NO20034071L - Elektronisk modul som omfatter et kjöleunderlag, samt tilhörende fremgangsmåter - Google Patents

Elektronisk modul som omfatter et kjöleunderlag, samt tilhörende fremgangsmåter

Info

Publication number
NO20034071L
NO20034071L NO20034071A NO20034071A NO20034071L NO 20034071 L NO20034071 L NO 20034071L NO 20034071 A NO20034071 A NO 20034071A NO 20034071 A NO20034071 A NO 20034071A NO 20034071 L NO20034071 L NO 20034071L
Authority
NO
Norway
Prior art keywords
chamber
evaporator
transfer body
heat transfer
condenser
Prior art date
Application number
NO20034071A
Other languages
English (en)
Other versions
NO20034071D0 (no
Inventor
Steven Robert Snyder
Charles Michael Newton
Michael Ray Lange
Original Assignee
Harris Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Harris Corp filed Critical Harris Corp
Publication of NO20034071D0 publication Critical patent/NO20034071D0/no
Publication of NO20034071L publication Critical patent/NO20034071L/no

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/73—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control for cooling by change of state
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/06—Control arrangements therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

Elektronisk modul (20) omfatter et kjøleunderlag (21a), en elektronisk anordning (22) som er montert på dette, og en varmeoppsamlingspanne (23) opptil kjøleunderlaget (21a). Nærmere bestemt kan kjøleunderlaget (21a) ha et fordamperkammer (25) opptil den elektroniske anordning (22), minst ett kondensatorkammer (26) opptil varmeoppsamlingspannen (23) og minst én kjølefluidpassasje (27) som forbinder fordamperkammeret (25) i fluidforbindelse med nevnte minst ene kondensatorkammer (26). Dessuten kan et fordampervarmeoverføringslegeme (28) være innkoplet i termisk forbindelse mellom fordamperkammeret (25) og den elektroniske anordning (22). I tillegg kan minst ett kondensatorvarmeoverføringslegeme (36) være innkoplet i termisk forbindelse mellom nevnte minst ene kondensatorkammer (26) og varmeoppsamlingspannen (23). Fordampervarmeoverføringslegemet (28) og nevnte minst ene kondensatorvarmeoverføringslegeme (36) har fortrinnsvis vært en høyere varmeledningsevne enn tilgrensende partier av kjøleunderlaget.
NO20034071A 2001-03-19 2003-09-15 Elektronisk modul som omfatter et kjöleunderlag, samt tilhörende fremgangsmåter NO20034071L (no)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/811,827 US6483705B2 (en) 2001-03-19 2001-03-19 Electronic module including a cooling substrate and related methods
PCT/US2002/007417 WO2002076165A1 (en) 2001-03-19 2002-03-12 Electronic module including a cooling substrate and related methods

Publications (2)

Publication Number Publication Date
NO20034071D0 NO20034071D0 (no) 2003-09-15
NO20034071L true NO20034071L (no) 2003-11-18

Family

ID=25207701

Family Applications (1)

Application Number Title Priority Date Filing Date
NO20034071A NO20034071L (no) 2001-03-19 2003-09-15 Elektronisk modul som omfatter et kjöleunderlag, samt tilhörende fremgangsmåter

Country Status (9)

Country Link
US (1) US6483705B2 (no)
EP (1) EP1378153B1 (no)
JP (1) JP4004963B2 (no)
KR (1) KR100553171B1 (no)
CN (1) CN1333627C (no)
AU (1) AU2002254176B2 (no)
CA (1) CA2440522C (no)
NO (1) NO20034071L (no)
WO (1) WO2002076165A1 (no)

