NO20011706L - Stråleanordning for vesentlig undertrykkelse av en höyfrekvent ström i en elektrisk komponent - Google Patents

Stråleanordning for vesentlig undertrykkelse av en höyfrekvent ström i en elektrisk komponent

Info

Publication number
NO20011706L
NO20011706L NO20011706A NO20011706A NO20011706L NO 20011706 L NO20011706 L NO 20011706L NO 20011706 A NO20011706 A NO 20011706A NO 20011706 A NO20011706 A NO 20011706A NO 20011706 L NO20011706 L NO 20011706L
Authority
NO
Norway
Prior art keywords
high frequency
electrical component
frequency current
radiation device
substantially suppressing
Prior art date
Application number
NO20011706A
Other languages
English (en)
Other versions
NO20011706D0 (no
NO325816B1 (no
Inventor
Shigeyoshi Yoshida
Hiroshi Ono
Yoshio Awakura
Original Assignee
Tokin Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokin Corp filed Critical Tokin Corp
Publication of NO20011706D0 publication Critical patent/NO20011706D0/no
Publication of NO20011706L publication Critical patent/NO20011706L/no
Publication of NO325816B1 publication Critical patent/NO325816B1/no

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W44/00—Electrical arrangements for controlling or matching impedance
    • H10W44/20—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/10—Arrangements for heating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W42/00—Arrangements for protection of devices
    • H10W42/20—Arrangements for protection of devices protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W42/00—Arrangements for protection of devices
    • H10W42/20—Arrangements for protection of devices protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons
    • H10W42/281—Arrangements for protection of devices protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons characterised by their materials
    • H10W42/287—Arrangements for protection of devices protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons characterised by their materials materials for magnetic shielding, e.g. ferromagnetic materials

Landscapes

  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Thin Magnetic Films (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Emergency Protection Circuit Devices (AREA)
NO20011706A 2000-04-05 2001-04-04 Straleanordning for vesentlig undertrykkelse av en hoyfrekvent strom i en elektrisk komponent NO325816B1 (no)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000103171A JP4287020B2 (ja) 2000-04-05 2000-04-05 高周波電流抑制型放熱板

Publications (3)

Publication Number Publication Date
NO20011706D0 NO20011706D0 (no) 2001-04-04
NO20011706L true NO20011706L (no) 2001-10-08
NO325816B1 NO325816B1 (no) 2008-07-21

Family

ID=18616931

Family Applications (1)

Application Number Title Priority Date Filing Date
NO20011706A NO325816B1 (no) 2000-04-05 2001-04-04 Straleanordning for vesentlig undertrykkelse av en hoyfrekvent strom i en elektrisk komponent

Country Status (10)

Country Link
US (1) US6624714B2 (no)
EP (1) EP1143777B1 (no)
JP (1) JP4287020B2 (no)
KR (1) KR100789051B1 (no)
CN (1) CN1222034C (no)
DE (1) DE60109343T2 (no)
MY (1) MY123590A (no)
NO (1) NO325816B1 (no)
SG (1) SG102619A1 (no)
TW (1) TWI248780B (no)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI266591B (en) * 2005-05-05 2006-11-11 Amulaire Thermal Technology In Heat dissipation apparatus having low-melting point alloy coating-layer and its manufacturing method
US20090279265A1 (en) * 2006-09-19 2009-11-12 Masaharu Imazato Electronic device mounting apparatus and resonance suppression method thereof
WO2008099856A1 (ja) * 2007-02-15 2008-08-21 Nec Corporation 電子装置搭載機器とそのノイズ抑制方法
JP2009253253A (ja) * 2008-04-11 2009-10-29 Fuji Electric Holdings Co Ltd 冷却フィン
EP2725612A1 (en) * 2012-10-29 2014-04-30 TP Vision Holding B.V. Heat conductor device and method of forming a heat conductor device

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5291064A (en) * 1991-04-16 1994-03-01 Nec Corporation Package structure for semiconductor device having a flexible wiring circuit member spaced from the package casing
US5164683A (en) * 1991-10-21 1992-11-17 Motorola, Inc. RF amplifier assembly
US5303113A (en) * 1992-03-30 1994-04-12 General Electric Company Digital circuit interrupter with RFI and EMI shielding
JP2828059B2 (ja) * 1996-08-28 1998-11-25 日本電気株式会社 ヒートシンクの実装構造
US5956576A (en) * 1996-09-13 1999-09-21 International Business Machines Corporation Enhanced protection of semiconductors with dual surface seal
TW571373B (en) * 1996-12-04 2004-01-11 Seiko Epson Corp Semiconductor device, circuit substrate, and electronic machine
US5880930A (en) 1997-06-18 1999-03-09 Silicon Graphics, Inc. Electromagnetic interference shielding enclosure and heat sink with compression coupling mechanism
JP3012867B2 (ja) * 1998-01-22 2000-02-28 インターナショナル・ビジネス・マシーンズ・コーポレイション コンピュ―タ用ヒ―トシンク装置
KR100302986B1 (ko) * 1999-07-08 2001-09-22 이종석 사출성형용 금형
US6390475B1 (en) 1999-08-31 2002-05-21 Intel Corporation Electro-mechanical heat sink gasket for shock and vibration protection and EMI suppression on an exposed die

Also Published As

Publication number Publication date
KR20010095275A (ko) 2001-11-03
NO20011706D0 (no) 2001-04-04
DE60109343T2 (de) 2006-02-09
MY123590A (en) 2006-05-31
NO325816B1 (no) 2008-07-21
US20010040790A1 (en) 2001-11-15
TWI248780B (en) 2006-02-01
SG102619A1 (en) 2004-03-26
CN1222034C (zh) 2005-10-05
EP1143777A1 (en) 2001-10-10
JP2001291981A (ja) 2001-10-19
US6624714B2 (en) 2003-09-23
CN1316775A (zh) 2001-10-10
KR100789051B1 (ko) 2007-12-26
JP4287020B2 (ja) 2009-07-01
DE60109343D1 (de) 2005-04-21
EP1143777B1 (en) 2005-03-16

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