NO20084351L - Baererlegeme for komponenter og kretser - Google Patents

Baererlegeme for komponenter og kretser

Info

Publication number
NO20084351L
NO20084351L NO20084351A NO20084351A NO20084351L NO 20084351 L NO20084351 L NO 20084351L NO 20084351 A NO20084351 A NO 20084351A NO 20084351 A NO20084351 A NO 20084351A NO 20084351 L NO20084351 L NO 20084351L
Authority
NO
Norway
Prior art keywords
carrier body
circuits
components
support body
conductive
Prior art date
Application number
NO20084351A
Other languages
English (en)
Inventor
Claus Peter Kluge
Original Assignee
Ceramtec Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ceramtec Ag filed Critical Ceramtec Ag
Publication of NO20084351L publication Critical patent/NO20084351L/no

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/76—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
    • F21V29/763—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
    • F21V29/86—Ceramics or glass
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
    • F21V29/89—Metals
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H10W40/226—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections characterised by projecting parts, e.g. fins to increase surface area
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/251—Organics
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/255—Arrangements for cooling characterised by their materials having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/258—Metallic materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/259—Ceramics or glasses
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W42/00—Arrangements for protection of devices
    • H10W42/20—Arrangements for protection of devices protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/69—Insulating materials thereof
    • H10W70/692—Ceramics or glasses
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/71—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/71—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements
    • F21V29/713—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements in direct thermal and mechanical contact of each other to form a single system
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/75—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with fins or blades having different shapes, thicknesses or spacing
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2105/00—Planar light sources
    • F21Y2105/10—Planar light sources comprising a two-dimensional [2D] array of point-like light-generating elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2215/00—Fins
    • F28F2215/10—Secondary fins, e.g. projections or recesses on main fins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0284—Details of three-dimensional rigid printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09045—Locally raised area or protrusion of insulating substrate
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H10H20/8582—Means for heat extraction or cooling characterised by their shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H10H20/8586—Means for heat extraction or cooling comprising fluids, e.g. heat-pipes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07351—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting
    • H10W72/07352—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting changes in structures or sizes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/321—Structures or relative sizes of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Structure Of Printed Boards (AREA)
  • Led Device Packages (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)

Abstract

Oppfinnelsen vedrører et bærerlegeme (1, 2) for elektriske. eller elektroniske komponentelementer (6a, 6b, 6c, 6d) eller kretser, hvilket bærerlegeme (1, 2) er elektrisk ikke-ledende eller nær sagt ikke-ledende. For å forenkle bærerlegemet (1) samtidig som det tilveiebringes ekstremt forbedret. varmespredning foreslås det i henhold til oppfinnelsen at bærerlegemet (1, 2) er tilveiebrakt integrert med varmespredende eller varmetilførende kjøleelementer (7).
NO20084351A 2006-03-23 2008-10-16 Baererlegeme for komponenter og kretser NO20084351L (no)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
DE102006013873 2006-03-23
DE102006055965 2006-11-24
DE102006058417 2006-12-08
PCT/EP2007/052726 WO2007107601A2 (de) 2006-03-23 2007-03-22 Trägerkörper für bauelemente oder schaltungen

Publications (1)

Publication Number Publication Date
NO20084351L true NO20084351L (no) 2008-12-18

Family

ID=38051792

Family Applications (1)

Application Number Title Priority Date Filing Date
NO20084351A NO20084351L (no) 2006-03-23 2008-10-16 Baererlegeme for komponenter og kretser

Country Status (19)

Country Link
US (1) US8040676B2 (no)
EP (11) EP2387072A3 (no)
JP (1) JP2009531844A (no)
KR (1) KR101363421B1 (no)
CN (2) CN105590901A (no)
AU (1) AU2007228752B2 (no)
BR (1) BRPI0709070A2 (no)
CA (1) CA2644433A1 (no)
DE (1) DE102007014433A1 (no)
DK (1) DK2397754T3 (no)
ES (1) ES2536154T3 (no)
IL (1) IL194282A (no)
MX (1) MX2008012029A (no)
MY (1) MY147935A (no)
NO (1) NO20084351L (no)
RU (1) RU2434313C2 (no)
SI (1) SI2397754T1 (no)
TW (1) TWI449137B (no)
WO (1) WO2007107601A2 (no)

