NO843113L - Baerefilm for halvlederskiver og fremgangsmaate for fremstilling av individuelle brikker ut fra en halvlederskive - Google Patents

Baerefilm for halvlederskiver og fremgangsmaate for fremstilling av individuelle brikker ut fra en halvlederskive

Info

Publication number
NO843113L
NO843113L NO843113A NO843113A NO843113L NO 843113 L NO843113 L NO 843113L NO 843113 A NO843113 A NO 843113A NO 843113 A NO843113 A NO 843113A NO 843113 L NO843113 L NO 843113L
Authority
NO
Norway
Prior art keywords
semi
leader
movie
disk
procedure
Prior art date
Application number
NO843113A
Other languages
English (en)
Other versions
NO172716C (no
NO172716B (no
Inventor
Joseph Anthony Aurichio
Original Assignee
Stauffer Chemical Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Stauffer Chemical Co filed Critical Stauffer Chemical Co
Publication of NO843113L publication Critical patent/NO843113L/no
Publication of NO172716B publication Critical patent/NO172716B/no
Publication of NO172716C publication Critical patent/NO172716C/no

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7402—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • B28D5/0052—Means for supporting or holding work during breaking
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0442—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7402—Wafer tapes, e.g. grinding or dicing support tapes
    • H10P72/7404—Wafer tapes, e.g. grinding or dicing support tapes the wafer tape being a laminate of three or more layers, e.g. including additional layers beyond a base layer and an uppermost adhesive layer
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7416—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W46/00—Marks applied to devices, e.g. for alignment or identification
    • H10W46/101—Marks applied to devices, e.g. for alignment or identification characterised by the type of information, e.g. logos or symbols
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W46/00—Marks applied to devices, e.g. for alignment or identification
    • H10W46/301—Marks applied to devices, e.g. for alignment or identification for alignment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W46/00—Marks applied to devices, e.g. for alignment or identification
    • H10W46/501—Marks applied to devices, e.g. for alignment or identification for use before dicing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Dicing (AREA)
  • Adhesive Tapes (AREA)
  • Holding Or Fastening Of Disk On Rotational Shaft (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Die Bonding (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Laminated Bodies (AREA)
NO843113A 1983-08-03 1984-08-02 Delefilm for understoettelse av halvlederskiver, samt fremgangsmaate for fremstilling av enkelte brikker fra en halvlederskive NO172716C (no)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US51993683A 1983-08-03 1983-08-03

Publications (3)

Publication Number Publication Date
NO843113L true NO843113L (no) 1985-02-04
NO172716B NO172716B (no) 1993-05-18
NO172716C NO172716C (no) 1993-08-25

Family

ID=24070468

Family Applications (1)

Application Number Title Priority Date Filing Date
NO843113A NO172716C (no) 1983-08-03 1984-08-02 Delefilm for understoettelse av halvlederskiver, samt fremgangsmaate for fremstilling av enkelte brikker fra en halvlederskive

Country Status (15)

Country Link
EP (1) EP0134606B1 (no)
JP (1) JPS6057642A (no)
KR (1) KR920006894B1 (no)
AU (1) AU559159B2 (no)
BR (1) BR8403579A (no)
CA (1) CA1244294A (no)
DE (1) DE3477311D1 (no)
HK (1) HK62789A (no)
IE (1) IE55238B1 (no)
IL (1) IL72141A (no)
MY (1) MY100982A (no)
NO (1) NO172716C (no)
NZ (1) NZ209093A (no)
PH (1) PH23587A (no)
SG (1) SG35489G (no)

