NO174245C - Flytende sammensetning egnet for dannelse av et trykt kretskortsubstrat, fremgangsmåte for fremstilling av en slik sammensetning samt anvendelse derav - Google Patents

Flytende sammensetning egnet for dannelse av et trykt kretskortsubstrat, fremgangsmåte for fremstilling av en slik sammensetning samt anvendelse derav

Info

Publication number
NO174245C
NO174245C NO893800A NO893800A NO174245C NO 174245 C NO174245 C NO 174245C NO 893800 A NO893800 A NO 893800A NO 893800 A NO893800 A NO 893800A NO 174245 C NO174245 C NO 174245C
Authority
NO
Norway
Prior art keywords
making
forming
circuit board
printed circuit
board substrate
Prior art date
Application number
NO893800A
Other languages
English (en)
Norwegian (no)
Other versions
NO893800L (no
NO174245B (no
NO893800D0 (no
Inventor
George Martin Benedikt
David John Smith
Original Assignee
Goodrich Co B F
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Goodrich Co B F filed Critical Goodrich Co B F
Publication of NO893800D0 publication Critical patent/NO893800D0/no
Publication of NO893800L publication Critical patent/NO893800L/no
Publication of NO174245B publication Critical patent/NO174245B/no
Publication of NO174245C publication Critical patent/NO174245C/no

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G61/00Macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain of the macromolecule
    • C08G61/02Macromolecular compounds containing only carbon atoms in the main chain of the macromolecule, e.g. polyxylylenes
    • C08G61/04Macromolecular compounds containing only carbon atoms in the main chain of the macromolecule, e.g. polyxylylenes only aliphatic carbon atoms
    • C08G61/06Macromolecular compounds containing only carbon atoms in the main chain of the macromolecule, e.g. polyxylylenes only aliphatic carbon atoms prepared by ring-opening of carbocyclic compounds
    • C08G61/08Macromolecular compounds containing only carbon atoms in the main chain of the macromolecule, e.g. polyxylylenes only aliphatic carbon atoms prepared by ring-opening of carbocyclic compounds of carbocyclic compounds containing one or more carbon-to-carbon double bonds in the ring
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/0313Organic insulating material
    • H05K1/032Organic insulating material consisting of one material

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Reinforced Plastic Materials (AREA)
  • Laminated Bodies (AREA)
  • Polyoxymethylene Polymers And Polymers With Carbon-To-Carbon Bonds (AREA)
NO893800A 1988-09-23 1989-09-25 Flytende sammensetning egnet for dannelse av et trykt kretskortsubstrat, fremgangsmåte for fremstilling av en slik sammensetning samt anvendelse derav NO174245C (no)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/248,371 US5274026A (en) 1988-09-23 1988-09-23 Curable polycycloolefin resin solutions, their use in making printed circuit boards and the boards so made

Publications (4)

Publication Number Publication Date
NO893800D0 NO893800D0 (no) 1989-09-25
NO893800L NO893800L (no) 1990-03-26
NO174245B NO174245B (no) 1993-12-27
NO174245C true NO174245C (no) 1994-04-06

Family

ID=22938806

Family Applications (1)

Application Number Title Priority Date Filing Date
NO893800A NO174245C (no) 1988-09-23 1989-09-25 Flytende sammensetning egnet for dannelse av et trykt kretskortsubstrat, fremgangsmåte for fremstilling av en slik sammensetning samt anvendelse derav

Country Status (8)

