NO20054833L - Fremgangsmate og anordning for anbringelse av en getter i et MEMS-innretningshus - Google Patents

Fremgangsmate og anordning for anbringelse av en getter i et MEMS-innretningshus

Info

Publication number
NO20054833L
NO20054833L NO20054833A NO20054833A NO20054833L NO 20054833 L NO20054833 L NO 20054833L NO 20054833 A NO20054833 A NO 20054833A NO 20054833 A NO20054833 A NO 20054833A NO 20054833 L NO20054833 L NO 20054833L
Authority
NO
Norway
Prior art keywords
getter
tire
placing
device housing
mems device
Prior art date
Application number
NO20054833A
Other languages
English (en)
Inventor
Harlan L Curtis
Lori A Dunaway
Jon B Dcamp
Max C Glenn
Original Assignee
Honywell Internat Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Honywell Internat Inc filed Critical Honywell Internat Inc
Publication of NO20054833L publication Critical patent/NO20054833L/no

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems ; Auxiliary parts of microstructural devices or systems
    • B81B7/0032—Packages or encapsulation
    • B81B7/0035—Packages or encapsulation for maintaining a controlled atmosphere inside of the chamber containing the MEMS
    • B81B7/0038—Packages or encapsulation for maintaining a controlled atmosphere inside of the chamber containing the MEMS using materials for controlling the level of pressure, contaminants or moisture inside of the package, e.g. getters
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems ; Auxiliary parts of microstructural devices or systems
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/40—Fillings or auxiliary members in containers, e.g. centering rings
    • H10W76/42—Fillings
    • H10W76/48—Fillings including materials for absorbing or reacting with moisture or other undesired substances

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Micromachines (AREA)
  • Mechanical Optical Scanning Systems (AREA)

Abstract

Det beskrives en fremgangsmåte for å redusere forekomster av løse getter materialpartikler i innretninger med mikroelekttomekaniske systemer (MEMS) (200). MEMS-innretningene innbefatter en mikromaskin (108) i et hovedsakelig lukket hulrom (224) som er dannet av et hus (102) og et dekke (202) for hus. Hufrommet rommer en getter (220) som er anbrakt på et gettersubsttat (222) som skal festes til dekket. Fremgangsmåten innbefatter å tilveiebringe et område (212) meUom en del av dekket og en del av gettersubsttatet, og posisjonere denne getter i området, og å feste gettersubsttatet tU dekket.
NO20054833A 2003-03-20 2005-10-19 Fremgangsmate og anordning for anbringelse av en getter i et MEMS-innretningshus NO20054833L (no)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/393,237 US6914323B2 (en) 2003-03-20 2003-03-20 Methods and apparatus for attaching getters to MEMS device housings
PCT/US2004/008024 WO2004086499A1 (en) 2003-03-20 2004-03-17 Methods and apparatus for attaching getters inside mems device housing

Publications (1)

Publication Number Publication Date
NO20054833L true NO20054833L (no) 2005-10-19

Family

ID=32988101

Family Applications (1)

Application Number Title Priority Date Filing Date
NO20054833A NO20054833L (no) 2003-03-20 2005-10-19 Fremgangsmate og anordning for anbringelse av en getter i et MEMS-innretningshus

Country Status (7)

