NO844985L - Invertert reaktorkammer for kjemisk dampavsetning med positiv vertikal stroem - Google Patents
Invertert reaktorkammer for kjemisk dampavsetning med positiv vertikal stroemInfo
- Publication number
- NO844985L NO844985L NO844985A NO844985A NO844985L NO 844985 L NO844985 L NO 844985L NO 844985 A NO844985 A NO 844985A NO 844985 A NO844985 A NO 844985A NO 844985 L NO844985 L NO 844985L
- Authority
- NO
- Norway
- Prior art keywords
- vapor deposition
- chemical vapor
- reactor chamber
- vertical flow
- positive vertical
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
- C23C16/45582—Expansion of gas before it reaches the substrate
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
- H10D84/01—Manufacture or treatment
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B25/00—Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
- C30B25/02—Epitaxial-layer growth
- C30B25/08—Reaction chambers; Selection of materials therefor
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B25/00—Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
- C30B25/02—Epitaxial-layer growth
- C30B25/14—Feed and outlet means for the gases; Modifying the flow of the reactive gases
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Crystallography & Structural Chemistry (AREA)
- Mechanical Engineering (AREA)
- Chemical Vapour Deposition (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US48991983A | 1983-04-29 | 1983-04-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| NO844985L true NO844985L (no) | 1984-12-12 |
Family
ID=23945829
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| NO844985A NO844985L (no) | 1983-04-29 | 1984-12-12 | Invertert reaktorkammer for kjemisk dampavsetning med positiv vertikal stroem |
Country Status (9)
| Country | Link |
|---|---|
| EP (1) | EP0142495B1 (fr) |
| JP (1) | JPS60501234A (fr) |
| KR (1) | KR900001658B1 (fr) |
| CA (1) | CA1209330A (fr) |
| DE (1) | DE3367627D1 (fr) |
| IL (1) | IL71376A (fr) |
| IT (1) | IT1214395B (fr) |
| NO (1) | NO844985L (fr) |
| WO (1) | WO1984004334A1 (fr) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3539981C1 (de) * | 1985-11-11 | 1987-06-11 | Telog Systems Gmbh | Verfahren und Vorrichtung zur Behandlung von Halbleitermaterialien |
| JP2733535B2 (ja) * | 1988-06-24 | 1998-03-30 | 株式会社リコー | 半導体薄膜気相成長装置 |
| US5510146A (en) * | 1991-07-16 | 1996-04-23 | Seiko Epson Corporation | CVD apparatus, method of forming semiconductor film, and method of fabricating thin-film semiconductor device |
| US6066204A (en) * | 1997-01-08 | 2000-05-23 | Bandwidth Semiconductor, Llc | High pressure MOCVD reactor system |
| US7344584B2 (en) * | 2004-09-03 | 2008-03-18 | Inco Limited | Process for producing metal powders |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR1398758A (fr) * | 1963-11-13 | 1965-05-14 | Texas Instruments Inc | Procédé et appareil de croissance épitaxiale pour la fabrication de semi-conducteurs |
| FR1462335A (fr) * | 1965-10-16 | 1966-04-15 | Philips Nv | Procédé d'application de couches d'oxyde d'étain sur des dispositifs supports |
| US3607378A (en) * | 1969-10-27 | 1971-09-21 | Texas Instruments Inc | Technique for depositing silicon dioxide from silane and oxygen |
| DE2846160A1 (de) * | 1978-10-24 | 1980-05-08 | Kernforschungsanlage Juelich | Wirbelschichtreaktor mit offenem reaktionsgaszutritt und verfahren zur laminar-durchflussteigerung |
| JPS5673694A (en) * | 1979-11-14 | 1981-06-18 | Fujitsu Ltd | Vertical type vapor phase growing method and apparatus |
-
1983
- 1983-07-22 WO PCT/US1983/001139 patent/WO1984004334A1/fr not_active Ceased
- 1983-07-22 DE DE8383902562T patent/DE3367627D1/de not_active Expired
- 1983-07-22 EP EP83902562A patent/EP0142495B1/fr not_active Expired
- 1983-07-22 JP JP58502621A patent/JPS60501234A/ja active Granted
-
1984
- 1984-03-27 IL IL71376A patent/IL71376A/xx not_active IP Right Cessation
- 1984-04-27 IT IT8448099A patent/IT1214395B/it active
- 1984-04-27 CA CA000453058A patent/CA1209330A/fr not_active Expired
- 1984-04-28 KR KR1019840002280A patent/KR900001658B1/ko not_active Expired
- 1984-12-12 NO NO844985A patent/NO844985L/no unknown
Also Published As
| Publication number | Publication date |
|---|---|
| IT8448099A0 (it) | 1984-04-27 |
| EP0142495B1 (fr) | 1986-11-12 |
| WO1984004334A1 (fr) | 1984-11-08 |
| EP0142495A1 (fr) | 1985-05-29 |
| IT1214395B (it) | 1990-01-18 |
| KR900001658B1 (ko) | 1990-03-17 |
| JPS60501234A (ja) | 1985-08-01 |
| DE3367627D1 (en) | 1987-01-02 |
| KR840009176A (ko) | 1984-12-24 |
| CA1209330A (fr) | 1986-08-12 |
| JPH0231490B2 (fr) | 1990-07-13 |
| IL71376A (en) | 1987-12-20 |
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