NO20034071L - Elektronisk modul som omfatter et kjöleunderlag, samt tilhörende fremgangsmåter - Google Patents

Elektronisk modul som omfatter et kjöleunderlag, samt tilhörende fremgangsmåter

Info

Publication number
NO20034071L
NO20034071L NO20034071A NO20034071A NO20034071L NO 20034071 L NO20034071 L NO 20034071L NO 20034071 A NO20034071 A NO 20034071A NO 20034071 A NO20034071 A NO 20034071A NO 20034071 L NO20034071 L NO 20034071L
Authority
NO
Norway
Prior art keywords
chamber
evaporator
transfer body
heat transfer
condenser
Prior art date
Application number
NO20034071A
Other languages
English (en)
Other versions
NO20034071D0 (no
Inventor
Steven Robert Snyder
Charles Michael Newton
Michael Ray Lange
Original Assignee
Harris Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Harris Corp filed Critical Harris Corp
Publication of NO20034071D0 publication Critical patent/NO20034071D0/no
Publication of NO20034071L publication Critical patent/NO20034071L/no

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/73—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control for cooling by change of state
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/06—Control arrangements therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

Elektronisk modul (20) omfatter et kjøleunderlag (21a), en elektronisk anordning (22) som er montert på dette, og en varmeoppsamlingspanne (23) opptil kjøleunderlaget (21a). Nærmere bestemt kan kjøleunderlaget (21a) ha et fordamperkammer (25) opptil den elektroniske anordning (22), minst ett kondensatorkammer (26) opptil varmeoppsamlingspannen (23) og minst én kjølefluidpassasje (27) som forbinder fordamperkammeret (25) i fluidforbindelse med nevnte minst ene kondensatorkammer (26). Dessuten kan et fordampervarmeoverføringslegeme (28) være innkoplet i termisk forbindelse mellom fordamperkammeret (25) og den elektroniske anordning (22). I tillegg kan minst ett kondensatorvarmeoverføringslegeme (36) være innkoplet i termisk forbindelse mellom nevnte minst ene kondensatorkammer (26) og varmeoppsamlingspannen (23). Fordampervarmeoverføringslegemet (28) og nevnte minst ene kondensatorvarmeoverføringslegeme (36) har fortrinnsvis vært en høyere varmeledningsevne enn tilgrensende partier av kjøleunderlaget.
NO20034071A 2001-03-19 2003-09-15 Elektronisk modul som omfatter et kjöleunderlag, samt tilhörende fremgangsmåter NO20034071L (no)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/811,827 US6483705B2 (en) 2001-03-19 2001-03-19 Electronic module including a cooling substrate and related methods
PCT/US2002/007417 WO2002076165A1 (en) 2001-03-19 2002-03-12 Electronic module including a cooling substrate and related methods

Publications (2)

Publication Number Publication Date
NO20034071D0 NO20034071D0 (no) 2003-09-15
NO20034071L true NO20034071L (no) 2003-11-18

Family

ID=25207701

Family Applications (1)

Application Number Title Priority Date Filing Date
NO20034071A NO20034071L (no) 2001-03-19 2003-09-15 Elektronisk modul som omfatter et kjöleunderlag, samt tilhörende fremgangsmåter

Country Status (9)

Country Link
US (1) US6483705B2 (no)
EP (1) EP1378153B1 (no)
JP (1) JP4004963B2 (no)
KR (1) KR100553171B1 (no)
CN (1) CN1333627C (no)
AU (1) AU2002254176B2 (no)
CA (1) CA2440522C (no)
NO (1) NO20034071L (no)
WO (1) WO2002076165A1 (no)

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Also Published As

Publication number Publication date
NO20034071D0 (no) 2003-09-15
WO2002076165A1 (en) 2002-09-26
US6483705B2 (en) 2002-11-19
JP2004523920A (ja) 2004-08-05
KR100553171B1 (ko) 2006-02-22
AU2002254176B2 (en) 2004-05-20
CA2440522A1 (en) 2002-09-26
EP1378153B1 (en) 2011-08-10
CN1507767A (zh) 2004-06-23
US20020131237A1 (en) 2002-09-19
KR20030087643A (ko) 2003-11-14
EP1378153A1 (en) 2004-01-07
JP4004963B2 (ja) 2007-11-07
CN1333627C (zh) 2007-08-22
CA2440522C (en) 2010-05-11
EP1378153A4 (en) 2009-05-06

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