Country Link
US (2) US6914323B2 (no)
EP (1) EP1604399A1 (no)
JP (1) JP2006520698A (no)
KR (1) KR20050113243A (no)
CN (1) CN1788346A (no)
NO (1) NO20054833L (no)
WO (1) WO2004086499A1 (no)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
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US7170155B2 (en) * 2003-06-25 2007-01-30 Intel Corporation MEMS RF switch module including a vertical via
WO2006010037A2 (en) * 2004-07-08 2006-01-26 Deborah Schenberger Strain monitoring system and apparatus
US7045885B1 (en) 2004-12-09 2006-05-16 Hewlett-Packard Development Company, L.P. Placement of absorbing material in a semiconductor device
US7509870B2 (en) * 2005-10-26 2009-03-31 Orthodata Technologies Llc MEMS capacitive bending and axial strain sensor
DE102006016260B4 (de) * 2006-04-06 2024-07-18 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Vielfach-Bauelement mit mehreren aktive Strukturen enthaltenden Bauteilen (MEMS) zum späteren Vereinzeln, flächiges Substrat oder flächig ausgebildete Kappenstruktur, in der Mikrosystemtechnik einsetzbares Bauteil mit aktiven Strukturen, Einzelsubstrat oder Kappenstruktur mit aktiven Strukturen und Verfahren zum Herstellen eines Vielfach-Bauelements
US7462506B2 (en) * 2006-06-15 2008-12-09 International Business Machines Corporation Carbon dioxide gettering method for a chip module assembly
JP2009522104A (ja) * 2006-12-15 2009-06-11 ビ−エイイ− システムズ パブリック リミテッド カンパニ− 薄膜ゲッタ装置に関する改善
US7923790B1 (en) 2007-03-09 2011-04-12 Silicon Laboratories Inc. Planar microshells for vacuum encapsulated devices and damascene method of manufacture
US7659150B1 (en) 2007-03-09 2010-02-09 Silicon Clocks, Inc. Microshells for multi-level vacuum cavities
US7595209B1 (en) 2007-03-09 2009-09-29 Silicon Clocks, Inc. Low stress thin film microshells
US7736929B1 (en) 2007-03-09 2010-06-15 Silicon Clocks, Inc. Thin film microshells incorporating a getter layer
GB2451921A (en) * 2007-08-17 2009-02-18 Wolfson Microelectronics Plc MEMS package
GB2451908B (en) * 2007-08-17 2009-12-02 Wolfson Microelectronics Plc Mems package
US7800190B2 (en) * 2008-06-16 2010-09-21 Honeywell International Inc. Getter on die in an upper sense plate designed system
FR2933389B1 (fr) * 2008-07-01 2010-10-29 Commissariat Energie Atomique Structure a base d'un materiau getter suspendu
US8387464B2 (en) * 2009-11-30 2013-03-05 Freescale Semiconductor, Inc. Laterally integrated MEMS sensor device with multi-stimulus sensing
US8748206B2 (en) 2010-11-23 2014-06-10 Honeywell International Inc. Systems and methods for a four-layer chip-scale MEMS device
US9171964B2 (en) 2010-11-23 2015-10-27 Honeywell International Inc. Systems and methods for a three-layer chip-scale MEMS device
JP2013219237A (ja) * 2012-04-10 2013-10-24 Mitsubishi Electric Corp 真空パッケージおよびその製造方法
EP2973685B1 (en) * 2013-03-13 2018-01-17 Robert Bosch GmbH Mems device having a getter
US9422149B2 (en) 2014-07-25 2016-08-23 Semiconductor Manufacturing International (Shanghai) Corporation Trapped sacrificial structures and methods of manufacturing same using thin-film encapsulation
GB2557717A (en) * 2016-10-12 2018-06-27 Cirrus Logic Int Semiconductor Ltd Transducer packaging
US10384930B2 (en) 2017-04-26 2019-08-20 Invensense, Inc. Systems and methods for providing getters in microelectromechanical systems
CN109734046B (zh) * 2018-12-26 2021-05-14 中国科学院上海微系统与信息技术研究所 一种真空封装工艺
JP2023519917A (ja) * 2020-03-26 2023-05-15 ウィメムス カンパニー リミテッド 光スキャナーパッケージ及び製造方法

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US5547093A (en) * 1994-09-14 1996-08-20 Delco Electronics Corporation Method for forming a micromachine motion sensor
US6323550B1 (en) * 1995-06-06 2001-11-27 Analog Devices, Inc. Package for sealing an integrated circuit die
US6969635B2 (en) * 2000-12-07 2005-11-29 Reflectivity, Inc. Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates
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US6040625A (en) * 1997-09-25 2000-03-21 I/O Sensors, Inc. Sensor package arrangement
DE19754513A1 (de) 1997-12-09 1999-06-10 Bosch Gmbh Robert Verfahren zur Herstellung einer Mikrostruktur und entsprechende Mikrostruktur
ITMI981138A1 (it) * 1998-05-21 1999-11-21 Getters Spa Processo per la rimozione di acqua da camere evacuate o da gas
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US6522457B2 (en) * 1999-05-20 2003-02-18 Paolo Battilana Apparatus for removal of water from evacuated chambers or from gasses using boron oxide
US6379988B1 (en) * 2000-05-16 2002-04-30 Sandia Corporation Pre-release plastic packaging of MEMS and IMEMS devices
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US6469909B2 (en) * 2001-01-09 2002-10-22 3M Innovative Properties Company MEMS package with flexible circuit interconnect
US20020089044A1 (en) * 2001-01-09 2002-07-11 3M Innovative Properties Company Hermetic mems package with interlocking layers
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Also Published As

Publication number Publication date
US20040183177A1 (en) 2004-09-23
JP2006520698A (ja) 2006-09-14
KR20050113243A (ko) 2005-12-01
US20050208739A1 (en) 2005-09-22
EP1604399A1 (en) 2005-12-14
US6914323B2 (en) 2005-07-05
US7074636B2 (en) 2006-07-11
CN1788346A (zh) 2006-06-14
WO2004086499A1 (en) 2004-10-07

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