NO128830B - - Google Patents

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Info

Publication number: NO128830B
Authority: NO; Norway
Prior art keywords: gel; plating; areas; emulsion; plated
Prior art date: 1966-06-29

Application number

NO00168626A

Other languages

English (en)

Norwegian (no)

Inventor

J Kefalas

Original Assignee

Honeywell Inc

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1966-06-29

Filing date

1967-06-16

Publication date

1974-01-14

1967-06-16 Application filed by Honeywell Inc filed Critical Honeywell Inc

1974-01-14 Publication of NO128830B publication Critical patent/NO128830B/no

Links

238000007747 plating Methods 0.000 claims description 83
239000000758 substrate Substances 0.000 claims description 57
239000000839 emulsion Substances 0.000 claims description 52
238000000034 method Methods 0.000 claims description 30
238000005530 etching Methods 0.000 claims description 23
238000007772 electroless plating Methods 0.000 claims description 19
239000000463 material Substances 0.000 claims description 18
PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 8
230000004913 activation Effects 0.000 claims description 8
229940100890 silver compound Drugs 0.000 claims description 7
150000003379 silver compounds Chemical class 0.000 claims description 7
XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 6
238000004519 manufacturing process Methods 0.000 claims description 6
239000000956 alloy Substances 0.000 claims description 4
229910045601 alloy Inorganic materials 0.000 claims description 4
229910017052 cobalt Inorganic materials 0.000 claims description 3
239000010941 cobalt Substances 0.000 claims description 3
GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 claims description 3
229910052742 iron Inorganic materials 0.000 claims description 3
229910052759 nickel Inorganic materials 0.000 claims description 3
230000008569 process Effects 0.000 claims description 3
239000004372 Polyvinyl alcohol Substances 0.000 claims description 2
229920002678 cellulose Polymers 0.000 claims description 2
239000001913 cellulose Substances 0.000 claims description 2
239000013528 metallic particle Substances 0.000 claims description 2
229920002689 polyvinyl acetate Polymers 0.000 claims description 2
239000011118 polyvinyl acetate Substances 0.000 claims description 2
229920002451 polyvinyl alcohol Polymers 0.000 claims description 2
229920000915 polyvinyl chloride Polymers 0.000 claims description 2
239000004800 polyvinyl chloride Substances 0.000 claims description 2
229920000620 organic polymer Polymers 0.000 claims 1
238000005406 washing Methods 0.000 claims 1
239000010408 film Substances 0.000 description 85
239000000499 gel Substances 0.000 description 54
238000011282 treatment Methods 0.000 description 28
238000000576 coating method Methods 0.000 description 18
-1 poly(alkylene) Polymers 0.000 description 14
229910052709 silver Inorganic materials 0.000 description 14
239000004332 silver Substances 0.000 description 14
239000000243 solution Substances 0.000 description 14
238000007654 immersion Methods 0.000 description 13
230000001235 sensitizing effect Effects 0.000 description 13
BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 12
229910052751 metal Inorganic materials 0.000 description 12
239000002184 metal Substances 0.000 description 12
239000003795 chemical substances by application Substances 0.000 description 11
XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 10
239000011248 coating agent Substances 0.000 description 9
238000000151 deposition Methods 0.000 description 8
239000002245 particle Substances 0.000 description 8
230000003213 activating effect Effects 0.000 description 7
229920000139 polyethylene terephthalate Polymers 0.000 description 7
239000005020 polyethylene terephthalate Substances 0.000 description 7
206010070834 Sensitisation Diseases 0.000 description 6
230000008901 benefit Effects 0.000 description 6
230000015572 biosynthetic process Effects 0.000 description 6
239000000084 colloidal system Substances 0.000 description 6
230000000694 effects Effects 0.000 description 6
239000007788 liquid Substances 0.000 description 6
230000008313 sensitization Effects 0.000 description 6
KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 5
238000004061 bleaching Methods 0.000 description 5
230000008021 deposition Effects 0.000 description 5
230000001464 adherent effect Effects 0.000 description 4
230000003197 catalytic effect Effects 0.000 description 4
239000000126 substance Substances 0.000 description 4
239000007864 aqueous solution Substances 0.000 description 3
239000002131 composite material Substances 0.000 description 3
239000003792 electrolyte Substances 0.000 description 3
150000002500 ions Chemical class 0.000 description 3
230000000873 masking effect Effects 0.000 description 3
238000002203 pretreatment Methods 0.000 description 3
238000012360 testing method Methods 0.000 description 3
HUHGPYXAVBJSJV-UHFFFAOYSA-N 2-[3,5-bis(2-hydroxyethyl)-1,3,5-triazinan-1-yl]ethanol Chemical compound OCCN1CN(CCO)CN(CCO)C1 HUHGPYXAVBJSJV-UHFFFAOYSA-N 0.000 description 2
OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 2
239000003929 acidic solution Substances 0.000 description 2
239000012190 activator Substances 0.000 description 2
239000000654 additive Substances 0.000 description 2
230000000996 additive effect Effects 0.000 description 2
244000052616 bacterial pathogen Species 0.000 description 2
