NO940463L - Fremgangsmåte og innretning for stabling av substrater, som skal forbindes med hverandre ved hjelp av adhesjonsbinding - Google Patents

Fremgangsmåte og innretning for stabling av substrater, som skal forbindes med hverandre ved hjelp av adhesjonsbinding

Info

Publication number
NO940463L
NO940463L NO940463A NO940463A NO940463L NO 940463 L NO940463 L NO 940463L NO 940463 A NO940463 A NO 940463A NO 940463 A NO940463 A NO 940463A NO 940463 L NO940463 L NO 940463L
Authority
NO
Norway
Prior art keywords
bonded
adhesion bonding
stacking substrates
substrates
stacking
Prior art date
Application number
NO940463A
Other languages
English (en)
Other versions
NO940463D0 (no
NO307437B1 (no
Inventor
Horst Plankenhorn
Thomas Lindner
Original Assignee
Mannesmann Kienzle Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mannesmann Kienzle Gmbh filed Critical Mannesmann Kienzle Gmbh
Publication of NO940463L publication Critical patent/NO940463L/no
Publication of NO940463D0 publication Critical patent/NO940463D0/no
Publication of NO307437B1 publication Critical patent/NO307437B1/no

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
    • B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
    • B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
    • B32B17/10005—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing
    • B32B17/10807—Making laminated safety glass or glazing; Apparatus therefor
    • B32B17/1088—Making laminated safety glass or glazing; Apparatus therefor by superposing a plurality of layered products
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/17—Surface bonding means and/or assemblymeans with work feeding or handling means
    • Y10T156/1702—For plural parts or plural areas of single part
    • Y10T156/1744—Means bringing discrete articles into assembled relationship

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Pressure Sensors (AREA)
  • Stacking Of Articles And Auxiliary Devices (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Laminated Bodies (AREA)
  • Recrystallisation Techniques (AREA)
NO940463A 1992-06-17 1994-02-10 Fremgangsmåte og innretning for stabling av substrater, som skal forbindes med hverandre ved hjelp av binding NO307437B1 (no)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE4219774A DE4219774C1 (de) 1992-06-17 1992-06-17 Verfahren und Vorrichtung zum Stapeln von Substraten, die durch Bonden miteinander zu verbinden sind
PCT/EP1993/001480 WO1993026040A1 (de) 1992-06-17 1993-06-11 Verfahren und vorrichtung zum stapeln von substraten, die durch bonden miteinander zu verbinden sind

Publications (3)

Publication Number Publication Date
NO940463L true NO940463L (no) 1994-02-10
NO940463D0 NO940463D0 (no) 1994-02-10
NO307437B1 NO307437B1 (no) 2000-04-03

Family

ID=6461179

Family Applications (1)

Application Number Title Priority Date Filing Date
NO940463A NO307437B1 (no) 1992-06-17 1994-02-10 Fremgangsmåte og innretning for stabling av substrater, som skal forbindes med hverandre ved hjelp av binding

Country Status (9)

Country Link
US (1) US6168678B1 (no)
EP (1) EP0605679B1 (no)
JP (1) JP2515490B2 (no)
AT (1) ATE163800T1 (no)
CZ (1) CZ283025B6 (no)
DE (1) DE4219774C1 (no)
FI (1) FI940722A7 (no)
NO (1) NO307437B1 (no)
WO (1) WO1993026040A1 (no)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4428808C2 (de) * 1994-08-13 2003-07-17 Bosch Gmbh Robert Verfahren zur Herstellung eines Bauelementes nach dem Anodic-Bonding-Verfahren und Bauelement
DE19755088A1 (de) * 1997-12-11 1999-06-17 Daimler Chrysler Ag Kalibriervorrichtung zum Verkleben von Scheiben
US7192841B2 (en) 2002-04-30 2007-03-20 Agency For Science, Technology And Research Method of wafer/substrate bonding
DE10230373B3 (de) * 2002-07-05 2004-03-04 Süss Microtec Lithography Gmbh Vorrichtung und Verfahren zum Bonden eines Stapels aus drei oder mehr scheibenförmigen Substraten, insbesondere eines 3-Wafer-Stacks
KR100475716B1 (ko) * 2002-08-13 2005-03-10 매그나칩 반도체 유한회사 복합 반도체 장치의 멀티 반도체 기판의 적층 구조 및 그방법
US7361593B2 (en) * 2002-12-17 2008-04-22 Finisar Corporation Methods of forming vias in multilayer substrates
US7259466B2 (en) * 2002-12-17 2007-08-21 Finisar Corporation Low temperature bonding of multilayer substrates
EP2221865B1 (en) * 2004-01-07 2019-05-22 Nikon Corporation Stacking apparatus and method for stacking a plurality of wafers
US20070188757A1 (en) * 2006-02-14 2007-08-16 Jeffrey Michael Amsden Method of sealing a glass envelope
US20070246450A1 (en) * 2006-04-21 2007-10-25 Cady Raymond C High temperature anodic bonding apparatus
KR101484348B1 (ko) * 2007-08-10 2015-01-19 가부시키가이샤 니콘 기판접합장치 및 기판접합방법

