NO333677B1 - Blyfri loddelegering - Google Patents

Blyfri loddelegering Download PDF

Info

Publication number
NO333677B1
NO333677B1 NO20032185A NO20032185A NO333677B1 NO 333677 B1 NO333677 B1 NO 333677B1 NO 20032185 A NO20032185 A NO 20032185A NO 20032185 A NO20032185 A NO 20032185A NO 333677 B1 NO333677 B1 NO 333677B1
Authority
NO
Norway
Prior art keywords
alloy
solder
lead
fatigue life
fatigue
Prior art date
Application number
NO20032185A
Other languages
English (en)
Norwegian (no)
Other versions
NO20032185D0 (no
NO20032185L (no
Inventor
Alan Leonard Meddle
Original Assignee
Singapore Asahi Chemical & Solder Ind Pte Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Singapore Asahi Chemical & Solder Ind Pte Ltd filed Critical Singapore Asahi Chemical & Solder Ind Pte Ltd
Publication of NO20032185D0 publication Critical patent/NO20032185D0/no
Publication of NO20032185L publication Critical patent/NO20032185L/no
Publication of NO333677B1 publication Critical patent/NO333677B1/no

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400°C
    • B23K35/262—Sn as the principal constituent

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Organic Insulating Materials (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
  • Battery Electrode And Active Subsutance (AREA)
  • Conductive Materials (AREA)
  • Materials For Medical Uses (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Ceramic Products (AREA)
NO20032185A 2000-11-16 2003-05-14 Blyfri loddelegering NO333677B1 (no)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/GB2000/004365 WO2002040213A1 (en) 2000-11-16 2000-11-16 Lead-free solders

Publications (3)

Publication Number Publication Date
NO20032185D0 NO20032185D0 (no) 2003-05-14
NO20032185L NO20032185L (no) 2003-05-14
NO333677B1 true NO333677B1 (no) 2013-08-05

Family

ID=9886311

Family Applications (1)

Application Number Title Priority Date Filing Date
NO20032185A NO333677B1 (no) 2000-11-16 2003-05-14 Blyfri loddelegering

Country Status (14)

Country Link
EP (1) EP1333957B1 (cs)
AT (1) ATE293513T1 (cs)
AU (1) AU2001214037A1 (cs)
CY (1) CY1105145T1 (cs)
CZ (1) CZ297089B6 (cs)
DE (1) DE60019651T2 (cs)
DK (1) DK1333957T3 (cs)
ES (1) ES2241671T3 (cs)
HU (1) HU228577B1 (cs)
NO (1) NO333677B1 (cs)
PL (1) PL195528B1 (cs)
PT (1) PT1333957E (cs)
RU (1) RU2254971C2 (cs)
WO (1) WO2002040213A1 (cs)

Families Citing this family (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050199323A1 (en) * 2004-03-15 2005-09-15 Nielson Daniel B. Reactive material enhanced munition compositions and projectiles containing same
US7977420B2 (en) 2000-02-23 2011-07-12 Alliant Techsystems Inc. Reactive material compositions, shot shells including reactive materials, and a method of producing same
USRE45899E1 (en) 2000-02-23 2016-02-23 Orbital Atk, Inc. Low temperature, extrudable, high density reactive materials
SG139507A1 (en) * 2001-07-09 2008-02-29 Quantum Chem Tech Singapore Improvements in or relating to solders
EP1465468B1 (en) 2003-03-31 2007-11-14 SANYO ELECTRIC Co., Ltd. Metal mask and method of printing lead-free solder paste using same
JP4979944B2 (ja) 2003-08-26 2012-07-18 株式会社トクヤマ 素子接合用基板、素子接合基板及びその製造方法
FR2867469A1 (fr) 2004-03-15 2005-09-16 Alliant Techsystems Inc Compositions reactives contenant un metal, et leur procede de production
CZ300575B6 (cs) * 2005-01-04 2009-06-17 Jeník@Jan Bezolovnatá pájka
TWI465312B (zh) * 2005-07-19 2014-12-21 日本斯倍利亞股份有限公司 追加供應用無鉛焊料及焊浴中之Ｃｕ濃度及Ｎｉ濃度之調整方法
EP2116807A2 (en) 2005-10-04 2009-11-11 Alliant Techsystems Inc. Reactive Material Enhanced Projectiles And Related Methods
CN100453244C (zh) * 2005-12-16 2009-01-21 浙江亚通焊材有限公司 无铅锡焊料
CN101357421B (zh) * 2005-12-16 2010-12-29 浙江亚通焊材有限公司 无铅锡焊料
RU2335385C1 (ru) * 2006-12-25 2008-10-10 Государственное образовательное учреждение высшего профессионального образования "Государственный университет цветных металлов и золота" Припой на основе серебра
US8888932B2 (en) 2007-07-18 2014-11-18 Senju Metal Industry Co., Ltd. Indium-containing lead-free solder for vehicle-mounted electronic circuits
RU2367551C2 (ru) * 2007-10-29 2009-09-20 Государственное образовательное учреждение высшего профессионального образования "Воронежский государственный технический университет" Бессвинцовый припой
US7821130B2 (en) * 2008-03-31 2010-10-26 Infineon Technologies Ag Module including a rough solder joint
US8598464B2 (en) 2009-04-20 2013-12-03 Panasonic Corporation Soldering material and electronic component assembly
CA2842762A1 (en) * 2011-08-02 2013-02-07 Alpha Metals, Inc. Solder compositions
JP2013252548A (ja) * 2012-06-08 2013-12-19 Nihon Almit Co Ltd 微細部品接合用のソルダペースト
CN103042315B (zh) * 2013-01-22 2015-05-27 马莒生 耐热耐湿低熔点无铅焊料合金
JP2015077601A (ja) * 2013-04-02 2015-04-23 千住金属工業株式会社 鉛フリーはんだ合金
AU2015254179B2 (en) 2014-04-30 2017-07-20 Nihon Superior Co., Ltd. Lead-free solder alloy
US9931716B2 (en) 2014-06-24 2018-04-03 Harima Chemicals, Incorporated Solder alloy, solder composition, solder paste, and electronic circuit board
KR102685941B1 (ko) * 2015-05-05 2024-07-17 인듐 코포레이션 전자장치 적용을 위한 무연 땜납 합금
WO2016185674A1 (ja) * 2015-05-19 2016-11-24 パナソニックＩｐマネジメント株式会社 はんだ合金およびそれを用いた実装構造体
JP6135885B2 (ja) * 2015-05-19 2017-05-31 パナソニックＩｐマネジメント株式会社 はんだ合金およびそれを用いた実装構造体
JP6745453B2 (ja) * 2016-05-18 2020-08-26 パナソニックＩｐマネジメント株式会社 はんだ合金およびそれを用いた実装構造体
JP6230737B1 (ja) * 2017-03-10 2017-11-15 株式会社タムラ製作所 鉛フリーはんだ合金、ソルダペースト及び電子回路基板
JP6397079B1 (ja) * 2017-04-07 2018-09-26 株式会社ケーヒン はんだ材料
CN109894768B (zh) * 2019-03-29 2021-06-18 东莞市千岛金属锡品有限公司 一种低温无铅合金焊料的制备方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1997009455A1 (en) * 1995-09-01 1997-03-13 Sarnoff Corporation Soldering composition
KR980006783A (ko) * 1996-05-13 1998-03-30 이. 힐러 윌리엄 저가의 위상 고정 모터 제어 방법 및 구조
JP3736819B2 (ja) * 1997-01-17 2006-01-18 株式会社豊田中央研究所 無鉛はんだ合金
WO1999004048A1 (en) * 1997-07-17 1999-01-28 Litton Systems, Inc. Tin-bismuth based lead-free solders
US5938862A (en) * 1998-04-03 1999-08-17 Delco Electronics Corporation Fatigue-resistant lead-free alloy
JP2000288772A (ja) * 1999-02-02 2000-10-17 Nippon Genma:Kk 無鉛はんだ