239000002585 base Substances 0.000 description 2
150000001875 compounds Chemical class 0.000 description 2
230000000593 degrading effect Effects 0.000 description 2
239000000696 magnetic material Substances 0.000 description 2
230000015654 memory Effects 0.000 description 2
150000002739 metals Chemical class 0.000 description 2
229910052763 palladium Inorganic materials 0.000 description 2
PIBWKRNGBLPSSY-UHFFFAOYSA-L palladium(II) chloride Chemical compound Cl[Pd]Cl PIBWKRNGBLPSSY-UHFFFAOYSA-L 0.000 description 2
229910052698 phosphorus Inorganic materials 0.000 description 2
239000011574 phosphorus Substances 0.000 description 2
229920000728 polyester Polymers 0.000 description 2
229920000642 polymer Polymers 0.000 description 2
230000009467 reduction Effects 0.000 description 2
229920005989 resin Polymers 0.000 description 2
239000011347 resin Substances 0.000 description 2
SQGYOTSLMSWVJD-UHFFFAOYSA-N silver(1+) nitrate Chemical compound [Ag+].[O-]N(=O)=O SQGYOTSLMSWVJD-UHFFFAOYSA-N 0.000 description 2
238000001179 sorption measurement Methods 0.000 description 2
239000011800 void material Substances 0.000 description 2
238000004804 winding Methods 0.000 description 2
QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 description 1
229920002799 BoPET Polymers 0.000 description 1
229920000298 Cellophane Polymers 0.000 description 1
108010010803 Gelatin Proteins 0.000 description 1
239000005041 Mylar™ Substances 0.000 description 1
229920001328 Polyvinylidene chloride Polymers 0.000 description 1
NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 1
ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 1
BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
IGOJDKCIHXGPTI-UHFFFAOYSA-N [P].[Co].[Ni] Chemical compound [P].[Co].[Ni] IGOJDKCIHXGPTI-UHFFFAOYSA-N 0.000 description 1
238000009825 accumulation Methods 0.000 description 1
239000002253 acid Substances 0.000 description 1
230000002378 acidificating effect Effects 0.000 description 1
150000008044 alkali metal hydroxides Chemical class 0.000 description 1
229920002301 cellulose acetate Polymers 0.000 description 1
239000003638 chemical reducing agent Substances 0.000 description 1
238000005253 cladding Methods 0.000 description 1
238000004140 cleaning Methods 0.000 description 1
229910001429 cobalt ion Inorganic materials 0.000 description 1
NVIVJPRCKQTWLY-UHFFFAOYSA-N cobalt nickel Chemical compound [Co][Ni][Co] NVIVJPRCKQTWLY-UHFFFAOYSA-N 0.000 description 1
XLJKHNWPARRRJB-UHFFFAOYSA-N cobalt(2+) Chemical compound [Co+2] XLJKHNWPARRRJB-UHFFFAOYSA-N 0.000 description 1
238000001246 colloidal dispersion Methods 0.000 description 1
230000001143 conditioned effect Effects 0.000 description 1
238000011109 contamination Methods 0.000 description 1
238000010924 continuous production Methods 0.000 description 1
229920001577 copolymer Polymers 0.000 description 1
230000007547 defect Effects 0.000 description 1
230000002939 deleterious effect Effects 0.000 description 1
230000005347 demagnetization Effects 0.000 description 1
238000001035 drying Methods 0.000 description 1
238000009713 electroplating Methods 0.000 description 1
239000003995 emulsifying agent Substances 0.000 description 1
229920002457 flexible plastic Polymers 0.000 description 1
230000006870 function Effects 0.000 description 1
239000008273 gelatin Substances 0.000 description 1
229920000159 gelatin Polymers 0.000 description 1
235000019322 gelatine Nutrition 0.000 description 1
235000011852 gelatine desserts Nutrition 0.000 description 1
150000004820 halides Chemical class 0.000 description 1
230000006872 improvement Effects 0.000 description 1
239000004615 ingredient Substances 0.000 description 1
230000002045 lasting effect Effects 0.000 description 1
230000005415 magnetization Effects 0.000 description 1
239000000203 mixture Substances 0.000 description 1
239000003607 modifier Substances 0.000 description 1
229910001453 nickel ion Inorganic materials 0.000 description 1
230000009972 noncorrosive effect Effects 0.000 description 1
238000010899 nucleation Methods 0.000 description 1
229920003023 plastic Polymers 0.000 description 1
239000004033 plastic Substances 0.000 description 1
229920001484 poly(alkylene) Polymers 0.000 description 1
229920002239 polyacrylonitrile Polymers 0.000 description 1
239000005033 polyvinylidene chloride Substances 0.000 description 1
239000000843 powder Substances 0.000 description 1
230000001105 regulatory effect Effects 0.000 description 1
150000003839 salts Chemical class 0.000 description 1
229920006395 saturated elastomer Polymers 0.000 description 1
229910001961 silver nitrate Inorganic materials 0.000 description 1
239000007787 solid Substances 0.000 description 1
238000005507 spraying Methods 0.000 description 1
238000003860 storage Methods 0.000 description 1
229910052717 sulfur Inorganic materials 0.000 description 1
239000011593 sulfur Substances 0.000 description 1
238000004381 surface treatment Methods 0.000 description 1
239000000725 suspension Substances 0.000 description 1
KKEYFWRCBNTPAC-UHFFFAOYSA-L terephthalate(2-) Chemical compound [O-]C(=O)C1=CC=C(C([O-])=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-L 0.000 description 1
239000010409 thin film Substances 0.000 description 1
239000010936 titanium Substances 0.000 description 1
229910052719 titanium Inorganic materials 0.000 description 1
230000004304 visual acuity Effects 0.000 description 1
239000000080 wetting agent Substances 0.000 description 1