Families Citing this family (71)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6935022B2 (en) * 2001-08-28 2005-08-30 Advanced Materials Technologies Pte, Ltd. Advanced microelectronic heat dissipation package and method for its manufacture
ATE478337T1 (de) * 2002-05-31 2010-09-15 Cornell Res Foundation Inc Methoden zum nachweis analyten in proben
JP3959498B2 (ja) * 2002-07-25 2007-08-15 富士通株式会社 冷却システム及び当該冷却システムを有する電子機器
JP2004077051A (ja) * 2002-08-20 2004-03-11 Sony Corp 熱輸送装置およびその製造方法
US20040150956A1 (en) * 2003-01-24 2004-08-05 Robert Conte Pin fin heat sink for power electronic applications
SE0301381D0 (sv) * 2003-05-12 2003-05-12 Sapa Ab Extruded heat sink with integrated thermosyphon
US7031156B2 (en) * 2003-07-25 2006-04-18 Rockwell Automation Technologies, Inc. Reduced package volume convectively cooled sealed electrical system and method
US20050083655A1 (en) * 2003-10-15 2005-04-21 Visteon Global Technologies, Inc. Dielectric thermal stack for the cooling of high power electronics
US20060016578A1 (en) * 2004-06-24 2006-01-26 Shine Ying Co., Ltd. [high-performance two-phase flow evaporator]
US7768619B2 (en) * 2004-08-03 2010-08-03 Harris Corporation Method and apparatus for sealing flex circuits made with an LCP substrate
US7265977B2 (en) * 2005-01-18 2007-09-04 International Business Machines Corporation Active liquid metal thermal spreader
US20080296589A1 (en) * 2005-03-24 2008-12-04 Ingo Speier Solid-State Lighting Device Package
WO2006105638A1 (en) * 2005-04-05 2006-10-12 Tir Systems Ltd. Electronic device package with an integrated evaporator
EP1737009A1 (de) * 2005-06-23 2006-12-27 Abb Research Ltd. Elektrische Anlage mit einem Kühlelement und Verfahren zum Betrieb dieser Anlage
US7521793B2 (en) * 2005-09-26 2009-04-21 Temic Automotive Of North America, Inc. Integrated circuit mounting for thermal stress relief useable in a multi-chip module
US7906794B2 (en) 2006-07-05 2011-03-15 Koninklijke Philips Electronics N.V. Light emitting device package with frame and optically transmissive element
US9172145B2 (en) 2006-09-21 2015-10-27 Raytheon Company Transmit/receive daughter card with integral circulator
US9019166B2 (en) 2009-06-15 2015-04-28 Raytheon Company Active electronically scanned array (AESA) card
US8279131B2 (en) * 2006-09-21 2012-10-02 Raytheon Company Panel array
US7671696B1 (en) * 2006-09-21 2010-03-02 Raytheon Company Radio frequency interconnect circuits and techniques
US20080079779A1 (en) * 2006-09-28 2008-04-03 Robert Lee Cornell Method for Improving Thermal Conductivity in Micro-Fluid Ejection Heads
CN101536179B (zh) * 2006-10-31 2011-05-25 皇家飞利浦电子股份有限公司 照明设备封装
US20090008662A1 (en) * 2007-07-05 2009-01-08 Ian Ashdown Lighting device package
EP2061078B1 (de) * 2007-11-16 2015-07-15 IQ evolution GmbH Kühlkörper
US20090207568A1 (en) * 2008-02-18 2009-08-20 Haveri Heikki Antti Mikael Method and apparatus for cooling in miniaturized electronics
US8195118B2 (en) 2008-07-15 2012-06-05 Linear Signal, Inc. Apparatus, system, and method for integrated phase shifting and amplitude control of phased array signals
US8706049B2 (en) * 2008-12-31 2014-04-22 Intel Corporation Platform integrated phased array transmit/receive module
US8467737B2 (en) * 2008-12-31 2013-06-18 Intel Corporation Integrated array transmit/receive module
US7859835B2 (en) * 2009-03-24 2010-12-28 Allegro Microsystems, Inc. Method and apparatus for thermal management of a radio frequency system
US8537552B2 (en) 2009-09-25 2013-09-17 Raytheon Company Heat sink interface having three-dimensional tolerance compensation
US8508943B2 (en) 2009-10-16 2013-08-13 Raytheon Company Cooling active circuits
US8872719B2 (en) 2009-11-09 2014-10-28 Linear Signal, Inc. Apparatus, system, and method for integrated modular phased array tile configuration
US8427371B2 (en) 2010-04-09 2013-04-23 Raytheon Company RF feed network for modular active aperture electronically steered arrays