Families Citing this family (75)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102008001226A1 (de) * 2007-04-24 2008-10-30 Ceramtec Ag Bauteil mit einem metallisierten Keramikkörper
US20100112372A1 (en) * 2007-04-24 2010-05-06 Claus Peter Kluge Component having a ceramic base the surface of which is metalized
JP2010524698A (ja) 2007-04-24 2010-07-22 セラムテック アクチエンゲゼルシャフト 少なくとも１つの非プレート状の構成要素を備えた複合体を製造する方法
CN101687718A (zh) * 2007-04-24 2010-03-31 陶瓷技术股份公司 具有金属化表面的陶瓷体的结构部件
WO2008128943A1 (de) * 2007-04-24 2008-10-30 Ceramtec Ag Verfahren zur selektiven oberflächenbehandlung von nicht plattenförmigen werkstücken
DE102007055462A1 (de) 2007-11-13 2009-05-20 Adamidis, Antonius Verfahren zur Regelung eines Photovoltaik-Anlage und derartige Anlage
US7940560B2 (en) 2008-05-29 2011-05-10 Advanced Micro Devices, Inc. Memory cells, memory devices and integrated circuits incorporating the same
KR100993059B1 (ko) 2008-09-29 2010-11-08 엘지이노텍 주식회사 발광 장치
TW201039958A (en) * 2009-03-31 2010-11-16 Ceramtec Ag Component having an overlapping laser track
DE102009025033A1 (de) 2009-06-10 2010-12-16 Behr Gmbh & Co. Kg Thermoelektrische Vorrichtung und Verfahren zum Herstellen einer thermoelektrischen Vorrichtung
TWM378614U (en) * 2009-06-29 2010-04-11 Te-Lung Chen The ceramic radiator with conductive circuit
DE102009033029A1 (de) * 2009-07-02 2011-01-05 Electrovac Ag Elektronische Vorrichtung
DE102009045189A1 (de) * 2009-09-30 2011-04-28 Sirona Dental Systems Gmbh Beleuchtungsvorrichtung für ein dentales Handstück
TWI525287B (zh) * 2009-10-27 2016-03-11 製陶技術股份有限公司 由具有ｌｅｄ的可變規模的陶瓷二極體載體構成的陣列
US9228785B2 (en) * 2010-05-04 2016-01-05 Alexander Poltorak Fractal heat transfer device
US10852069B2 (en) * 2010-05-04 2020-12-01 Fractal Heatsink Technologies, LLC System and method for maintaining efficiency of a fractal heat sink
EP2567174B1 (en) * 2010-05-04 2020-02-26 Alexander Poltorak Fractal heat transfer device
US12078432B2 (en) * 2010-05-04 2024-09-03 Fractal Heatsink Technologies LLC Fractal heat transfer device
US10041745B2 (en) * 2010-05-04 2018-08-07 Fractal Heatsink Technologies LLC Fractal heat transfer device
CN102446873A (zh) * 2010-10-07 2012-05-09 卓英社有限公司 散热器
DE102011114880A1 (de) 2010-10-15 2012-04-19 Ceramtec Gmbh LED-Treiberschaltung
DE102011114882A1 (de) 2010-10-15 2012-04-19 Ceramtec Gmbh LED-Leuchte mit integriertem Treiber
WO2012130838A1 (de) * 2011-03-29 2012-10-04 Ceramtec Gmbh Spritzguss-lampenkörper mit keramischen kühlern und leds
JP2014512079A (ja) 2011-04-04 2014-05-19 セラムテック ゲゼルシャフト ミット ベシュレンクテル ハフツング 発光手段としてのｌｅｄとガラス又はプラスチック製ランプシェードとを備えたｌｅｄランプ
DE102012205178A1 (de) 2011-04-04 2012-10-04 Ceramtec Gmbh Keramische Leiterplatte mit Al-Kühler
TW201320877A (zh) * 2011-11-04 2013-05-16 茂晶國際能源股份有限公司 熱管理裝置及電子設備
GB2497283A (en) * 2011-12-02 2013-06-12 Tzu-Yu Liao Method for assembling LEDs to a ceramic heat conductive member