Classifications

- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1603—Process or apparatus coating on selected surface areas
- C23C18/1607—Process or apparatus coating on selected surface areas by direct patterning
- C23C18/1608—Process or apparatus coating on selected surface areas by direct patterning from pretreatment step, i.e. selective pre-treatment
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/28—Sensitising or activating
- C23C18/30—Activating or accelerating or sensitising with palladium or other noble metal
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/105—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by conversion of non-conductive material on or in the support into conductive material, e.g. by using an energy beam
- H05K3/106—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by conversion of non-conductive material on or in the support into conductive material, e.g. by using an energy beam by photographic methods
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
- H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
- H05K3/185—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method by making a catalytic pattern by photo-imaging
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S428/00—Stock material or miscellaneous articles
- Y10S428/922—Static electricity metal bleed-off metallic stock
- Y10S428/923—Physical dimension
- Y10S428/924—Composite
- Y10S428/926—Thickness of individual layer specified
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S428/00—Stock material or miscellaneous articles
- Y10S428/922—Static electricity metal bleed-off metallic stock
- Y10S428/9265—Special properties
- Y10S428/928—Magnetic property
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S428/00—Stock material or miscellaneous articles
- Y10S428/922—Static electricity metal bleed-off metallic stock
- Y10S428/9335—Product by special process
- Y10S428/936—Chemical deposition, e.g. electroless plating
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12014—All metal or with adjacent metals having metal particles
- Y10T428/12028—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, etc.]
- Y10T428/12049—Nonmetal component
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12014—All metal or with adjacent metals having metal particles
- Y10T428/12028—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, etc.]
- Y10T428/12063—Nonparticulate metal component
- Y10T428/12104—Particles discontinuous
- Y10T428/12111—Separated by nonmetal matrix or binder [e.g., welding electrode, etc.]
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12431—Foil or filament smaller than 6 mils
- Y10T428/12438—Composite
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12535—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.] with additional, spatially distinct nonmetal component
- Y10T428/12542—More than one such component
- Y10T428/12549—Adjacent to each other

Landscapes

Chemical & Material Sciences (AREA)
Engineering & Computer Science (AREA)
Chemical Kinetics & Catalysis (AREA)
Manufacturing & Machinery (AREA)
Microelectronics & Electronic Packaging (AREA)
General Chemical & Material Sciences (AREA)
Materials Engineering (AREA)
Mechanical Engineering (AREA)
Metallurgy (AREA)
Organic Chemistry (AREA)
Chemically Coating (AREA)
Photosensitive Polymer And Photoresist Processing (AREA)

