NO20074482L - Prosess for a danne miniatyriserte getteravsetninger og getteravsetninger dannet slik - Google Patents

Prosess for a danne miniatyriserte getteravsetninger og getteravsetninger dannet slik

Info

Publication number
NO20074482L
NO20074482L NO20074482A NO20074482A NO20074482L NO 20074482 L NO20074482 L NO 20074482L NO 20074482 A NO20074482 A NO 20074482A NO 20074482 A NO20074482 A NO 20074482A NO 20074482 L NO20074482 L NO 20074482L
Authority
NO
Norway
Prior art keywords
forming
polymer
deposits
solvent
miniaturized
Prior art date
Application number
NO20074482A
Other languages
English (en)
Other versions
NO338707B1 (no
Inventor
Marco Moraja
Andrea Conte
Sara Guadagnuolo
Original Assignee
Getters Spa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Getters Spa filed Critical Getters Spa
Publication of NO20074482L publication Critical patent/NO20074482L/no
Publication of NO338707B1 publication Critical patent/NO338707B1/no

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P76/00—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography
    • H10P76/20—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials
    • H10P76/202—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials for lift-off processes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00261—Processes for packaging MEMS devices
    • B81C1/00277—Processes for packaging MEMS devices for maintaining a controlled atmosphere inside of the cavity containing the MEMS
    • B81C1/00285—Processes for packaging MEMS devices for maintaining a controlled atmosphere inside of the cavity containing the MEMS using materials for controlling the level of pressure, contaminants or moisture inside of the package, e.g. getters
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0047—Photosensitive materials characterised by additives for obtaining a metallic or ceramic pattern, e.g. by firing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P76/00—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24479—Structurally defined web or sheet [e.g., overall dimension, etc.] including variation in thickness
    • Y10T428/24612—Composite web or sheet
    • Y10T428/2462—Composite web or sheet with partial filling of valleys on outer surface

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Physical Vapour Deposition (AREA)
  • Manufacture Of Electron Tubes, Discharge Lamp Vessels, Lead-In Wires, And The Like (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
  • Drying Of Semiconductors (AREA)
  • Common Detailed Techniques For Electron Tubes Or Discharge Tubes (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Yarns And Mechanical Finishing Of Yarns Or Ropes (AREA)
  • Portable Nailing Machines And Staplers (AREA)
  • Image-Pickup Tubes, Image-Amplification Tubes, And Storage Tubes (AREA)
  • Cathode-Ray Tubes And Fluorescent Screens For Display (AREA)

Abstract

En prosess for å danne miniatyriserte getteravsetninger blir beskrevet, omfattende følgende trinn: å danne et lag (11) av et fotofølsomt polymermateriale på en bærer (10); selektivt å eksponere polymerlaget for å forårsake en kjemisk modifikasjon i en del av polymerlaget; å fjerne med et løsemiddel den tidligere eksponerte eller den tidligere ikke eksponerte delen av polymerlaget, for derved å danne kaviteter (12, 121, ... ) i polymerlaget; å danne et tynt lag (13) av et gettermateriale ved hjelp av katodeavsetning ved bunnen av kaviteten og på restpolymeren; og å fjerne, med et annet løsemiddel, den polymerdelen som ikke ble fjernet ved hjelp av det første løsemiddelet, for å etterlate minst en gettermaterialavsetning (131,131', ... ; 20) på bærerflaten. Oppfinnelsen vedrører også miniatyriserte getteravsetninger fremskaffet ved hjelp av denne prosessen.
NO20074482A 2005-04-12 2007-09-03 Prosess for å danne miniatyriserte getteravsetninger og getteravsetninger dannet slik NO338707B1 (no)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
IT000616A ITMI20050616A1 (it) 2005-04-12 2005-04-12 Processo per la formazione di depositi getter miniaturizzati e depositi getrter cosi'ottenuti
PCT/IT2006/000242 WO2006109343A2 (en) 2005-04-12 2006-04-11 Process for the formation of miniaturized getter deposits and getterdeposits so obtained

Publications (2)

Publication Number Publication Date
NO20074482L true NO20074482L (no) 2007-10-25
NO338707B1 NO338707B1 (no) 2016-10-03

Family

ID=36968973

Family Applications (1)

Application Number Title Priority Date Filing Date
NO20074482A NO338707B1 (no) 2005-04-12 2007-09-03 Prosess for å danne miniatyriserte getteravsetninger og getteravsetninger dannet slik