US9130326B2 (en) * 2011-12-14 2015-09-08 Dula-Werke Dustmann & Co. Gmbh Device for supplying electrical energy to a load, and system therefor
WO2013150481A1 (en) * 2012-04-05 2013-10-10 Koninklijke Philips N.V. Led light structure
DE102012103198B4 (de) * 2012-04-13 2019-02-21 Vossloh-Schwabe Deutschland Gmbh Trägereinrichtung für ein Leuchtmodul und Verfahren zu deren Herstellung
KR101499665B1 (ko) * 2012-05-29 2015-03-06 포리프라스틱 가부시키가이샤 복합 성형체의 제조방법
RU2519925C2 (ru) * 2012-06-26 2014-06-20 Открытое акционерное общество "Научно-производственное предприятие "Алмаз" (ОАО "НПП "Алмаз") Устройство для отвода тепла от тепловыделяющих радиоэлементов
US8835299B2 (en) * 2012-08-29 2014-09-16 Infineon Technologies Ag Pre-sintered semiconductor die structure
RU2529852C2 (ru) * 2012-10-18 2014-10-10 Открытое акционерное общество "Научно-производственное объединение "Прибор" Устройство стабилизации температуры электронных компонентов
US9230889B2 (en) * 2013-01-16 2016-01-05 Infineon Technologies Ag Chip arrangement with low temperature co-fired ceramic and a method for forming a chip arrangement with low temperature co-fired ceramic
FI20135113L (fi) * 2013-02-05 2014-08-06 Tellabs Oy Jäähdytysjärjestelyllä varustettu piirikorttijärjestelmä
JP6251739B2 (ja) * 2013-05-22 2017-12-20 株式会社カネカ 放熱構造体
KR101625895B1 (ko) * 2014-01-22 2016-05-31 안성룡 Ｕｖ-ｌｅｄ 조사장치
RU2579434C2 (ru) * 2014-03-19 2016-04-10 Михаил Юрьевич Гончаров Планарный индуктивный элемент и способ отвода тепла от его обмоток
EP3123841A1 (de) 2014-03-28 2017-02-01 CeramTec GmbH Transluzente mit led bestückte platinen und/oder kühlkörper
EP3180805A1 (de) * 2014-08-12 2017-06-21 CeramTec GmbH Keramischer trägerkörper mit solarzellen
EP2990725B1 (en) * 2014-08-27 2018-03-07 Toshiba Lighting & Technology Corporation Socket and lighting device
JP6761800B2 (ja) * 2014-09-09 2020-09-30 セラムテック ゲゼルシャフト ミット ベシュレンクテル ハフツングＣｅｒａｍＴｅｃ ＧｍｂＨ 多層冷却体
WO2016083301A1 (de) * 2014-11-24 2016-06-02 Ceramtec Gmbh Thermomanagement im bereich e-mobility
CN105742252B (zh) * 2014-12-09 2019-05-07 台达电子工业股份有限公司 一种功率模块及其制造方法
CN104465975A (zh) * 2014-12-18 2015-03-25 陈畅 一种功率型led集成封装结构
FR3034171B1 (fr) * 2015-03-23 2021-03-19 Valeo Vision Support de led avec surface de reception et connexion electrique par pontage
DE102015106552B4 (de) * 2015-04-28 2022-06-30 Infineon Technologies Ag Elektronisches Modul mit Fluid-Kühlkanal und Verfahren zum Herstellen desselben
FR3037634B1 (fr) * 2015-06-22 2019-04-05 Valeo Vision Support polymerique pour dispositif lumineux de vehicule automobile
CN108140626A (zh) * 2015-10-07 2018-06-08 陶瓷技术有限责任公司 在两侧冷却的电路
DE102015118245B4 (de) * 2015-10-26 2024-10-10 Infineon Technologies Austria Ag Elektronische Komponente mit einem thermischen Schnittstellenmaterial, Herstellungsverfahren für eine elektronische Komponente, Wärmeabfuhrkörper mit einem thermischen Schnittstellenmaterial und thermisches Schnittstellenmaterial
