NO20002322D0 - Plastmateriale og ledende plastgjenstander - Google Patents

Plastmateriale og ledende plastgjenstander

Info

Publication number
NO20002322D0
NO20002322D0 NO20002322A NO20002322A NO20002322D0 NO 20002322 D0 NO20002322 D0 NO 20002322D0 NO 20002322 A NO20002322 A NO 20002322A NO 20002322 A NO20002322 A NO 20002322A NO 20002322 D0 NO20002322 D0 NO 20002322D0
Authority
NO
Norway
Prior art keywords
plastic
conductive
articles
plastic material
resin matrix
Prior art date
Application number
NO20002322A
Other languages
English (en)
Other versions
NO312903B1 (no
Inventor
Helmut Kahl
Bernd Tiburtius
Karl Gielnik
Original Assignee
Helmut Kahl
Bernd Tiburtius
Karl Gielnik
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Helmut Kahl, Bernd Tiburtius, Karl Gielnik filed Critical Helmut Kahl
Publication of NO20002322D0 publication Critical patent/NO20002322D0/no
Publication of NO312903B1 publication Critical patent/NO312903B1/no

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/22—Expanded, porous or hollow particles
    • C08K7/24—Expanded, porous or hollow particles inorganic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
    • C08J7/04—Coating
    • C08J7/044—Forming conductive coatings; Forming coatings having anti-static properties
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/0015—Gaskets or seals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/001—Conductive additives

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Laminated Bodies (AREA)
  • Conductive Materials (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
NO20002322A 1997-11-03 2000-05-02 Plastmateriale og ledende plastgjenstand NO312903B1 (no)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19749955 1997-11-03
PCT/DE1998/003280 WO1999023153A2 (de) 1997-11-03 1998-11-03 Kunststoffmaterial und leitfähiger kunststoffgegenstand

Publications (2)

Publication Number Publication Date
NO20002322D0 true NO20002322D0 (no) 2000-05-02
NO312903B1 NO312903B1 (no) 2002-07-15

Family

ID=7848378

Family Applications (1)

Application Number Title Priority Date Filing Date
NO20002322A NO312903B1 (no) 1997-11-03 2000-05-02 Plastmateriale og ledende plastgjenstand

Country Status (14)

Country Link
EP (1) EP1034214B1 (no)
JP (1) JP2001522896A (no)
KR (1) KR20010031764A (no)
CN (1) CN100358941C (no)
AT (1) ATE269374T1 (no)
AU (1) AU739520B2 (no)
CA (1) CA2309075A1 (no)
DE (2) DE19881648D2 (no)
HU (1) HUP0004086A3 (no)
IL (1) IL135903A0 (no)
NO (1) NO312903B1 (no)
RU (1) RU2207353C2 (no)
TR (1) TR200001108T2 (no)
WO (1) WO1999023153A2 (no)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4054969B2 (ja) * 2002-05-20 2008-03-05 信越化学工業株式会社 導電性組成物
US7553908B1 (en) 2003-01-30 2009-06-30 Prc Desoto International, Inc. Preformed compositions in shaped form comprising polymer blends
CN100515716C (zh) * 2003-06-18 2009-07-22 鸿富锦精密工业（深圳）有限公司 便携式电子装置外壳及其制造方法
DE10332009B4 (de) 2003-07-14 2008-01-31 Infineon Technologies Ag Halbleiterbauelement mit elektromagnetischer Abschirmvorrichtung
CN1307856C (zh) * 2003-08-06 2007-03-28 鸿富锦精密工业（深圳）有限公司 便携式电子装置外壳及其制造方法
US20050245695A1 (en) 2004-04-30 2005-11-03 Cosman Michael A Polymer blend and compositions and methods for using the same
UA81885C2 (uk) * 2004-09-08 2008-02-11 Прк-Дэсото Интэрнэшнл, Инк. Попередньо сформовані композиції в профільованій формі, що містять полімерні суміші, та спосіб закладання апертури
JP4803350B2 (ja) * 2005-06-03 2011-10-26 信越化学工業株式会社 圧着性異方導電性樹脂組成物及び微細電極の接続方法
KR101269741B1 (ko) * 2006-07-04 2013-05-30 쓰리엠 이노베이티브 프로퍼티즈 캄파니 탄성 및 접착성을 갖는 전자기파 차단용 가스켓
JP4535289B2 (ja) * 2006-10-26 2010-09-01 信越化学工業株式会社 導電性組成物
CN101685764B (zh) * 2008-09-23 2011-11-30 海华科技股份有限公司 系统级封装模块结构的制造方法
RU2438275C2 (ru) * 2010-04-29 2011-12-27 Федеральное государственное образовательное учреждение высшего профессионального образования Пермская государственная сельскохозяйственная академия имени академика Д.Н. Прянишникова Радиоэлектронный блок с экраном для защиты от сверхвысокочастотного излучения
ES2853225T3 (es) 2016-05-25 2021-09-15 Basf Se Partículas huecas de elastómeros termoplásticos y piezas moldeadas porosas
CN109651799A (zh) * 2018-12-19 2019-04-19 航天科工武汉磁电有限责任公司 吸波贴片、其制备方法及其应用
CN117637237B (zh) * 2024-01-24 2024-04-26 北京泰派斯特电子技术有限公司 一种双色金属骨架复合导电橡胶

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4621024A (en) * 1984-12-31 1986-11-04 Paper Applications International, Inc. Metal-coated hollow microspheres
US4740657A (en) * 1986-02-14 1988-04-26 Hitachi, Chemical Company, Ltd Anisotropic-electroconductive adhesive composition, method for connecting circuits using the same, and connected circuit structure thus obtained
US5275880A (en) * 1989-05-17 1994-01-04 Minnesota Mining And Manufacturing Company Microwave absorber for direct surface application
RU2016432C1 (ru) * 1990-04-19 1994-07-15 Научно-исследовательский институт измерительных приборов Способ изготовления стыкового магнитопровода
AU672499B2 (en) * 1993-06-14 1996-10-03 Emi-Tec Elektronische Materialien Gmbh A process for producing a casing providing a screen against electromagnetic radiation
US5904978A (en) * 1995-12-15 1999-05-18 W. L. Gore & Associates, Inc. Electrically conductive polytetrafluoroethylene article
CN1283213A (zh) * 1997-11-03 2001-02-07 赫尔穆特·卡尔 导电性填料及其制备方法

Also Published As

Publication number Publication date
ATE269374T1 (de) 2004-07-15
EP1034214A2 (de) 2000-09-13
AU739520B2 (en) 2001-10-11
HUP0004086A1 (en) 2001-03-28
DE59811587D1 (de) 2004-07-22
RU2207353C2 (ru) 2003-06-27
JP2001522896A (ja) 2001-11-20
WO1999023153A3 (de) 1999-07-08
CA2309075A1 (en) 1999-05-14
NO312903B1 (no) 2002-07-15
KR20010031764A (ko) 2001-04-16
CN100358941C (zh) 2008-01-02
WO1999023153A2 (de) 1999-05-14
DE19881648D2 (de) 2001-05-10
EP1034214B1 (de) 2004-06-16
IL135903A0 (en) 2001-05-20
CN1283214A (zh) 2001-02-07
HUP0004086A3 (en) 2006-04-28
TR200001108T2 (tr) 2000-08-21
AU2045399A (en) 1999-05-24

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