NO930970L - Halvleder-kondensator og mikrofonanordninger - Google Patents

Halvleder-kondensator og mikrofonanordninger

Info

Publication number
NO930970L
NO930970L NO93930970A NO930970A NO930970L NO 930970 L NO930970 L NO 930970L NO 93930970 A NO93930970 A NO 93930970A NO 930970 A NO930970 A NO 930970A NO 930970 L NO930970 L NO 930970L
Authority
NO
Norway
Prior art keywords
capacitor
diaphragm
condensor
semiconductor
constituting
Prior art date
Application number
NO93930970A
Other languages
English (en)
Other versions
NO930970D0 (no
Inventor
Peter V Loeppert
Original Assignee
Monolithic Sensors Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Monolithic Sensors Inc filed Critical Monolithic Sensors Inc
Publication of NO930970D0 publication Critical patent/NO930970D0/no
Publication of NO930970L publication Critical patent/NO930970L/no

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
    • B81B3/0064—Constitution or structural means for improving or controlling the physical properties of a device
    • B81B3/0067—Mechanical properties
    • B81B3/0072—For controlling internal stress or strain in moving or flexible elements, e.g. stress compensating layers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01H—MEASUREMENT OF MECHANICAL VIBRATIONS OR ULTRASONIC, SONIC OR INFRASONIC WAVES
    • G01H11/00—Measuring mechanical vibrations or ultrasonic, sonic or infrasonic waves by detecting changes in electric or magnetic properties
    • G01H11/06—Measuring mechanical vibrations or ultrasonic, sonic or infrasonic waves by detecting changes in electric or magnetic properties by electric means
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/04—Microphones
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/02—Sensors
    • B81B2201/0257—Microphones or microspeakers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R25/00—Electric hearing aids
    • H04R25/60—Mounting or interconnection of hearing aid parts, e.g. inside tips, housings or to ossicles
    • H04R25/604—Mounting or interconnection of hearing aid parts, e.g. inside tips, housings or to ossicles of acoustic or vibrational transducers

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)

Abstract

Det er frembragt en kompakt miniatyrkondensator og kon- densatormikrofon med god sensitivitet. Den omfatter en fast perforert bakplate som utgjør en fast elektrode i en paral- lellkondensator, følsom for innfallende lydtrykkbølge, og som utgjcr en bevegbar plate i parallellplate-kondensatoren, inn- retning for å posisjonere membranen i forhold til bakplaten uten å påtrykke vesentlig spenning på membranen, og FET- kretser som tilveiebringer et utgangssignal som er proporsjo- nalt i kapasitet til kondensatoren når membranen beveger seg i forhold til bakplaten.
NO93930970A 1992-03-18 1993-03-17 Halvleder-kondensator og mikrofonanordninger NO930970L (no)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US85348892A 1992-03-18 1992-03-18

Publications (2)

Publication Number Publication Date
NO930970D0 NO930970D0 (no) 1993-03-17
NO930970L true NO930970L (no) 1993-09-20

Family

ID=25316164

Family Applications (1)

Application Number Title Priority Date Filing Date
NO93930970A NO930970L (no) 1992-03-18 1993-03-17 Halvleder-kondensator og mikrofonanordninger

Country Status (8)

Country Link
EP (1) EP0561566B1 (no)
JP (1) JP3451593B2 (no)
AU (1) AU659290B2 (no)
CA (1) CA2092627A1 (no)
DE (1) DE69325732T2 (no)
DK (1) DK0561566T3 (no)
FI (1) FI931183L (no)
NO (1) NO930970L (no)