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3982979A (en) * 1973-06-28 1976-09-28 Western Electric Company, Inc. Methods for mounting an article on an adherent site on a substrate
US4062462A (en) * 1973-11-09 1977-12-13 Western Electric Co., Inc. Method for orienting an article
JPS5516228A (en) 1978-07-21 1980-02-04 Hitachi Ltd Capacity type sensor
US4322980A (en) * 1979-11-08 1982-04-06 Hitachi, Ltd. Semiconductor pressure sensor having plural pressure sensitive diaphragms and method
DE3116634A1 (de) * 1981-04-27 1982-11-11 Karl Süss KG, Präzisionsgeräte für Wissenschaft und Industrie - GmbH & Co, 8046 Garching Vorrichtung zum automatischen justieren von ebenen gegenstaenden mit zwei bezugspunkten, insbesondere bei der herstellung von halbleiterbauelementen
US4490111A (en) * 1982-09-23 1984-12-25 California Linear Circuits, Inc. Apparatus for making stacked high voltage rectifiers
US4795518A (en) * 1984-02-17 1989-01-03 Burr-Brown Corporation Method using a multiple device vacuum chuck for an automatic microelectronic bonding apparatus
US4669866A (en) * 1985-01-28 1987-06-02 Phillips Edward H Step-and-repeat alignment and exposure system and method therefore
US4938654A (en) 1985-05-17 1990-07-03 Schram Richard R Automated wafer inspection system
GB2194500B (en) * 1986-07-04 1991-01-23 Canon Kk A wafer handling apparatus
DE3640616A1 (de) * 1986-11-27 1988-06-09 Standard Elektrik Lorenz Ag Justiervorrichtung
US5062149A (en) * 1987-10-23 1991-10-29 General Dynamics Corporation Millimeter wave device and method of making
US4899921A (en) * 1988-10-28 1990-02-13 The American Optical Corporation Aligner bonder
US4984731A (en) * 1989-10-05 1991-01-15 Matsushita Electric Industrial Co., Ltd. Method of packaging electronic component parts using a eutectic die bonder
US5079070A (en) * 1990-10-11 1992-01-07 International Business Machines Corporation Repair of open defects in thin film conductors
JP2648638B2 (ja) * 1990-11-30 1997-09-03 三菱マテリアル株式会社 ウェーハの接着方法およびその装置

Also Published As

Publication number Publication date
FI940722A0 (fi) 1994-02-16
NO940463D0 (no) 1994-02-10
JPH06510639A (ja) 1994-11-24
JP2515490B2 (ja) 1996-07-10
EP0605679A1 (de) 1994-07-13
CZ283025B6 (cs) 1997-12-17
DE4219774C1 (de) 1994-01-27
US6168678B1 (en) 2001-01-02
FI940722L (fi) 1994-02-16
EP0605679B1 (de) 1998-03-04
CZ57694A3 (en) 1994-12-15
FI940722A7 (fi) 1994-02-16
NO307437B1 (no) 2000-04-03
WO1993026040A1 (de) 1993-12-23
ATE163800T1 (de) 1998-03-15

Similar Documents

Publication Publication Date Title
NO940463L (no) Fremgangsmåte og innretning for stabling av substrater, som skal forbindes med hverandre ved hjelp av adhesjonsbinding
TW349233B (en) Pre-bond cavity air bridge
TW329024B (en) Bonded wafer
CA2534385A1 (en) Process for the surface finishing of materials via application in particular of transparent layers based on polymethacrylates
ATE66094T1 (de) Verfahren und verbindungswerkstoff zum metallischen verbinden von bauteilen.
TW200507232A (en) Bonding method and bonding device
FI875153A7 (fi) Menetelmä kerrosten, kuten alustoilla olevien pintakerrosten paksuuden säätämiseksi ja/tai mittaamiseksi.
ATE465512T1 (de) Vorrichtung und verfahren zum verbinden von wafern
EP0278685A3 (en) Polymer laminates employing photocurable adhesives and process for bonding fluoropolymers to substrates
SG167651A1 (en) Laminated glass, and method and apparatus for manufacturing the same
JPS6417455A (en) Semiconductor device
DE59104278D1 (de) Verfahren zur Vorbereitung einer Substratoberfläche für die Verklebung mit ativierbaren Klebstoffen durch Aufbringen einer einen Aktivator enthaltenden Schicht auf die Substatoberfläche.
ATE337380T1 (de) Verfahren zum kleben von substraten unter verwendung einer uv-aktivierbaren klebfolie, sowie eine uv- bestrahlungsvorrichtung.
WO1997006205A3 (en) Joining of polyolefin articles
FR2376199A1 (fr) Procede et dispositif pour accelerer le durcissement d'elements colles par des colles a durcissement cristallin
ATE464620T1 (de) Verbundmaterialeinheiten mit transponder
GB1272642A (en) Method and apparatus for fastening articles
ATE54615T1 (de) Verfahren zum herstellen eines verbundelementes.
FI905991A7 (fi) Lateksiliima alustoja varten, menetelmä alustojen ja laminaattien liim aamiseksi
DK1129044T3 (da) Fremgangsmåde til overtrækning og fremgangsmåde til binding
JPS5752137A (en) Bonding method for work in lapping and polishing
TW200633082A (en) Chip bonding process
SE0102925D0 (sv) Adhesive sacrificial bonding of spatial light modulators
DE60004366D1 (de) Vorrichtung und verfahren zum verkleben von holzstreifen zur herstellung von holzverbundblöcken
DE602005018351D1 (de) Eichermediums

Legal Events

Date Code Title Description
MM1K Lapsed by not paying the annual fees

Free format text: LAPSED IN DECEMBER 2001