NO894328L - Fremgangsmaate og anordning for kjoeling av elektroniske komponenter. - Google Patents
Fremgangsmaate og anordning for kjoeling av elektroniske komponenter.Info
- Publication number
- NO894328L NO894328L NO89894328A NO894328A NO894328L NO 894328 L NO894328 L NO 894328L NO 89894328 A NO89894328 A NO 89894328A NO 894328 A NO894328 A NO 894328A NO 894328 L NO894328 L NO 894328L
- Authority
- NO
- Norway
- Prior art keywords
- procedure
- electronic components
- cooling electronic
- cooling
- components
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
- H10W40/73—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control for cooling by change of state
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| NO89894328A NO894328L (no) | 1989-10-30 | 1989-10-30 | Fremgangsmaate og anordning for kjoeling av elektroniske komponenter. |
| PCT/NO1990/000160 WO1991006958A1 (en) | 1989-10-30 | 1990-10-26 | A method and a means for cooling electronic components |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| NO89894328A NO894328L (no) | 1989-10-30 | 1989-10-30 | Fremgangsmaate og anordning for kjoeling av elektroniske komponenter. |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| NO894328D0 NO894328D0 (no) | 1989-10-30 |
| NO894328L true NO894328L (no) | 1991-05-02 |
Family
ID=19892523
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| NO89894328A NO894328L (no) | 1989-10-30 | 1989-10-30 | Fremgangsmaate og anordning for kjoeling av elektroniske komponenter. |
Country Status (2)
| Country | Link |
|---|---|
| NO (1) | NO894328L (no) |
| WO (1) | WO1991006958A1 (no) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6222122B1 (en) | 1998-01-13 | 2001-04-24 | Sun Microsystems, Inc. | Sealed liquid-filled module and method of forming same |
| US6935409B1 (en) | 1998-06-08 | 2005-08-30 | Thermotek, Inc. | Cooling apparatus having low profile extrusion |
| US7147045B2 (en) | 1998-06-08 | 2006-12-12 | Thermotek, Inc. | Toroidal low-profile extrusion cooling system and method thereof |
| US7305843B2 (en) | 1999-06-08 | 2007-12-11 | Thermotek, Inc. | Heat pipe connection system and method |
| US6981322B2 (en) | 1999-06-08 | 2006-01-03 | Thermotek, Inc. | Cooling apparatus having low profile extrusion and method of manufacture therefor |
| US9113577B2 (en) | 2001-11-27 | 2015-08-18 | Thermotek, Inc. | Method and system for automotive battery cooling |
| US7198096B2 (en) | 2002-11-26 | 2007-04-03 | Thermotek, Inc. | Stacked low profile cooling system and method for making same |
| GB2411049A (en) * | 2004-01-23 | 2005-08-17 | Jonathan David Cadd | Specific heat capacity heatsink for electronics |
| GB2467805C (en) * | 2009-05-12 | 2011-06-01 | Iceotope Ltd | Cooled electronic system |
| US8369090B2 (en) | 2009-05-12 | 2013-02-05 | Iceotope Limited | Cooled electronic system |
| CN103996664B (zh) * | 2014-05-30 | 2016-08-24 | 佐志温控技术(上海)有限公司 | 一种防反二极管的液体强制冷却装置 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4138692A (en) * | 1977-09-12 | 1979-02-06 | International Business Machines Corporation | Gas encapsulated cooling module |
| US4203129A (en) * | 1978-07-11 | 1980-05-13 | International Business Machines Corporation | Bubble generating tunnels for cooling semiconductor devices |
| CA1230184A (en) * | 1983-11-29 | 1987-12-08 | Toshiyuki Saito | Liquid cooling type high frequency solid state device |
| DE3778304D1 (de) * | 1986-10-29 | 1992-05-21 | Bbc Brown Boveri & Cie | Vorrichtung zur kuehlung von halbleiterbauelementen. |
-
1989
- 1989-10-30 NO NO89894328A patent/NO894328L/no unknown
-
1990
- 1990-10-26 WO PCT/NO1990/000160 patent/WO1991006958A1/en not_active Ceased
Also Published As
| Publication number | Publication date |
|---|---|
| WO1991006958A1 (en) | 1991-05-16 |
| NO894328D0 (no) | 1989-10-30 |
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