EP2383779B1 (en) * 2010-04-29 2012-09-12 ABB Oy Mounting base
CN102869943A (zh) * 2010-05-19 2013-01-09 日本电气株式会社 沸腾冷却装置
TW201040485A (en) * 2010-07-21 2010-11-16 Asia Vital Components Co Ltd Improved heat-dissipation structure
US8363413B2 (en) 2010-09-13 2013-01-29 Raytheon Company Assembly to provide thermal cooling
US8810448B1 (en) 2010-11-18 2014-08-19 Raytheon Company Modular architecture for scalable phased array radars
US8355255B2 (en) 2010-12-22 2013-01-15 Raytheon Company Cooling of coplanar active circuits
US8488312B2 (en) 2011-02-14 2013-07-16 Adc Telecommunications, Inc. Systems and methods for thermal management for telecommunications enclosures using heat pipes
US9124361B2 (en) 2011-10-06 2015-09-01 Raytheon Company Scalable, analog monopulse network
US9360514B2 (en) * 2012-04-05 2016-06-07 Board Of Regents, The University Of Texas System Thermal reliability testing systems with thermal cycling and multidimensional heat transfer
US9941242B2 (en) 2012-04-24 2018-04-10 Innogration (Suzhou) Co., Ltd. Unpacked structure for power device of radio frequency power amplification module and assembly method therefor
CN102623416B (zh) * 2012-04-24 2015-09-02 苏州远创达科技有限公司 一种射频功放模块的功率器件无封装结构及其组装方法
AU2013292389A1 (en) * 2012-07-18 2015-02-26 University Of Virginia Patent Foundation Heat transfer device for high heat flux applications and related methods thereof
US9267739B2 (en) * 2012-07-18 2016-02-23 Applied Materials, Inc. Pedestal with multi-zone temperature control and multiple purge capabilities
WO2014034411A1 (ja) * 2012-08-27 2014-03-06 三菱電機株式会社 電力用半導体装置
CN104704629A (zh) * 2012-10-16 2015-06-10 富士电机株式会社 冷却构造体和发热体
JP5788585B2 (ja) 2013-05-13 2015-09-30 新電元工業株式会社 電子モジュールおよびその製造方法
EP2887787A3 (en) * 2013-12-13 2015-08-19 Hitachi, Ltd. Cooling structure for heating element and power converter
US9609738B1 (en) 2013-12-23 2017-03-28 Flextronics Ap, Llc Graphite sheet to redirect SMT components during thermal exposure
US9789572B1 (en) 2014-01-09 2017-10-17 Flextronics Ap, Llc Universal automation line
US10750641B2 (en) 2015-12-17 2020-08-18 Mitsubishi Electric Corporation Phased array antenna
US10109978B2 (en) 2016-04-26 2018-10-23 Nlight, Inc. Low size and weight, high power fiber laser pump
US10597286B2 (en) 2017-08-01 2020-03-24 Analog Devices Global Monolithic phase change heat sink
CN109714931B (zh) * 2017-10-26 2020-08-18 深圳富泰宏精密工业有限公司 应用散热结构的电子设备
WO2019200223A1 (en) * 2018-04-13 2019-10-17 X4 Pharmaceuticals, Inc. Cancer serum biomarkers and methods of use thereof
CN110010546B (zh) * 2018-12-25 2021-01-05 浙江集迈科微电子有限公司 一种竖立放置射频模块的相变散热结构的制作工艺
EP3929975B1 (en) * 2019-03-22 2025-08-06 Resonac Corporation Cooling structure
KR102264132B1 (ko) * 2019-06-14 2021-06-11 제엠제코(주) 반도체 패키지
KR102244279B1 (ko) * 2019-06-14 2021-04-26 제엠제코(주) 반도체 패키지
CN112086413B (zh) 2019-06-14 2024-04-23 Jmj韩国株式会社 半导体封装
AT522831B1 (de) * 2019-08-08 2023-05-15 Dau Gmbh & Co Kg Luftwärmetauscher sowie Verfahren zu dessen Herstellung und damit ausgestatteter Elektronikaufbau
US12174602B2 (en) * 2020-08-04 2024-12-24 Nvidia Corporation Intelligent server-level testing of datacenter cooling systems
CN111900141A (zh) * 2020-08-28 2020-11-06 中国电子科技集团公司第十六研究所 一种陶瓷蒸汽腔散热器
US11457544B2 (en) * 2020-11-24 2022-09-27 Toyota Motor Engineering & Manufacturing North America, Inc. Power electronics systems comprising a two phase cold plate having an outer enclosure and an inner enclosure
EP4460272A2 (en) 2022-01-04 2024-11-13 Bluexthermal, Inc. Ocular region heat transfer devices and associated systems
CN117440645A (zh) * 2022-07-15 2024-01-23 华为技术有限公司 电子组件和电子设备
US12557245B1 (en) 2022-09-27 2026-02-17 International Business Machines Corporation Dual-phase evaporative cooling in sealed electronics devices
CN118632476B (zh) * 2024-04-30 2026-04-24 华为数字能源技术有限公司 功率变换设备
CN119687706B (zh) * 2024-11-27 2026-01-13 合肥联宝信息技术有限公司 金刚石铜均温板制备方法及金刚石铜均温板