US10228117B2 (en) * 2015-11-06 2019-03-12 Honeywell International Inc. Air mixing methodology and system to reduce the temperature of LEDs of a photocatalytic reactor
DK3206468T3 (en) * 2016-02-15 2019-04-01 Siemens Ag DC converter with DC voltage
US10522251B2 (en) 2016-07-08 2019-12-31 International Business Machines Corporation Infrared detectors and thermal tags for real-time activity monitoring
EP3485215B1 (en) * 2016-07-12 2023-06-07 Alexander Poltorak System and method for maintaining efficiency of a heat sink
US10376186B2 (en) 2016-10-18 2019-08-13 International Business Machines Corporation Thermal tags for real-time activity monitoring and methods for fabricating the same
DE102017203583A1 (de) * 2017-03-06 2018-09-06 Siemens Aktiengesellschaft Verbund aus Kühlkörper und elektrischer und/oder elektronischer Komponente
DE102017210200A1 (de) * 2017-06-19 2018-12-20 Osram Gmbh Substrat zum aufnehmen eines optoelektronischen bauelements, optoelektronische baugruppe, verfahren zum herstellen eines substrats und verfahren zum herstellen einer optoelektronischen baugruppe
JP7148276B2 (ja) * 2018-05-30 2022-10-05 京セラ株式会社 発光素子搭載用パッケージおよび発光装置
JP7147313B2 (ja) * 2018-07-18 2022-10-05 三菱マテリアル株式会社 金属ベース基板
CN109323140A (zh) * 2018-09-12 2019-02-12 上海三思电子工程有限公司 Led照明设备
WO2020052078A1 (zh) * 2018-09-12 2020-03-19 上海三思电子工程有限公司 Led照明设备
JP2020078988A (ja) * 2018-11-12 2020-05-28 株式会社東海理化電機製作所 車両用視認装置
CN110290635A (zh) * 2019-07-26 2019-09-27 中国科学院半导体研究所 一种低热阻电路板
JP7353148B2 (ja) * 2019-11-25 2023-09-29 国立大学法人東北大学 ヒートシンクの製造方法
EP3923321A1 (de) * 2020-06-08 2021-12-15 CeramTec GmbH Modul mit anschlusslaschen für zuleitungen
KR102907866B1 (ko) 2020-07-17 2026-01-02 삼성전자 주식회사 열적 계면 물질 페이스트 및 반도체 패키지
DE102021213689B4 (de) 2021-12-02 2023-06-22 Zf Friedrichshafen Ag Kühlvorrichtung zum Kühlen einer zu kühlenden Einheit und Verfahren zum Herstellen einer Kühlvorrichtung
US12176687B2 (en) * 2022-05-23 2024-12-24 Hamilton Sundstrand Corporation Power converter
FR3137743B1 (fr) * 2022-07-11 2024-08-02 Valeo Vision Dissipateur thermique de module lumineux pour véhicule automobile et module lumineux pour véhicule automobile
TWI822346B (zh) * 2022-09-20 2023-11-11 健策精密工業股份有限公司 電子裝置及其製造方法
KR102923495B1 (ko) * 2022-09-23 2026-02-05 주식회사 아모그린텍 히트싱크 일체형 파워모듈용 기판 및 그 제조방법
TWI835404B (zh) 2022-11-14 2024-03-11 財團法人工業技術研究院 功率模組
DE102025119996B4 (de) * 2024-05-23 2025-12-11 Ifm Electronic Gmbh Elektronikkomponente für die Automatisierungstechnik sowie ein Herstellverfahren
EP4719030A1 (en) * 2024-09-29 2026-04-01 Shenzhen STS Microelectronics Co., Ltd. Intra-cooling devices for power modules, methods for manufacturing same, power modules and electrical systems

