson Corp 液中ジェット洗浄方法及び洗浄装置
KR100254653B1 (ko) 1991-10-04 2000-05-01 월터 알란 이. 대상물을 처리하는 방법
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JP3347814B2 (ja) * 1993-05-17 2002-11-20 大日本スクリーン製造株式会社 基板の洗浄・乾燥処理方法並びにその処理装置
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US5464480A (en) * 1993-07-16 1995-11-07 Legacy Systems, Inc. Process and apparatus for the treatment of semiconductor wafers in a fluid
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Also Published As

Publication number Publication date
JPH02291128A (ja) 1990-11-30
CN1023450C (zh) 1994-01-12
US6139645A (en) 2000-10-31
KR900013597A (ko) 1990-09-06
CN1045539A (zh) 1990-09-26
US6170495B1 (en) 2001-01-09
EP0385536B1 (en) 1994-09-14
DE69012373T2 (de) 1995-04-20
DE69012373D1 (de) 1994-10-20
EP0385536A1 (en) 1990-09-05
JP3009699B2 (ja) 2000-02-14
US6533872B1 (en) 2003-03-18
US6012472A (en) 2000-01-11
KR0173449B1 (ko) 1999-04-01

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