NO810902L - Fremgangsmaate til intensivering av spyle- og renseprosesser r for perforasjoner i formstykker i spyle- og renseautomate - Google Patents

Fremgangsmaate til intensivering av spyle- og renseprosesser r for perforasjoner i formstykker i spyle- og renseautomate

Info

Publication number
NO810902L
NO810902L NO810902A NO810902A NO810902L NO 810902 L NO810902 L NO 810902L NO 810902 A NO810902 A NO 810902A NO 810902 A NO810902 A NO 810902A NO 810902 L NO810902 L NO 810902L
Authority
NO
Norway
Prior art keywords
rinse
cleaning
intensification
perforations
pieces
Prior art date
Application number
NO810902A
Other languages
English (en)
Other versions
NO151183C (no
NO151183B (no
Inventor
Georg Mueller
Wolfgang Gebauer
Original Assignee
Siemens Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Ag filed Critical Siemens Ag
Publication of NO810902L publication Critical patent/NO810902L/no
Publication of NO151183B publication Critical patent/NO151183B/no
Publication of NO151183C publication Critical patent/NO151183C/no

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/08—Apparatus, e.g. for photomechanical printing surfaces
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0085—Apparatus for treatments of printed circuits with liquids not provided for in groups H05K3/02 - H05K3/46; conveyors and holding means therefor
    • H05K3/0088—Apparatus for treatments of printed circuits with liquids not provided for in groups H05K3/02 - H05K3/46; conveyors and holding means therefor for treatment of holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/26—Cleaning or polishing of the conductive pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0736—Methods for applying liquids, e.g. spraying
    • H05K2203/0746—Local treatment using a fluid jet, e.g. for removing or cleaning material; Providing mechanical pressure using a fluid jet
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0736—Methods for applying liquids, e.g. spraying
    • H05K2203/075—Global treatment of printed circuits by fluid spraying, e.g. cleaning a conductive pattern using nozzles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1509—Horizontally held PCB

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • Cleaning And De-Greasing Of Metallic Materials By Chemical Methods (AREA)
  • Silver Salt Photography Or Processing Solution Therefor (AREA)
NO810902A 1980-03-21 1981-03-16 Fremgangsmaate til intensivering av spyle- og renseprosesser for perforasjoner i formstykker i spyle- og renseautomater NO151183C (no)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE3011061A DE3011061C2 (de) 1980-03-21 1980-03-21 Verfahren zur Intensivierung von Spül- und Reinigungsprozessen für Perforationen in Formstücken in Spül- und Reinigungsautomaten

Publications (3)

Publication Number Publication Date
NO810902L true NO810902L (no) 1981-09-22
NO151183B NO151183B (no) 1984-11-19
NO151183C NO151183C (no) 1985-02-27

Family

ID=6097972

Family Applications (1)

Application Number Title Priority Date Filing Date
NO810902A NO151183C (no) 1980-03-21 1981-03-16 Fremgangsmaate til intensivering av spyle- og renseprosesser for perforasjoner i formstykker i spyle- og renseautomater

Country Status (3)