Family Cites Families (95)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3766440A (en) * 1972-08-11 1973-10-16 Gen Motors Corp Ceramic integrated circuit convector assembly
GB2091635A (en) * 1980-12-15 1982-08-04 Hodgkinson Derek Alan Mountain Soft surface laminate
JPS57104246A (en) * 1980-12-19 1982-06-29 Mitsubishi Electric Corp Cooling body
JPS58223678A (ja) * 1982-06-16 1983-12-26 株式会社日立製作所 金属化層を有するＳｉＣ焼結体とその製法
US4681656A (en) * 1983-02-22 1987-07-21 Byrum James E IC carrier system
FR2556503B1 (fr) * 1983-12-08 1986-12-12 Eurofarad Substrat d'interconnexion en alumine pour composant electronique
US5165909A (en) * 1984-12-06 1992-11-24 Hyperion Catalysis Int'l., Inc. Carbon fibrils and method for producing same
DE3604074A1 (de) * 1986-02-08 1987-08-13 Bosch Gmbh Robert Zuendschaltgeraet
DE3709200A1 (de) * 1987-03-20 1988-09-29 Heraeus Gmbh W C Elektronisches bauteil
DE3827893A1 (de) * 1988-08-17 1990-03-01 Hoechst Ceram Tec Ag Verfahren zur stromlosen abscheidung von nickel
DE69000112D1 (de) * 1989-02-03 1992-07-02 Mitsubishi Materials Corp Substrat zur herstellung eines dickschichtschaltkreises.
US5006925A (en) * 1989-11-22 1991-04-09 International Business Machines Corporation Three dimensional microelectric packaging
US5155661A (en) * 1991-05-15 1992-10-13 Hewlett-Packard Company Aluminum nitride multi-chip module
CA2072817A1 (en) * 1991-07-02 1993-01-03 Miksa Desorgo Multi-layer circuit board
US5366688A (en) * 1992-12-09 1994-11-22 Iowa State University Research Foundation, Inc. Heat sink and method of fabricating
DE9307386U1 (de) * 1993-05-14 1993-10-14 Siemens AG, 80333 München Schaltungsanordnung mit einem elektronischen Leistungsschalter
JPH0794625A (ja) * 1993-09-24 1995-04-07 Shinko Electric Ind Co Ltd 多層回路基板及びその製造方法
EP0678917B1 (en) * 1994-04-22 2003-06-25 Nec Corporation Supporting member for cooling means and electronic package using the same
WO1996029736A1 (fr) * 1995-03-20 1996-09-26 Kabushiki Kaisha Toshiba Substrat de circuit au nitrure de silicium
US6175084B1 (en) * 1995-04-12 2001-01-16 Denki Kagaku Kogyo Kabushiki Kaisha Metal-base multilayer circuit substrate having a heat conductive adhesive layer
DE19514018C1 (de) * 1995-04-13 1996-11-28 Hoechst Ceram Tec Ag Verfahren zur Herstellung eines metallbeschichteten, metallisierten Substrats aus Aluminiumnitridkeramik und damit erhaltenes metallbeschichtetes Substrat
JP3100871B2 (ja) * 1995-07-11 2000-10-23 株式会社東芝 窒化アルミニウム焼結体
US5798566A (en) * 1996-01-11 1998-08-25 Ngk Spark Plug Co., Ltd. Ceramic IC package base and ceramic cover
US5649593A (en) * 1996-01-17 1997-07-22 Kitagawa Industries Co., Ltd. Radiator member
US5736786A (en) * 1996-04-01 1998-04-07 Ford Global Technologies, Inc. Power module with silicon dice oriented for improved reliability
US5847929A (en) * 1996-06-28 1998-12-08 International Business Machines Corporation Attaching heat sinks directly to flip chips and ceramic chip carriers
DE19636493C1 (de) * 1996-09-09 1998-03-26 Bosch Gmbh Robert Mit Edelmetallsalzen bekeimte Substrate oder Pulver und Verfahren zu ihrer Herstellung
US5708566A (en) * 1996-10-31 1998-01-13 Motorola, Inc. Solder bonded electronic module
JPH10284808A (ja) * 1997-04-08 1998-10-23 Denki Kagaku Kogyo Kk 回路基板
JP3948642B2 (ja) * 1998-08-21 2007-07-25 信越化学工業株式会社 熱伝導性グリース組成物及びそれを使用した半導体装置
US6117797A (en) * 1998-09-03 2000-09-12 Micron Technology, Inc. Attachment method for heat sinks and devices involving removal of misplaced encapsulant