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US5573679A (en) * 1995-06-19 1996-11-12 Alberta Microelectronic Centre Fabrication of a surface micromachined capacitive microphone using a dry-etch process
NL1001733C2 (nl) * 1995-11-23 1997-05-27 Stichting Tech Wetenschapp Stelsel van een substraat en een opnemer.
US5870482A (en) * 1997-02-25 1999-02-09 Knowles Electronics, Inc. Miniature silicon condenser microphone
JP2000022172A (ja) * 1998-06-30 2000-01-21 Matsushita Electric Ind Co Ltd 変換装置及びその製造方法
US6088463A (en) 1998-10-30 2000-07-11 Microtronic A/S Solid state silicon-based condenser microphone
EP1063866B1 (en) * 1999-05-28 2008-11-26 Texas Instruments Inc. Digital loudspeaker
US6732588B1 (en) * 1999-09-07 2004-05-11 Sonionmems A/S Pressure transducer
AU6984000A (en) * 1999-09-06 2001-04-10 ROMBACH, Pirmin, Hernann, Otto A pressure transducer
US6522762B1 (en) 1999-09-07 2003-02-18 Microtronic A/S Silicon-based sensor system
JP3611779B2 (ja) * 1999-12-09 2005-01-19 シャープ株式会社 電気信号−音響信号変換器及びその製造方法並びに電気信号−音響変換装置
JP4338395B2 (ja) * 2000-08-11 2009-10-07 ノールズ エレクトロニクス，リミテッド ライアビリティ カンパニー 小型ブロードバンド変換器
EP1206160A1 (en) * 2000-11-09 2002-05-15 Texas Instruments Incorporated Digital loudspeaker
JP2002345088A (ja) * 2001-05-18 2002-11-29 Mitsubishi Electric Corp 圧力感応装置及びこれに用いられる半導体基板の製造方法
US6859542B2 (en) 2001-05-31 2005-02-22 Sonion Lyngby A/S Method of providing a hydrophobic layer and a condenser microphone having such a layer
US7065224B2 (en) 2001-09-28 2006-06-20 Sonionmicrotronic Nederland B.V. Microphone for a hearing aid or listening device with improved internal damping and foreign material protection
US7253016B2 (en) 2002-05-15 2007-08-07 Infineon Technologies Ag Micromechanical capacitive transducer and method for producing the same
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US7142682B2 (en) 2002-12-20 2006-11-28 Sonion Mems A/S Silicon-based transducer for use in hearing instruments and listening devices
JP2004356708A (ja) * 2003-05-27 2004-12-16 Hosiden Corp 音響検出機構及びその製造方法
JP2004356707A (ja) 2003-05-27 2004-12-16 Hosiden Corp 音響検出機構
JP2005039652A (ja) 2003-07-17 2005-02-10 Hosiden Corp 音響検出機構
KR101059364B1 (ko) 2003-11-20 2011-08-24 파나소닉 주식회사 일렉트릿 및 일렉트릿 컨덴서
US7346178B2 (en) * 2004-10-29 2008-03-18 Silicon Matrix Pte. Ltd. Backplateless silicon microphone
US7415121B2 (en) 2004-10-29 2008-08-19 Sonion Nederland B.V. Microphone with internal damping
JP2007104467A (ja) * 2005-10-06 2007-04-19 Micro Precision Kk 音響センサおよびその製造方法
WO2007085017A1 (en) * 2006-01-20 2007-07-26 Analog Devices, Inc. Support apparatus for condenser microphone diaphragm
JP4811035B2 (ja) * 2006-01-31 2011-11-09 パナソニック電工株式会社 音響センサ
JP4737721B2 (ja) * 2006-03-10 2011-08-03 ヤマハ株式会社 コンデンサマイクロホン
JP2007267049A (ja) * 2006-03-29 2007-10-11 Yamaha Corp コンデンサマイクロホン
JP4605470B2 (ja) * 2006-03-31 2011-01-05 ヤマハ株式会社 コンデンサマイクロホン
JP4737719B2 (ja) * 2006-02-24 2011-08-03 ヤマハ株式会社 コンデンサマイクロホン
JP2007228345A (ja) * 2006-02-24 2007-09-06 Yamaha Corp コンデンサマイクロホン
DE102006011545B4 (de) * 2006-03-14 2016-03-17 Robert Bosch Gmbh Mikromechanisches Kombi-Bauelement und entsprechendes Herstellungsverfahren
GB0605576D0 (en) 2006-03-20 2006-04-26 Oligon Ltd MEMS device
JP4966370B2 (ja) * 2006-03-30 2012-07-04 パルス・エムイーエムエス・アンパルトセルスカブ シングルダイ型ｍｅｍｓ音響トランスデューサおよび製造方法
DE102006024668A1 (de) * 2006-05-26 2007-11-29 Robert Bosch Gmbh Mikromechanisches Bauelement und Verfahren zu dessen Herstellung
JP4797829B2 (ja) * 2006-06-26 2011-10-19 ヤマハ株式会社 コンデンサマイクロホン及びコンデンサマイクロホンの製造方法
WO2008010269A1 (en) * 2006-07-19 2008-01-24 Panasonic Electric Works Co., Ltd. System for detecting position of mobile object
JP4936199B2 (ja) * 2006-07-19 2012-05-23 パナソニック株式会社 移動体の位置検出システム
GB2452941B (en) * 2007-09-19 2012-04-11 Wolfson Microelectronics Plc Mems device and process
GB2453104B (en) * 2007-09-19 2012-04-25 Wolfson Microelectronics Plc Mems device and process
TWI365525B (en) * 2007-12-24 2012-06-01 Ind Tech Res Inst An ultra thin package for a sensor chip of a micro electro mechanical system
JP5721452B2 (ja) 2011-01-27 2015-05-20 ローム株式会社 静電容量型ｍｅｍｓセンサ
EP2679024B1 (en) * 2011-02-25 2020-01-08 Nokia Technologies Oy A transducer apparatus with a tension actuator
DE102011016934A1 (de) * 2011-04-13 2012-10-18 Epcos Ag MEMS-Sensor
KR101379680B1 (ko) * 2012-05-09 2014-04-01 이화여자대학교 산학협력단 듀얼 백플레이트를 갖는 ｍｅｍｓ 마이크로폰 및 제조방법
DE102013201795A1 (de) * 2013-02-05 2014-08-07 Robert Bosch Gmbh Mikromechanisches Bauelement mit einer Membranstruktur
CN105263851B (zh) * 2013-05-31 2017-10-13 罗伯特·博世有限公司 被限位的膜
DE102013212173B4 (de) * 2013-06-26 2016-06-02 Robert Bosch Gmbh MEMS-Bauelement mit einer auslenkbaren Membran und einem feststehenden Gegenelement sowie Verfahren zu dessen Herstellung
DE102014108984B4 (de) 2014-06-26 2017-04-06 Tdk Corporation Wandlerelement
US9745188B1 (en) 2016-02-26 2017-08-29 Infineon Technologies Ag Microelectromechanical device and method for forming a microelectromechanical device
US9856134B2 (en) 2016-02-26 2018-01-02 Infineon Technologies Ag Microelectromechanical system and a method of manufacturing a microelectromechanical system
DE102016210444A1 (de) * 2016-06-13 2017-12-14 Robert Bosch Gmbh Mikroelektromechanisches Mikrofon
CZ308267B6 (cs) * 2019-02-13 2020-04-01 ÄŚeskĂ© vysokĂ© uÄŤenĂ­ technickĂ© v Praze Miniaturní snímač akustického tlaku v kapalinách a plynech

