NO20002323L - FremgangsmÕte for fremstilling av 1,2-dikloretan ved oksidering - Google Patents

FremgangsmÕte for fremstilling av 1,2-dikloretan ved oksidering

Info

Publication number
NO20002323L
NO20002323L NO20002323A NO20002323A NO20002323L NO 20002323 L NO20002323 L NO 20002323L NO 20002323 A NO20002323 A NO 20002323A NO 20002323 A NO20002323 A NO 20002323A NO 20002323 L NO20002323 L NO 20002323L
Authority
NO
Norway
Prior art keywords
dichloroethane
oxidation
preparation
Prior art date
Application number
NO20002323A
Other languages
English (en)
Other versions
NO312902B1 (no
NO20002323D0 (no
Inventor
Helmut Kahl
Bernd Tiburtius
Helmut Wegener
Original Assignee
Helmut Kahl
Bernd Tiburtius
Helmut Wegener
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Helmut Kahl, Bernd Tiburtius, Helmut Wegener filed Critical Helmut Kahl
Publication of NO20002323D0 publication Critical patent/NO20002323D0/no
Publication of NO20002323L publication Critical patent/NO20002323L/no
Publication of NO312902B1 publication Critical patent/NO312902B1/no

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/223—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating specially adapted for coating particles
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/22—Expanded, porous or hollow particles
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
    • C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
    • C23C18/2073—Multistep pretreatment
    • C23C18/2086—Multistep pretreatment with use of organic or inorganic compounds other than metals, first
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/28—Sensitising or activating
    • C23C18/30—Activating or accelerating or sensitising with palladium or other noble metal
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Health & Medical Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Dispersion Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Inorganic Chemistry (AREA)
  • Laminated Bodies (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Conductive Materials (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)
  • Physical Vapour Deposition (AREA)
NO20002323A 1997-11-03 2000-05-02 Elektrisk ledende fyllstoff for ledende plastmaterialer NO312902B1 (no)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19749956 1997-11-03
PCT/DE1998/003267 WO1999023152A1 (de) 1997-11-03 1998-11-03 Elektrisch leitfähiger füllstoff und verfahren zu dessen herstellung

Publications (3)

Publication Number Publication Date
NO20002323D0 NO20002323D0 (no) 2000-05-02
NO20002323L true NO20002323L (no) 2000-06-20
NO312902B1 NO312902B1 (no) 2002-07-15

Family

ID=7848379

Family Applications (1)

Application Number Title Priority Date Filing Date
NO20002323A NO312902B1 (no) 1997-11-03 2000-05-02 Elektrisk ledende fyllstoff for ledende plastmaterialer

Country Status (13)

Country Link
EP (1) EP1030880A1 (no)
JP (1) JP2001521964A (no)
KR (1) KR100421334B1 (no)
CN (1) CN1283213A (no)
AU (1) AU730445B2 (no)
CA (1) CA2309074A1 (no)
DE (1) DE19881647D2 (no)
HU (1) HUP0004285A3 (no)
IL (1) IL135862A0 (no)
NO (1) NO312902B1 (no)
RU (1) RU2199556C2 (no)
TR (1) TR200001006T2 (no)
WO (1) WO1999023152A1 (no)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
HUP0004086A3 (en) * 1997-11-03 2006-04-28 Gielnik Karl Plastic material and conductive plastic object
EP3049246A4 (en) * 2013-09-24 2017-03-29 Henkel IP & Holding GmbH Pyrolized organic layers and conductive prepregs made therewith
CN104448562A (zh) * 2014-12-04 2015-03-25 苏州润佳工程塑料股份有限公司 一种包覆型导电粉体及其制备方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6096548A (ja) * 1983-10-31 1985-05-30 Nippon Chem Ind Co Ltd:The 導電性材料
US4621024A (en) * 1984-12-31 1986-11-04 Paper Applications International, Inc. Metal-coated hollow microspheres
US4740657A (en) * 1986-02-14 1988-04-26 Hitachi, Chemical Company, Ltd Anisotropic-electroconductive adhesive composition, method for connecting circuits using the same, and connected circuit structure thus obtained
JP3042101B2 (ja) * 1991-11-22 2000-05-15 ジェイエスアール株式会社 複合粒子および中空粒子の製造方法
AU672499B2 (en) * 1993-06-14 1996-10-03 Emi-Tec Elektronische Materialien Gmbh A process for producing a casing providing a screen against electromagnetic radiation
DE4405156C1 (de) * 1994-02-18 1995-10-26 Univ Karlsruhe Verfahren zur Herstellung beschichteter polymerer Mikropartikel
DE19518942C2 (de) * 1995-05-23 1998-12-10 Fraunhofer Ges Forschung Verfahren zur Herstellung von metallisierten Polymerpartikeln und nach dem Verfahren hergestelltes Polymermaterial sowie deren Verwendung

Also Published As

Publication number Publication date
JP2001521964A (ja) 2001-11-13
HUP0004285A1 (en) 2001-03-28
AU1749599A (en) 1999-05-24
HUP0004285A3 (en) 2002-02-28
KR20010031755A (ko) 2001-04-16
CN1283213A (zh) 2001-02-07
TR200001006T2 (tr) 2000-07-21
KR100421334B1 (ko) 2004-03-09
NO312902B1 (no) 2002-07-15
CA2309074A1 (en) 1999-05-14
EP1030880A1 (de) 2000-08-30
DE19881647D2 (de) 2000-04-13
AU730445B2 (en) 2001-03-08
IL135862A0 (en) 2001-05-20
NO20002323D0 (no) 2000-05-02
RU2199556C2 (ru) 2003-02-27
WO1999023152A1 (de) 1999-05-14

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Legal Events

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