WO2000034539A1 (fr) * 1998-12-07 2000-06-15 Hitachi, Ltd. Materiau composite et son utilisation
DE19900603A1 (de) * 1999-01-11 2000-07-13 Bosch Gmbh Robert Elektronisches Halbleitermodul
US6093961A (en) * 1999-02-24 2000-07-25 Chip Coolers, Inc. Heat sink assembly manufactured of thermally conductive polymer material with insert molded metal attachment
DE19912441A1 (de) * 1999-03-19 2000-09-21 Elfo Ag Sachseln Sachseln Multi-Chip-Modul
KR20010079642A (ko) * 1999-06-14 2001-08-22 오카야마 노리오 복합 재료 및 그를 이용한 반도체 장치
JP2001015882A (ja) * 1999-07-02 2001-01-19 Nec Corp 歪みゲージ内蔵回路基板およびその製造方法
JP4649027B2 (ja) * 1999-09-28 2011-03-09 株式会社東芝 セラミックス回路基板
JP2001135758A (ja) * 1999-11-04 2001-05-18 Toyota Autom Loom Works Ltd パワーモジュールの放熱構造
US7033920B1 (en) * 2000-01-10 2006-04-25 Micron Technology, Inc. Method for fabricating a silicon carbide interconnect for semiconductor components
US7083759B2 (en) * 2000-01-26 2006-08-01 A.L.M.T. Corp. Method of producing a heat dissipation substrate of molybdenum powder impregnated with copper with rolling in primary and secondary directions
US7019975B2 (en) * 2000-08-09 2006-03-28 Mitsubishi Materials Corporation Power module and power module with heat sink
FR2814280B1 (fr) * 2000-09-15 2003-05-02 Alstom Substrat pour circuit electronique de puissance et module electronique de puissance utilisant un tel substrat
DE10146227B4 (de) * 2000-09-20 2015-01-29 Hitachi Metals, Ltd. Siliciumnitrid-Sinterkörper, Leiterplatte und thermoelektrisches Modul
US6582979B2 (en) * 2000-11-15 2003-06-24 Skyworks Solutions, Inc. Structure and method for fabrication of a leadless chip carrier with embedded antenna
DE10062108B4 (de) * 2000-12-13 2010-04-15 Infineon Technologies Ag Leistungsmodul mit verbessertem transienten Wärmewiderstand
CN100482035C (zh) * 2000-12-27 2009-04-22 松下电器产业株式会社 导热性基板的制造方法
DE10101359A1 (de) * 2001-01-13 2002-07-25 Conti Temic Microelectronic Verfahren zur Herstellung einer elektronischen Baugruppe
DE10102621B4 (de) * 2001-01-20 2006-05-24 Conti Temic Microelectronic Gmbh Leistungsmodul
DE10110620A1 (de) * 2001-03-06 2002-09-26 Conti Temic Microelectronic Elekronische Baugruppe
US6418020B1 (en) * 2001-03-30 2002-07-09 Advanced Thermal Technologies Heat dissipation device with ribbed fin plates
US20030112602A1 (en) * 2001-04-06 2003-06-19 Chieh-Wei Lin Structure and designing method of composite heat-dissipating structure
JP2002328775A (ja) * 2001-04-27 2002-11-15 Alps Electric Co Ltd 座標入力装置
DE10129006B4 (de) * 2001-06-15 2009-07-30 Conti Temic Microelectronic Gmbh Elektronische Baugruppe
RU21981U1 (ru) * 2001-07-18 2002-02-27 Савкин Анатолий Иванович Конструкция силового полупроводникового модуля на охладителе
US6756005B2 (en) * 2001-08-24 2004-06-29 Cool Shield, Inc. Method for making a thermally conductive article having an integrated surface and articles produced therefrom
JP2003101184A (ja) * 2001-09-27 2003-04-04 Kyocera Corp セラミック回路基板およびその製造方法
JP2003124590A (ja) * 2001-10-17 2003-04-25 Sumitomo Electric Ind Ltd 回路基板とその製造方法及び高出力モジュール
JP2003163315A (ja) * 2001-11-29 2003-06-06 Denki Kagaku Kogyo Kk モジュール
US6936855B1 (en) * 2002-01-16 2005-08-30 Shane Harrah Bendable high flux LED array
JP3758610B2 (ja) * 2002-06-20 2006-03-22 三井金属鉱業株式会社 電子部品実装用フィルムキャリアテープ
US6625028B1 (en) * 2002-06-20 2003-09-23 Agilent Technologies, Inc. Heat sink apparatus that provides electrical isolation for integrally shielded circuit
JP3920746B2 (ja) * 2002-09-02 2007-05-30 信越化学工業株式会社 熱伝導性複合シートおよびその製造方法