NO00168626A 1966-06-29 1967-06-16 NO128830B (fr)

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
US56134166A	1966-06-29	1966-06-29

Publications (1)

Publication Number	Publication Date
NO128830B true NO128830B (fr)	1974-01-14

Family

ID=24241544

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
NO00168626A NO128830B (fr)	1966-06-29	1967-06-16

Country Status (8)

Country	Link
US (1)	US3594229A (fr)
AT (1)	AT297444B (fr)
BE (1)	BE700684A (fr)
CH (1)	CH478250A (fr)
GB (1)	GB1201194A (fr)
NL (1)	NL6708989A (fr)
NO (1)	NO128830B (fr)
SE (1)	SE346336B (fr)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US3748137A (en) *	1970-12-10	1973-07-24	Eastman Kodak Co	Photosensitive and thermosensitive elements and process for development
US4581301A (en) *	1984-04-10	1986-04-08	Michaelson Henry W	Additive adhesive based process for the manufacture of printed circuit boards
US6468672B1 (en)	2000-06-29	2002-10-22	Lacks Enterprises, Inc.	Decorative chrome electroplate on plastics
WO2018079056A1 (fr) *	2016-10-27	2018-05-03	東京エレクトロン株式会社	Procédé de placage, dispositif de placage et milieu de stockage

1966
- 1966-06-29 US US561341A patent/US3594229A/en not_active Expired - Lifetime
1967
- 1967-06-16 NO NO00168626A patent/NO128830B/no unknown
- 1967-06-16 SE SE8528/67A patent/SE346336B/xx unknown
- 1967-06-28 AT AT599967A patent/AT297444B/de not_active IP Right Cessation
- 1967-06-28 NL NL6708989A patent/NL6708989A/xx unknown
- 1967-06-29 GB GB27086/67A patent/GB1201194A/en not_active Expired
- 1967-06-29 BE BE700684D patent/BE700684A/xx unknown
- 1967-06-29 CH CH924767A patent/CH478250A/fr not_active IP Right Cessation

Also Published As

Publication number	Publication date
DE1621256A1 (de)	1971-06-03
BE700684A (fr)	1967-12-01
DE1621256B2 (de)	1972-06-29
CH478250A (fr)	1969-09-15
SE346336B (fr)	1972-07-03
GB1201194A (en)	1970-08-05
US3594229A (en)	1971-07-20
NL6708989A (fr)	1968-01-02
AT297444B (de)	1972-03-27

Publication	Publication Date	Title
US3801368A (en)	1974-04-02	Process of electroless plating and article made thereby
KR100936527B1 (ko)	2010-01-13	전자파 차폐재 및 그 제조 방법
US3269861A (en)	1966-08-30	Method for electroless copper plating
US3994727A (en)	1976-11-30	Formation of metal images using reducible non-noble metal salts and light sensitive reducing agents
JPH047117B2 (fr)	1992-02-07
US3245826A (en)	1966-04-12	Magnetic recording medium and method of manufacture
JPS586781B2 (ja)	1983-02-07	キンゾクハクマクケイセイホウ
US3791340A (en)	1974-02-12	Method of depositing a metal pattern on a surface
USRE29015E (en)	1976-10-26	Method of generating precious metal-reducing patterns
US3668003A (en)	1972-06-06	Printed circuits
US4066804A (en)	1978-01-03	Metal deposition process
GB1222969A (en)	1971-02-17	Plating process
US3853589A (en)	1974-12-10	Metal deposition process
US3642476A (en)	1972-02-15	Method of preparing glass masters
US3666527A (en)	1972-05-30	Method of electroless deposition of metals with improved sensitizer
US3877981A (en)	1975-04-15	Method of electroless plating
US3615483A (en)	1971-10-26	Method of photographically producing copper metal images
US3321328A (en)	1967-05-23	Coating of aluminum substrates with a magnetic material
US3594229A (en)	1971-07-20	Plated substrate and related methods
US3269854A (en)	1966-08-30	Process of rendering substrates catalytic to electroless cobalt deposition and article produced
USRE29039E (en)	1976-11-16	Metal deposition process
US3489660A (en)	1970-01-13	Electroplating bath and method
US3360397A (en)	1967-12-26	Process of chemically depositing a magnetic cobalt film from a bath containing malonate and citrate ions
US4154869A (en)	1979-05-15	Electroless plating method with inspection for an unbroken layer of water prior to plating
US3895124A (en)	1975-07-15	Process for controlling the coercivity of a cobalt or cobalt/nickel coating applied by an electroless plating process