Families Citing this family (40)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5049434A (en) * 1984-04-30 1991-09-17 National Starch And Chemical Investment Holding Corporation Pre-patterned device substrate device-attach adhesive transfer system
EP0185767B1 (en) * 1984-05-29 1991-01-23 MITSUI TOATSU CHEMICALS, Inc. Film for machining wafers
US4687693A (en) * 1985-06-13 1987-08-18 Stauffer Chemical Company Adhesively mountable die attach film
JPH0691057B2 (ja) * 1985-09-07 1994-11-14 日東電工株式会社 半導体ウエハの保護部材
DE3787680T2 (de) * 1986-07-09 1994-03-10 Lintec Corp Klebestreifen zum Kleben von Plättchen.
US5030308A (en) * 1986-07-14 1991-07-09 National Starch And Chemical Investment Holding Corporation Method of bonding a semiconductor chip to a substrate
US4793883A (en) * 1986-07-14 1988-12-27 National Starch And Chemical Corporation Method of bonding a semiconductor chip to a substrate
JPH01143211A (ja) * 1987-11-27 1989-06-05 Takatori Haitetsuku:Kk ウエハーに対する保護テープの貼付け切り抜き方法および装置
JPH05179211A (ja) * 1991-12-30 1993-07-20 Nitto Denko Corp ダイシング・ダイボンドフイルム
US5667884A (en) * 1993-04-12 1997-09-16 Bolger; Justin C. Area bonding conductive adhesive preforms
KR200174655Y1 (ko) * 1994-04-30 2000-03-02 유무성 반도체 일반 및 LOC(Lead On Chip) 리드프레임의 테이핑장치
JP4230080B2 (ja) 2000-02-18 2009-02-25 リンテック株式会社 ウエハ貼着用粘着シート
FR2815468B1 (fr) * 2000-10-12 2003-10-03 Gemplus Card Int Procede pour le report de microcircuit sur un support
FR2831148B1 (fr) 2001-10-22 2004-01-02 Gemplus Card Int Procede et dispositif de manipulation d'un wafer
US6620651B2 (en) * 2001-10-23 2003-09-16 National Starch And Chemical Investment Holding Corporation Adhesive wafers for die attach application
JP4107417B2 (ja) 2002-10-15 2008-06-25 日東電工株式会社 チップ状ワークの固定方法
JP4283596B2 (ja) 2003-05-29 2009-06-24 日東電工株式会社 チップ状ワークの固定方法
JP4536367B2 (ja) * 2003-12-24 2010-09-01 東レ・ダウコーニング株式会社 ダイシングダイボンディング用シート及びその製造方法
JP4275522B2 (ja) 2003-12-26 2009-06-10 日東電工株式会社 ダイシング・ダイボンドフィルム
JP4443962B2 (ja) 2004-03-17 2010-03-31 日東電工株式会社 ダイシング・ダイボンドフィルム
WO2008032367A1 (en) 2006-09-12 2008-03-20 Nitto Denko Corporation Dicing/die bonding film
JP4430085B2 (ja) 2007-03-01 2010-03-10 日東電工株式会社 ダイシング・ダイボンドフィルム
JP4717051B2 (ja) 2007-11-08 2011-07-06 日東電工株式会社 ダイシング・ダイボンドフィルム
JP4717052B2 (ja) 2007-11-08 2011-07-06 日東電工株式会社 ダイシング・ダイボンドフィルム
JP4717086B2 (ja) 2008-01-18 2011-07-06 日東電工株式会社 ダイシング・ダイボンドフィルム
JP4717085B2 (ja) 2008-01-18 2011-07-06 日東電工株式会社 ダイシング・ダイボンドフィルム
JP4553400B2 (ja) 2008-02-18 2010-09-29 日東電工株式会社 ダイシング・ダイボンドフィルム
EP2149900A2 (en) 2008-08-01 2010-02-03 Nitto Denko Corporation Dicing die-bonding film
JP4628479B2 (ja) 2008-08-04 2011-02-09 日東電工株式会社 ダイシング・ダイボンドフィルム
EP2151860A2 (en) 2008-08-04 2010-02-10 Nitto Denko Corporation Dicing die-bonding film
EP2151858A2 (en) 2008-08-04 2010-02-10 Nitto Denko Corporation Dicing die-bonding film
JP5519971B2 (ja) 2008-11-26 2014-06-11 日東電工株式会社 ダイシング・ダイボンドフィルム及び半導体装置の製造方法
JP2012079936A (ja) 2010-10-01 2012-04-19 Nitto Denko Corp ダイシング・ダイボンドフィルム、及び、半導体装置の製造方法
JP5023225B1 (ja) 2011-03-10 2012-09-12 日東電工株式会社 半導体装置用フィルムの製造方法
JP5398083B2 (ja) 2011-03-11 2014-01-29 日東電工株式会社 ダイボンドフィルム及びその用途
JP5036887B1 (ja) 2011-03-11 2012-09-26 日東電工株式会社 保護フィルム付きダイシングフィルム
JP5930625B2 (ja) * 2011-08-03 2016-06-08 日東電工株式会社 ダイボンドフィルム、ダイシング・ダイボンドフィルム、及び、半導体装置
JP5976326B2 (ja) 2012-01-25 2016-08-23 日東電工株式会社 半導体装置の製造方法、及び、当該半導体装置の製造方法に用いられる接着フィルム
JP6193663B2 (ja) 2013-07-26 2017-09-06 日東電工株式会社 ダイシングテープ付きダイボンドフィルム、及び、半導体装置の製造方法
KR102675134B1 (ko) * 2020-03-31 2024-06-12 동우 화인켐 주식회사 도전성 필름 적층체 및 이의 제조 방법

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1061014B (de) * 1957-07-03 1959-07-09 Minnesota Mining & Mfg Klebkraeftige Klebfolie oder Klebband, insbesondere mit einem biegsamen Traeger aus einem nichtfaserigen Film mit einer klebrigen Vorderseite und einem Rueckseitenaufstrich niederer Adhaesion
FR1484458A (no) * 1965-06-25 1967-09-15
US3579105A (en) * 1969-03-03 1971-05-18 Perkin Elmer Corp Digital readout system having an automatic zero-setting circuit
US4285433A (en) * 1979-12-19 1981-08-25 Western Electric Co., Inc. Method and apparatus for removing dice from a severed wafer
JPS5695974A (en) * 1979-12-28 1981-08-03 Shin Etsu Chem Co Ltd Releasable silicone type adhesive base
IE55524B1 (en) * 1983-06-13 1990-10-10 Minnesota Mining & Mfg Electrically and thermally conductive adhesive transfer tape

Also Published As

Publication number Publication date
AU559159B2 (en) 1987-02-26
NO172716C (no) 1993-08-25
IL72141A0 (en) 1984-10-31
IE55238B1 (en) 1990-07-04
CA1244294A (en) 1988-11-08
BR8403579A (pt) 1985-06-25
EP0134606A3 (en) 1985-11-27
AU3120084A (en) 1985-02-07
NZ209093A (en) 1986-10-08
JPS6057642A (ja) 1985-04-03
PH23587A (en) 1989-09-11
DE3477311D1 (en) 1989-04-20
KR920006894B1 (ko) 1992-08-21
IE841466L (en) 1985-02-03
IL72141A (en) 1988-02-29
MY100982A (en) 1991-06-15
KR850002170A (ko) 1985-05-06
EP0134606B1 (en) 1989-03-15
EP0134606A2 (en) 1985-03-20
HK62789A (en) 1989-08-11
SG35489G (en) 1989-10-13
NO172716B (no) 1993-05-18

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