US7244965B2 (en) * 2002-09-04 2007-07-17 Cree Inc, Power surface mount light emitting die package
JP4133170B2 (ja) * 2002-09-27 2008-08-13 Ｄｏｗａホールディングス株式会社 アルミニウム−セラミックス接合体
US7173334B2 (en) * 2002-10-11 2007-02-06 Chien-Min Sung Diamond composite heat spreader and associated methods
TWI239606B (en) * 2002-11-07 2005-09-11 Kobe Steel Ltd Heat spreader and semiconductor device and package using the same
AT412265B (de) * 2002-11-12 2004-12-27 Electrovac Bauteil zur wärmeableitung
CN2583936Y (zh) * 2002-11-21 2003-10-29 陞技电脑股份有限公司 电路板的散热装置
US6919504B2 (en) * 2002-12-19 2005-07-19 3M Innovative Properties Company Flexible heat sink
JP3971296B2 (ja) * 2002-12-27 2007-09-05 Ｄｏｗａホールディングス株式会社 金属−セラミックス接合基板およびその製造方法
US7015795B2 (en) * 2002-12-30 2006-03-21 Potomac Photonics, Inc. Self-identifying integrated circuits and method for fabrication thereof
US7360309B2 (en) * 2003-01-28 2008-04-22 Advanced Ceramics Research, Inc. Method of manufacturing microchannel heat exchangers
US7034345B2 (en) * 2003-03-27 2006-04-25 The Boeing Company High-power, integrated AC switch module with distributed array of hybrid devices
US6976769B2 (en) * 2003-06-11 2005-12-20 Cool Options, Inc. Light-emitting diode reflector assembly having a heat pipe
US20040264195A1 (en) * 2003-06-25 2004-12-30 Chia-Fu Chang Led light source having a heat sink
KR20060031629A (ko) * 2003-06-30 2006-04-12 켄이치로 미야하라 발광소자 탑재용 기판 및 발광소자
US7078796B2 (en) * 2003-07-01 2006-07-18 Freescale Semiconductor, Inc. Corrosion-resistant copper bond pad and integrated device
DE10333439A1 (de) * 2003-07-23 2005-02-17 Robert Bosch Gmbh Verfahren zur Herstellung eines aus mehreren Verdrahtungsebenen bestehenden Hybrid-Produktes
JP2005094842A (ja) * 2003-09-12 2005-04-07 Toshiba Corp インバータ装置及びその製造方法
DE10344547A1 (de) * 2003-09-24 2005-08-11 Warnking Elektrotechnik Gmbh Leuchtmittel
US6992887B2 (en) * 2003-10-15 2006-01-31 Visteon Global Technologies, Inc. Liquid cooled semiconductor device
US20050083655A1 (en) * 2003-10-15 2005-04-21 Visteon Global Technologies, Inc. Dielectric thermal stack for the cooling of high power electronics
TWI245436B (en) * 2003-10-30 2005-12-11 Kyocera Corp Package for housing light-emitting element, light-emitting apparatus and illumination apparatus
GB0328246D0 (en) * 2003-12-04 2004-06-16 Qinetiq Ltd Improvements relating to electronic circuit packages
TWI309962B (en) * 2004-02-24 2009-05-11 Sanyo Electric Co Circuit device and menufacturing method thereof
EP1568978B1 (de) * 2004-02-24 2014-06-04 Siemens Aktiengesellschaft Temperatursensor
WO2005098942A1 (ja) * 2004-04-05 2005-10-20 Mitsubishi Materials Corporation Ａi／ａiｎ接合体、パワーモジュール用基板及びパワーモジュール並びにａi／ａiｎ接合体の製造方法
US7036387B2 (en) * 2004-05-11 2006-05-02 Sun Microsystems, Inc. Integrated strain gages for board strain characterization
US7186461B2 (en) * 2004-05-27 2007-03-06 Delaware Capital Formation, Inc. Glass-ceramic materials and electronic packages including same
JP2005347354A (ja) * 2004-05-31 2005-12-15 Sanyo Electric Co Ltd 回路装置およびその製造方法
WO2006023860A2 (en) * 2004-08-23 2006-03-02 General Electric Company Thermally conductive composition and method for preparing the same
TWI253161B (en) * 2004-09-10 2006-04-11 Via Tech Inc Chip carrier and chip package structure thereof
US7269017B2 (en) * 2004-11-19 2007-09-11 Delphi Technologies, Inc. Thermal management of surface-mount circuit devices on laminate ceramic substrate
US7521789B1 (en) * 2004-12-18 2009-04-21 Rinehart Motion Systems, Llc Electrical assembly having heat sink protrusions