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3786861A (en) * 1971-04-12 1974-01-22 Battelle Memorial Institute Heat pipes
US4019098A (en) * 1974-11-25 1977-04-19 Sundstrand Corporation Heat pipe cooling system for electronic devices
JPS5936827B2 (ja) * 1979-01-12 1984-09-06 日本電信電話株式会社 集積回路素子の冷却装置
US4519447A (en) 1980-08-04 1985-05-28 Fine Particle Technology Corporation Substrate cooling
JPS59119186A (ja) * 1982-12-24 1984-07-10 Ngk Spark Plug Co Ltd 板状ヒ−トパイプ
JPS59185989A (ja) * 1983-04-08 1984-10-22 Fujitsu Ltd ヒ−トパイプ構造基板
DE3504992A1 (de) * 1985-02-14 1986-08-14 Brown, Boveri & Cie Ag, 6800 Mannheim Leistungshalbleitermodul mit integriertem waermerohr
US4833567A (en) 1986-05-30 1989-05-23 Digital Equipment Corporation Integral heat pipe module
US4880053A (en) * 1989-04-24 1989-11-14 The Board Of Governors Of Wayne State University Two-phase cooling apparatus for electronic equipment and the like
US5199165A (en) * 1991-12-13 1993-04-06 Hewlett-Packard Company Heat pipe-electrical interconnect integration method for chip modules
US5216580A (en) 1992-01-14 1993-06-01 Sun Microsystems, Inc. Optimized integral heat pipe and electronic circuit module arrangement
US5308920A (en) * 1992-07-31 1994-05-03 Itoh Research & Development Laboratory Co., Ltd. Heat radiating device
US5769154A (en) * 1996-01-29 1998-06-23 Sandia Corporation Heat pipe with embedded wick structure
US6056044A (en) * 1996-01-29 2000-05-02 Sandia Corporation Heat pipe with improved wick structures
TW346566B (en) * 1996-08-29 1998-12-01 Showa Aluminiun Co Ltd Radiator for portable electronic apparatus
JPH11148787A (ja) * 1997-11-17 1999-06-02 Mitsubishi Electric Corp ヒートパイプ入りサンドイッチパネル
JP2000269676A (ja) * 1999-03-15 2000-09-29 Tdk Corp 電子機器の放熱装置
JP2001217365A (ja) * 2000-02-02 2001-08-10 Shimada Phys & Chem Ind Co Ltd 電子部品モジュ−ルの冷却装置

Also Published As

Publication number Publication date
NO20034071D0 (no) 2003-09-15
JP2004523920A (ja) 2004-08-05
CA2440522A1 (en) 2002-09-26
CN1507767A (zh) 2004-06-23
EP1378153B1 (en) 2011-08-10
EP1378153A4 (en) 2009-05-06
KR20030087643A (ko) 2003-11-14
CN1333627C (zh) 2007-08-22
US6483705B2 (en) 2002-11-19
JP4004963B2 (ja) 2007-11-07
AU2002254176B2 (en) 2004-05-20
EP1378153A1 (en) 2004-01-07
WO2002076165A1 (en) 2002-09-26
US20020131237A1 (en) 2002-09-19
CA2440522C (en) 2010-05-11
KR100553171B1 (ko) 2006-02-22

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