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AU5817473A (en) * 1973-07-17 1975-01-23 Detlef Fischer Directional microphone
NL7313455A (nl) * 1973-10-01 1975-04-03 Philips Nv Mikrofoon met elektrostatische capsule.
SE428081B (sv) * 1981-10-07 1983-05-30 Ericsson Telefon Ab L M Tilledningsram for en elektretmikrofon
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JPH0748564B2 (ja) * 1988-05-07 1995-05-24 シャープ株式会社 シリコンマイクロセンサ
JP2681207B2 (ja) * 1989-02-01 1997-11-26 株式会社 オーディオテクニカ 静電型電気音響変換器の振動板
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Also Published As

Publication number Publication date
DE69325732D1 (de) 1999-09-02
DK0561566T3 (da) 2000-03-27
CA2092627A1 (en) 1993-09-19
JPH0750899A (ja) 1995-02-21
EP0561566A2 (en) 1993-09-22
DE69325732T2 (de) 2000-04-27
EP0561566A3 (en) 1994-12-14
FI931183A0 (fi) 1993-03-17
EP0561566B1 (en) 1999-07-28
FI931183A7 (fi) 1993-09-19
FI931183L (fi) 1993-09-19
NO930970D0 (no) 1993-03-17
AU3526093A (en) 1993-09-23
JP3451593B2 (ja) 2003-09-29
AU659290B2 (en) 1995-05-11

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Legal Events

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FC2A Withdrawal, rejection or dismissal of laid open patent application