Country Link
US (1) US5274026A (fr)
EP (1) EP0360295A3 (fr)
JP (1) JPH02198190A (fr)
CN (1) CN1042158A (fr)
BR (1) BR8904847A (fr)
DK (1) DK469489A (fr)
MX (1) MX170095B (fr)
NO (1) NO174245C (fr)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5728785A (en) * 1995-07-07 1998-03-17 California Institute Of Technology Romp polymerization in the presence of peroxide crosslinking agents to form high-density crosslinked polymers
CN1171290C (zh) * 1998-06-05 2004-10-13 佐治亚技术研究公司 多孔性绝缘材料及其制备方法
MY139405A (en) 1998-09-28 2009-09-30 Ibiden Co Ltd Printed circuit board and method for its production
WO2000018555A1 (fr) 1998-10-01 2000-04-06 Airtech International, Inc. Procede de moulage ou de durcissement d'une matiere de resine a des temperatures elevees au moyen d'un film de separation multicouche
JP2001071416A (ja) * 1999-09-03 2001-03-21 Hitachi Chem Co Ltd 銅張り積層板の製造方法
FR2807521A1 (fr) * 2000-04-07 2001-10-12 Bp Chemicals Snc Methode de mesure de compressibilite a chaud de poudre
CN1252132C (zh) * 2000-07-19 2006-04-19 陶氏环球技术公司 含涂布增强剂的旋布介电层组合物
TWI226103B (en) * 2000-08-31 2005-01-01 Georgia Tech Res Inst Fabrication of semiconductor devices with air gaps for ultra low capacitance interconnections and methods of making same
US20040058106A1 (en) * 2002-09-17 2004-03-25 Leone Erlinda Dugaduga Packaged solvent-containing cosmetic composition
CN100365039C (zh) * 2003-01-31 2008-01-30 日本瑞翁株式会社 可聚合组合物、热塑性树脂组合物、交联树脂以及交联树脂复合材料
US7381782B2 (en) * 2003-08-13 2008-06-03 Zeon Corporation Polymerizable composition and molded articles produced by using the same
US7364672B2 (en) * 2004-12-06 2008-04-29 Arlon, Inc. Low loss prepregs, compositions useful for the preparation thereof and uses therefor
US20090323300A1 (en) * 2006-04-25 2009-12-31 Daisuke Fujimoto Conductor Foil with Adhesive Layer, Conductor-Clad Laminate, Printed Wiring Board and Multilayer Wiring Board
US7648758B2 (en) * 2007-02-06 2010-01-19 Innegrity, Llc Low dielectric loss composite material
JP2008294459A (ja) * 2008-07-11 2008-12-04 Ibiden Co Ltd 多層プリント配線板
JP5116857B2 (ja) * 2011-01-07 2013-01-09 イビデン株式会社 多層プリント配線板及び多層プリント配線板の製造方法
CN116239965B (zh) * 2023-02-10 2025-01-17 茂友木材股份有限公司 一种胶合板及提高胶合板胶层固化效率的加工方法

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3318758A (en) * 1963-02-18 1967-05-09 Tellite Corp Method of making a printed circuit board which includes low temperature saturation and the product
US3508983A (en) * 1967-04-24 1970-04-28 Schjeldahl Co G T Use of a silane coating to bond copper to plastic in making a printed circuit
US3558423A (en) * 1967-10-16 1971-01-26 Electronized Chem Corp Low loss electrical printed circuit board comprising polyolefin,fiberglass and metallic foil
US4136247A (en) * 1977-12-05 1979-01-23 The B. F. Goodrich Company Ring-opened iso-propylnorbornene copolymers
US4178424A (en) * 1977-12-05 1979-12-11 The Bf Goodrich Company Cycloolefin copolymers
US4292106A (en) * 1978-07-11 1981-09-29 Clark-Schwebel Fiber Glass Corp. Process of producing reinforced laminates from crosslinkable thermoplastic olefin polymer material
US4241132A (en) * 1978-08-17 1980-12-23 Castall Incorporated Insulating boards
JPS5698136A (en) * 1980-01-08 1981-08-07 Kanegafuchi Chem Ind Co Ltd Continuous manufacture of laminated substance
US4315970A (en) * 1980-02-11 1982-02-16 Dow Corning Corporation Adhesion of metals to solid substrates
JPS61185994A (ja) * 1985-02-13 1986-08-19 信越化学工業株式会社 耐熱性フレキシブルプリント配線用基板およびその製造方法
US4701510A (en) * 1985-12-16 1987-10-20 The B.F. Goodrich Company Polycycloolefins resistant to solvents
IN168456B (fr) * 1985-12-16 1991-04-06 Goodrich Co B F
EP0303969A3 (fr) * 1987-08-14 1990-10-17 The B.F. Goodrich Company Circuits imprimés de cyclooléfines polymérisées en masse
US4910077A (en) * 1988-08-04 1990-03-20 B.F. Goodrich Company Polynorbornene laminates and method of making the same

Also Published As

Publication number Publication date
DK469489A (da) 1990-03-24
MX170095B (es) 1993-08-06
BR8904847A (pt) 1990-05-08
NO893800L (no) 1990-03-26
NO174245B (no) 1993-12-27
EP0360295A3 (fr) 1992-02-26
US5274026A (en) 1993-12-28
NO893800D0 (no) 1989-09-25
JPH02198190A (ja) 1990-08-06
CN1042158A (zh) 1990-05-16
DK469489D0 (da) 1989-09-22
EP0360295A2 (fr) 1990-03-28

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