Also Published As

Publication number Publication date
EP1333957A1 (en) 2003-08-13
CY1105145T1 (el) 2009-11-04
RU2003114304A (ru) 2005-01-20
ES2241671T3 (es) 2005-11-01
HUP0301858A2 (hu) 2003-08-28
PL361336A1 (en) 2004-10-04
AU2001214037A1 (en) 2002-05-27
HU228577B1 (en) 2013-04-29
DE60019651D1 (de) 2005-05-25
CZ20031348A3 (cs) 2004-04-14
DE60019651T2 (de) 2005-09-22
EP1333957B1 (en) 2005-04-20
NO20032185D0 (no) 2003-05-14
HUP0301858A3 (en) 2005-05-30
DK1333957T3 (da) 2005-06-20
PT1333957E (pt) 2005-09-30
PL195528B1 (pl) 2007-09-28
CZ297089B6 (cs) 2006-09-13
RU2254971C2 (ru) 2005-06-27
NO20032185L (no) 2003-05-14
ATE293513T1 (de) 2005-05-15
WO2002040213A1 (en) 2002-05-23

Similar Documents

Publication Publication Date Title
NO333677B1 (no) Blyfri loddelegering
US6176947B1 (en) Lead-free solders
JP7830408B2 (ja) 鉛フリーはんだ組成物
HK1212398A1 (en) Lead-free solder alloys and solder joints thereof with improved drop impact resistance
Ren et al. Board-level drop reliability and fracture behavior of low-temperature soldering Sn–Ag–Cu/Sn–Bi–X hybrid BGA solder joints for consumer electronics
JP2002120085A (ja) 鉛無含有はんだ合金
WO2010122764A1 (ja) はんだ材料および電子部品接合体
CN102892549A (zh) 混合合金焊料膏
US20020155024A1 (en) Lead-free solder compositions
CN1208168C (zh) 无铅焊料
JP7704777B2 (ja) 混合はんだ粉末を含む高温用途の無鉛はんだペースト
US20040241039A1 (en) High temperature lead-free solder compositions
Schueller et al. Second generation Pb-free alloys
Frear Trends and issues in Pb-free soldering for electronic packaging
JP2008221330A (ja) はんだ合金
Li et al. The formation and evolution of IMC and its effect on the solder joint properties
KR101951813B1 (ko) 저융점 무연 합금 솔더 조성물, 이를 포함하는 무연 솔더 페이스트 및 반도체 패키지
US9741676B1 (en) Tin-indium based low temperature solder alloy
Sundelin et al. Pull testing of lead-free QFP solder joints
Samiappan Alternative Pb-free soldering alloys
종훈백 et al. Interfacial reactions and mechanical strength of Sn-3.0 Ag-0.5 Cu/0.1㎛-Ni thin ENEPIG solder joint
Gain et al. Effect of small Sn-Ag-Cu additions on structure and properties of Sn-Zn-Bi solder/BGA during as-soldered and as-aged conditions
Zhang et al. High temperature lead-free solder joints via mixed powder system
Kudyba Perspektywy i kierunki rozwoju bezołowiowych stopów lutowniczych nowej generacji oraz możliwość ich aplikacji w technologii bezołowiowego lutowania elektroniki użytkowej
KR20150075692A (ko) 무연 합금 솔더 조성물, 이를 포함하는 무연 솔더 페이스트 및 반도체 패키지

Legal Events

Date Code Title Description
MK1K Patent expired