Also Published As

Publication number Publication date
EP2387071B1 (de) 2021-07-21
EP2387073A3 (de) 2014-03-26
RU2008141611A (ru) 2010-04-27
EP2387072A3 (de) 2014-03-26
CA2644433A1 (en) 2007-09-27
EP2388811A2 (de) 2011-11-23
AU2007228752A1 (en) 2007-09-27
EP2002476A2 (de) 2008-12-17
JP2009531844A (ja) 2009-09-03
MX2008012029A (es) 2008-11-28
EP2387071A3 (de) 2014-04-23
EP2387072A2 (de) 2011-11-16
DK2397754T3 (en) 2015-03-30
EP2387068A3 (de) 2014-04-23
CN105590901A (zh) 2016-05-18
DE102007014433A1 (de) 2007-10-04
KR101363421B1 (ko) 2014-02-14
EP2398050A2 (de) 2011-12-21
MY147935A (en) 2013-02-15
EP2388811A3 (de) 2014-09-10
AU2007228752B2 (en) 2012-09-20
EP2397754A2 (de) 2011-12-21
KR20090005047A (ko) 2009-01-12
US20090086436A1 (en) 2009-04-02
BRPI0709070A2 (pt) 2011-06-28
WO2007107601A2 (de) 2007-09-27
EP2320457A2 (de) 2011-05-11
EP2320457A3 (de) 2014-09-10
TWI449137B (zh) 2014-08-11
EP2398050A3 (de) 2014-02-26
EP2398050B1 (de) 2020-01-15
WO2007107601A3 (de) 2007-12-13
IL194282A (en) 2013-11-28
EP2397754B1 (de) 2014-12-24
EP2397754A3 (de) 2013-06-26
EP2387074B1 (de) 2020-02-19
EP2387074A2 (de) 2011-11-16
SI2397754T1 (sl) 2015-07-31
EP2387073A2 (de) 2011-11-16
EP2387068A2 (de) 2011-11-16
CN101043809A (zh) 2007-09-26
EP2387071A2 (de) 2011-11-16
TW200814267A (en) 2008-03-16
EP2387069A2 (de) 2011-11-16
EP2387069A3 (de) 2014-05-07
RU2434313C2 (ru) 2011-11-20
ES2536154T3 (es) 2015-05-20
US8040676B2 (en) 2011-10-18
EP2387074A3 (de) 2014-05-07

Similar Documents

Publication Publication Date Title
MY147935A (en) Carrier body for component elements or circuits
TW200639353A (en) Illumination device having at least one light-emitting diode and vehicle headlight
ATE532400T1 (de) Wärmeleitendes montageelement zur anbringung einer bestückten leiterplatte an einem kühlkörper
TW200631491A (en) Sandwiched thermal solution
WO2007008342A3 (en) Thermal solution for portable electronic devices
ATE539481T1 (de) Wechselrichter mit einem gehäuse mit kühlkörper aufweisenden elektrischen und/oder elektronischen komponenten
TW200709766A (en) Flexible circuit board with heat sink
TW200739867A (en) Tape carrier package and display unit equipped with it
ATE356541T1 (de) Elektronisches leistungssystem mit passiver kühlung
WO2008040596A3 (de) Kühlkörper zur kühlung eines elektrischen bauelementes
GB201208816D0 (en) Printed circuit board heatsink mounting
ITMI20091294A1 (it) Modulo a semiconduttore e un procedimento per la produzione di un circuito elettronico
TW200802762A (en) Heat sink, electronic device, and tuner apparatus
SE0502703L (sv) Elektrisk drivenhet med positioneringsaggregat, vilket trycker komponenter mot en kylare
TW200520622A (en) Operating circuit for a lamp with a heat sink
TW200619908A (en) Captive socket actuator
TW200735736A (en) Assembly with at leat two component in electrical leading effect connection and procedure for manufacturing the assembly
DE10333315A1 (de) Leistungshalbleitermodul
CN108702852A (zh) 具有壳体件和盖件的电气设备
EP1715732A3 (en) Printed circuit board structure having a layer at one of its surfaces for dissipating heat by convection
DE502008000765D1 (de) Leistungshalbleitermodul mit verbundenem Substratträger und Herstellungsverfahren hierzu
EP1722611A3 (de) Elektronisches Gerät mit einer elektrischen Spule
TW200721952A (en) Heat dissipation device
TW200724014A (en) Heat dissipation structure
TW200727766A (en) Heat dissipating substrate

Legal Events

Date Code Title Description
FC2A Withdrawal, rejection or dismissal of laid open patent application