Country Status (14)

Country Link
US (1) US7998319B2 (no)
EP (1) EP1869696B1 (no)
JP (1) JP4971305B2 (no)
KR (1) KR100930738B1 (no)
CN (1) CN101156227B (no)
AT (1) ATE398831T1 (no)
CA (1) CA2602808C (no)
DE (1) DE602006001518D1 (no)
DK (1) DK1869696T3 (no)
ES (1) ES2308746T3 (no)
IT (1) ITMI20050616A1 (no)
NO (1) NO338707B1 (no)
PL (1) PL1869696T3 (no)
WO (1) WO2006109343A2 (no)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ITMI20052343A1 (it) 2005-12-06 2007-06-07 Getters Spa Processo per la produzione di dispositivi micromeccanici contenenti un materiale getter e dispositivi cosi'prodotti
ITMI20070301A1 (it) 2007-02-16 2008-08-17 Getters Spa Supporti comprendenti materiali getter e sorgenti di metalli alcalini o alcalino-terrosi per sistemi di termoregolazione basati su effetto tunnel
FR2922202B1 (fr) * 2007-10-15 2009-11-20 Commissariat Energie Atomique Structure comportant une couche getter et une sous-couche d'ajustement et procede de fabrication.
DE102017210459A1 (de) 2017-06-22 2018-12-27 Robert Bosch Gmbh Mikromechanische Vorrichtung mit einer ersten Kaverne und einer zweiten Kaverne
FR3083537B1 (fr) * 2018-07-06 2021-07-30 Ulis Boitier hermetique comportant un getter, composant integrant un tel boitier hermetique et procede de fabrication associe
FR3088319B1 (fr) 2018-11-08 2020-10-30 Ulis Boitier hermetique comportant un getter, composant optoelectronique ou dispositif mems integrant un tel boitier hermetique et procede de fabrication associe
FR3109936B1 (fr) * 2020-05-07 2022-08-05 Lynred Procede de fabrication d’un microsysteme electromecanique et microsysteme electromecanique
CN115554807A (zh) * 2022-09-29 2023-01-03 无锡奥夫特光学技术有限公司 一种新型的吸气剂结构及其制备方法
CN117262490B (zh) * 2023-09-15 2025-12-30 杭州海康微影传感科技有限公司 杜瓦组件及其加工方法和探测设备

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CN1003826B (zh) * 1985-04-16 1989-04-05 北京有色金属研究总院 宽激活温度范围吸气剂和吸气元件
EP0341843A3 (en) * 1988-05-09 1991-03-27 International Business Machines Corporation A process of forming a conductor pattern
EP0734589B1 (en) * 1993-12-13 1998-03-25 Honeywell Inc. Integrated silicon vacuum micropackage for infrared devices
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US5656778A (en) * 1995-04-24 1997-08-12 Kearfott Guidance And Navigation Corporation Micromachined acceleration and coriolis sensor
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JPH09196682A (ja) * 1996-01-19 1997-07-31 Matsushita Electric Ind Co Ltd 角速度センサと加速度センサ
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JP2004066225A (ja) * 2002-06-13 2004-03-04 Lg Electronics Inc ゲッタの組成物及び該ゲッタの組成物を利用した電界放出表示装置
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ITMI20031178A1 (it) 2003-06-11 2004-12-12 Getters Spa Depositi multistrato getter non evaporabili ottenuti per

Also Published As

Publication number Publication date
KR100930738B1 (ko) 2009-12-09
US7998319B2 (en) 2011-08-16
ES2308746T3 (es) 2008-12-01
CA2602808A1 (en) 2006-10-19
JP4971305B2 (ja) 2012-07-11
CA2602808C (en) 2013-11-26
ATE398831T1 (de) 2008-07-15
ITMI20050616A1 (it) 2006-10-13
EP1869696A2 (en) 2007-12-26
DE602006001518D1 (de) 2008-07-31
CN101156227A (zh) 2008-04-02
WO2006109343A3 (en) 2006-12-14
KR20080016991A (ko) 2008-02-25
DK1869696T3 (da) 2008-10-13
EP1869696B1 (en) 2008-06-18
WO2006109343A2 (en) 2006-10-19
CN101156227B (zh) 2011-01-26
JP2008537981A (ja) 2008-10-02
NO338707B1 (no) 2016-10-03
US20080171180A1 (en) 2008-07-17
PL1869696T3 (pl) 2008-10-31

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