NO20011230L - Dannelse av opphengte partier ved bruk av SOI-substrater, og anvendelse derav for fremstilling av et vibrasjonsgyrometer - Google Patents

Dannelse av opphengte partier ved bruk av SOI-substrater, og anvendelse derav for fremstilling av et vibrasjonsgyrometer

Info

Publication number
NO20011230L
NO20011230L NO20011230A NO20011230A NO20011230L NO 20011230 L NO20011230 L NO 20011230L NO 20011230 A NO20011230 A NO 20011230A NO 20011230 A NO20011230 A NO 20011230A NO 20011230 L NO20011230 L NO 20011230L
Authority
NO
Norway
Prior art keywords
wafer
insulating layer
formation
preparation
silicon
Prior art date
Application number
NO20011230A
Other languages
English (en)
Norwegian (no)
Other versions
NO20011230D0 (no
Inventor
Mark Edward Mcnie
Vishal Nayar
Original Assignee
Secr Defence
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Secr Defence filed Critical Secr Defence
Publication of NO20011230D0 publication Critical patent/NO20011230D0/no
Publication of NO20011230L publication Critical patent/NO20011230L/no

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01C—MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
    • G01C19/00—Gyroscopes; Turn-sensitive devices using vibrating masses; Turn-sensitive devices without moving masses; Measuring angular rate using gyroscopic effects
    • G01C19/56—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01C—MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
    • G01C19/00—Gyroscopes; Turn-sensitive devices using vibrating masses; Turn-sensitive devices without moving masses; Measuring angular rate using gyroscopic effects
    • G01C19/02—Rotary gyroscopes
    • G01C19/04—Details
    • G01C19/16—Suspensions; Bearings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D48/00—Individual devices not covered by groups H10D1/00 - H10D44/00
    • H10D48/50—Devices controlled by mechanical forces, e.g. pressure
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices
    • H10P50/20—Dry etching; Plasma etching; Reactive-ion etching
    • H10P50/24—Dry etching; Plasma etching; Reactive-ion etching of semiconductor materials
    • H10P50/242—Dry etching; Plasma etching; Reactive-ion etching of semiconductor materials of Group IV materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00—Cleaning of wafers, substrates or parts of devices
    • H10P70/10—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H10P70/12—Cleaning before device manufacture, i.e. Begin-Of-Line process by dry cleaning only

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Radar, Positioning & Navigation (AREA)
  • Remote Sensing (AREA)
  • Pressure Sensors (AREA)
  • Gyroscopes (AREA)
  • Micromachines (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
  • Producing Shaped Articles From Materials (AREA)
  • Oscillators With Electromechanical Resonators (AREA)
  • Press Drives And Press Lines (AREA)
  • Physical Vapour Deposition (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
NO20011230A 1998-09-12 2001-03-09 Dannelse av opphengte partier ved bruk av SOI-substrater, og anvendelse derav for fremstilling av et vibrasjonsgyrometer NO20011230L (no)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GBGB9819821.1A GB9819821D0 (en) 1998-09-12 1998-09-12 Improvements relating to micro-machining
PCT/GB1999/003028 WO2000016041A2 (en) 1998-09-12 1999-09-13 Formation of suspended beams using soi substrates, and application to the fabrication of a vibrating gyrometer

Publications (2)

Publication Number Publication Date
NO20011230D0 NO20011230D0 (no) 2001-03-09
NO20011230L true NO20011230L (no) 2001-05-11

Family

ID=10838709

Family Applications (1)

Application Number Title Priority Date Filing Date
NO20011230A NO20011230L (no) 1998-09-12 2001-03-09 Dannelse av opphengte partier ved bruk av SOI-substrater, og anvendelse derav for fremstilling av et vibrasjonsgyrometer

Country Status (11)

Country Link
US (2) US6276205B1 (de)
EP (2) EP1808672A3 (de)
JP (1) JP4999227B2 (de)
KR (1) KR100651769B1 (de)
AT (1) ATE367570T1 (de)
AU (1) AU5874099A (de)
CA (1) CA2343446A1 (de)
DE (1) DE69936590T2 (de)
GB (1) GB9819821D0 (de)
NO (1) NO20011230L (de)
WO (1) WO2000016041A2 (de)

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Also Published As

Publication number Publication date
AU5874099A (en) 2000-04-03
ATE367570T1 (de) 2007-08-15
WO2000016041A3 (en) 2000-09-28
CA2343446A1 (en) 2000-03-23
NO20011230D0 (no) 2001-03-09
GB9819821D0 (en) 1998-11-04
EP1808672A3 (de) 2009-06-17
EP1116008A2 (de) 2001-07-18
KR20010075052A (ko) 2001-08-09
EP1808672A2 (de) 2007-07-18
KR100651769B1 (ko) 2006-11-30
DE69936590D1 (de) 2007-08-30
DE69936590T2 (de) 2007-11-22
US6276205B1 (en) 2001-08-21
US20020017132A1 (en) 2002-02-14
EP1116008B1 (de) 2007-07-18
JP4999227B2 (ja) 2012-08-15
JP2002525843A (ja) 2002-08-13
US6670212B2 (en) 2003-12-30
WO2000016041A2 (en) 2000-03-23

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