Country Link
EP (1) EP0037483B1 (no)
DE (1) DE3011061C2 (no)
NO (1) NO151183C (no)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3244860C2 (de) * 1982-12-03 1985-09-19 Siemens AG, 1000 Berlin und 8000 München Vorrichtung zur Oxidation von Kupferoberflächen mit einem flüssigen Oxidationsmittel, insbesondere bei gedruckten Leiterplatten mittels einer horizontal arbeitenden Durchlaufanlage
DE3528575A1 (de) * 1985-08-06 1987-02-19 Schering Ag Verfahren und einrichtung zur reinigung, aktivierung und/oder metallisierung von bohrloechern in horizontal gefuehrten leiterplatten
US4755271A (en) * 1986-07-28 1988-07-05 Siemens Aktiengesellschaft Electroplating apparatus for plate-shaped workpieces, particularly printed circuit boards
DE3708529A1 (de) * 1987-03-16 1988-09-29 Siemens Ag Spuelmodul
US4871435A (en) * 1988-10-14 1989-10-03 Charles Denofrio Electroplating apparatus
DE3916693A1 (de) * 1989-05-23 1990-11-29 Schering Ag Anordnung zur behandlung und/oder reinigung von gut, insbesondere von mit bohrungen versehenen leiterplatten
DE3916694A1 (de) * 1989-05-23 1990-11-29 Schering Ag Anordnung zur chemischen behandlung und/oder reinigung von gut, insbesondere von mit bohrungen versehenen leiterplatten, sowie dazugehoeriges verfahren
JP3100057B2 (ja) * 1989-08-29 2000-10-16 ザ リージェンツ オブ ザ ユニバーシティ オブ カリフォルニア 新規な加水分解酵素阻害剤及び基質、並びにこれらを用いた分析方法及びキット
DE3932779A1 (de) * 1989-09-30 1991-04-11 Schering Ag Verfahren zum behandeln von gegenstaenden mit einer fluessigkeit, sowie vorrichtung zur durchfuehrung des verfahrens
DE4017380C1 (en) * 1990-05-30 1991-10-02 Schering Ag Berlin-Bergkamen, 1000 Berlin, De Washing-out bores in objects to be galvanised - by alternating increasing and lowering of pressure of cleaning or rinsing liq., flowing through
DE4040119A1 (de) * 1990-12-13 1992-06-17 Schering Ag Verfahren zum durchfluten von bohrungen in plattenfoermigen werkstuecken, insbesondere leiterplatten, und vorrichtung hierfuer
JPH10512101A (ja) * 1995-01-05 1998-11-17 ヒューベル エゴン 超微細孔を有したプレート形状の加工材料の処理のための方法と装置
US5720813A (en) 1995-06-07 1998-02-24 Eamon P. McDonald Thin sheet handling system
DE19524562A1 (de) * 1995-07-06 1997-01-09 Schmid Gmbh & Co Geb Vorrichtung zum Behandeln von flexiblen platten- bzw. blattförmigen Gegenständen, insbesondere Leiterplatten
DE19530989C1 (de) * 1995-08-23 1997-03-13 Atotech Deutschland Gmbh Verfahren zum Filmstrippen
JP3005898B2 (ja) * 1998-04-30 2000-02-07 東京化工機株式会社 液体噴射装置
DE10015349A1 (de) 2000-03-23 2001-10-25 Atotech Deutschland Gmbh Verfahren und Vorrichtung zum Behandeln von durchgehende Löcher und/oder Vertiefungen aufweisenden Schaltungsträgern sowie Anwendung des Verfahrens und Verwendung der Vorrichtung
US8150543B2 (en) 2007-09-28 2012-04-03 Siemens Aktiengesellschaft Methods, apparatus and articles for an air jet loom
US7951244B2 (en) * 2008-01-11 2011-05-31 Illinois Tool Works Inc. Liquid cleaning apparatus for cleaning printed circuit boards
JP6329380B2 (ja) * 2014-02-07 2018-05-23 株式会社ジャパンディスプレイ 液晶表示装置の製造方法および製造装置
CN111570151A (zh) * 2020-04-21 2020-08-25 石狮市天宏金属制品有限公司 一种钢质隔热防火门生产装置及工艺

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB837487A (en) * 1957-05-08 1960-06-15 Birmetals Ltd Etching curved surfaces
US3082774A (en) * 1961-02-08 1963-03-26 Ct Circuits Inc Etching machine
US3630453A (en) * 1970-02-20 1971-12-28 United States Steel Corp Adjustable elongated spray nozzle
DE2016969A1 (en) * 1970-04-09 1971-12-23 Dainippon Screen Mfg Pickling process for obtaining perforations - in metallic sheet

Also Published As

Publication number Publication date
NO151183C (no) 1985-02-27
DE3011061C2 (de) 1983-12-22
NO151183B (no) 1984-11-19
DE3011061A1 (de) 1981-10-15
EP0037483B1 (de) 1984-08-22
EP0037483A1 (de) 1981-10-14

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