NO20025457L - Lettkonstruksjonsb¶rer for stötfangere - Google Patents
Lettkonstruksjonsb¶rer for stötfangereInfo
- Publication number
- NO20025457L NO20025457L NO20025457A NO20025457A NO20025457L NO 20025457 L NO20025457 L NO 20025457L NO 20025457 A NO20025457 A NO 20025457A NO 20025457 A NO20025457 A NO 20025457A NO 20025457 L NO20025457 L NO 20025457L
- Authority
- NO
- Norway
- Prior art keywords
- bumpers
- lightweight construction
- lightweight
- construction
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B60—VEHICLES IN GENERAL
- B60R—VEHICLES, VEHICLE FITTINGS, OR VEHICLE PARTS, NOT OTHERWISE PROVIDED FOR
- B60R19/00—Wheel guards; Radiator guards, e.g. grilles; Obstruction removers; Fittings damping bouncing force in collisions
- B60R19/02—Bumpers, i.e. impact receiving or absorbing members for protecting vehicles or fending off blows from other vehicles or objects
- B60R19/18—Bumpers, i.e. impact receiving or absorbing members for protecting vehicles or fending off blows from other vehicles or objects characterised by the cross-section; Means within the bumper to absorb impact
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/04—Apparatus for manufacture or treatment
- H10P72/0442—Apparatus for placing on an insulating substrate, e.g. tape
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B60—VEHICLES IN GENERAL
- B60R—VEHICLES, VEHICLE FITTINGS, OR VEHICLE PARTS, NOT OTHERWISE PROVIDED FOR
- B60R19/00—Wheel guards; Radiator guards, e.g. grilles; Obstruction removers; Fittings damping bouncing force in collisions
- B60R19/02—Bumpers, i.e. impact receiving or absorbing members for protecting vehicles or fending off blows from other vehicles or objects
- B60R19/18—Bumpers, i.e. impact receiving or absorbing members for protecting vehicles or fending off blows from other vehicles or objects characterised by the cross-section; Means within the bumper to absorb impact
- B60R2019/1806—Structural beams therefor, e.g. shock-absorbing
- B60R2019/1813—Structural beams therefor, e.g. shock-absorbing made of metal
- B60R2019/182—Structural beams therefor, e.g. shock-absorbing made of metal of light metal, e.g. extruded
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
- H10P72/743—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support used as a support during manufacture of interconnect decals or build up layers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
- H10P72/7432—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support used in a transfer process involving transfer directly from an origin substrate to a target substrate without use of an intermediate handle substrate
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Body Structure For Vehicles (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| AT0088601U AT5755U1 (de) | 2001-11-15 | 2001-11-15 | Leichtbauträger für stossfänger |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| NO20025457D0 NO20025457D0 (no) | 2002-11-14 |
| NO20025457L true NO20025457L (no) | 2003-05-27 |
Family
ID=3502069
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| NO20025457A NO20025457L (no) | 2001-11-15 | 2002-11-14 | Lettkonstruksjonsb¶rer for stötfangere |
Country Status (4)
| Country | Link |
|---|---|
| AT (1) | AT5755U1 (de) |
| CH (1) | CH696197A5 (de) |
| DE (1) | DE10252835B4 (de) |
| NO (1) | NO20025457L (de) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102010054638A1 (de) | 2010-12-15 | 2012-06-21 | Benteler Automobiltechnik Gmbh | Stoßfänger für ein Kraftfahrzeug |
| CN115675345A (zh) * | 2021-07-26 | 2023-02-03 | 宝钢金属有限公司 | 一种汽车后保险杠用型材及其制造方法 |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| NO173537C (no) * | 1991-09-06 | 1993-12-29 | Norsk Hydro As | Forsterkningsbjelke og kjoeretoeydoer med bjelken |
| US5340178A (en) * | 1993-11-12 | 1994-08-23 | Chrysler Corporation | Vehicle bumper beam |
| CH688651A5 (de) * | 1994-12-23 | 1997-12-31 | Alusuisse Lonza Services Ag | Stossstange fuer Fahrzeuge. |
| NO974375L (no) * | 1997-09-22 | 1999-03-23 | Norsk Hydro As | St°tfanger, samt tilvirkning av samme |
| JP2000052897A (ja) * | 1998-08-05 | 2000-02-22 | Nippon Light Metal Co Ltd | バンパー構造 |
| JP2001132787A (ja) * | 1999-11-01 | 2001-05-18 | Tokai Rubber Ind Ltd | 衝撃吸収部材 |
-
2001
- 2001-11-15 AT AT0088601U patent/AT5755U1/de not_active IP Right Cessation
-
2002
- 2002-11-13 DE DE10252835A patent/DE10252835B4/de not_active Expired - Fee Related
- 2002-11-14 NO NO20025457A patent/NO20025457L/no unknown
- 2002-11-15 CH CH01922/02A patent/CH696197A5/de not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| CH696197A5 (de) | 2007-02-15 |
| DE10252835B4 (de) | 2013-11-28 |
| NO20025457D0 (no) | 2002-11-14 |
| AT5755U1 (de) | 2002-11-25 |
| DE10252835A1 (de) | 2004-02-05 |
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