|
US5872632A
(en)
*
|
1996-02-02 |
1999-02-16 |
Moore Epitaxial, Inc. |
Cluster tool layer thickness measurement apparatus
|
|
EP0902874B1
(en)
*
|
1996-05-31 |
2004-01-28 |
Tropel Corporation |
Interferometer for measuring thickness variations of semiconductor wafers
|
|
US5953578A
(en)
*
|
1998-09-08 |
1999-09-14 |
Winbond Electronics Corp. |
Global planarization method using plasma etching
|
|
US6284986B1
(en)
|
1999-03-15 |
2001-09-04 |
Seh America, Inc. |
Method of determining the thickness of a layer on a silicon substrate
|
|
US6286685B1
(en)
|
1999-03-15 |
2001-09-11 |
Seh America, Inc. |
System and method for wafer thickness sorting
|
|
US6195168B1
(en)
*
|
1999-07-22 |
2001-02-27 |
Zygo Corporation |
Infrared scanning interferometry apparatus and method
|
|
CN1696826A
(zh)
*
|
2000-08-01 |
2005-11-16 |
得克萨斯州大学系统董事会 |
用对激活光透明的模板在衬底上形成图案的方法及半导体器件
|
|
US6633391B1
(en)
|
2000-11-07 |
2003-10-14 |
Applied Materials, Inc |
Monitoring of film characteristics during plasma-based semi-conductor processing using optical emission spectroscopy
|
|
US6603538B1
(en)
|
2000-11-21 |
2003-08-05 |
Applied Materials, Inc. |
Method and apparatus employing optical emission spectroscopy to detect a fault in process conditions of a semiconductor processing system
|
|
US7510664B2
(en)
|
2001-01-30 |
2009-03-31 |
Rapt Industries, Inc. |
Apparatus and method for atmospheric pressure reactive atom plasma processing for shaping of damage free surfaces
|
|
US7591957B2
(en)
*
|
2001-01-30 |
2009-09-22 |
Rapt Industries, Inc. |
Method for atmospheric pressure reactive atom plasma processing for surface modification
|
|
EP1430270A4
(en)
*
|
2001-09-21 |
2006-10-25 |
Kmac |
METHOD AND DEVICE FOR MEASURING THE THICK PROFILE AND THE DISTRIBUTION OF THIN FILM MULTI-LAYER REFRACTIVE INDICES BY TWO-DIMENSIONAL REFLECTOMETRY
|
|
US6660177B2
(en)
|
2001-11-07 |
2003-12-09 |
Rapt Industries Inc. |
Apparatus and method for reactive atom plasma processing for material deposition
|
|
US20080011332A1
(en)
*
|
2002-04-26 |
2008-01-17 |
Accretech Usa, Inc. |
Method and apparatus for cleaning a wafer substrate
|
|
US20080190558A1
(en)
*
|
2002-04-26 |
2008-08-14 |
Accretech Usa, Inc. |
Wafer processing apparatus and method
|
|
US20080017316A1
(en)
*
|
2002-04-26 |
2008-01-24 |
Accretech Usa, Inc. |
Clean ignition system for wafer substrate processing
|
|
US7869057B2
(en)
*
|
2002-09-09 |
2011-01-11 |
Zygo Corporation |
Multiple-angle multiple-wavelength interferometer using high-NA imaging and spectral analysis
|
|
DE10393244B4
(de)
*
|
2002-09-09 |
2017-09-21 |
Zygo Corp. |
Interferometrisches Verfahren für ellipsometrische, reflektometrische und streulichtanalytische Messungen, einschließlich der Charakterisierung von Dünnfilmstrukturen
|
|
US7139081B2
(en)
|
2002-09-09 |
2006-11-21 |
Zygo Corporation |
Interferometry method for ellipsometry, reflectometry, and scatterometry measurements, including characterization of thin film structures
|
|
US8349241B2
(en)
*
|
2002-10-04 |
2013-01-08 |
Molecular Imprints, Inc. |
Method to arrange features on a substrate to replicate features having minimal dimensional variability
|
|
US7068375B2
(en)
*
|
2003-01-23 |
2006-06-27 |
Ut-Battelle Llc |
Direct-to-digital holography reduction of reference hologram noise and fourier space smearing
|
|
WO2004079295A2
(en)
|
2003-03-06 |
2004-09-16 |
Zygo Corporation |
Profiling complex surface structures using scanning interferometry
|
|
US7324214B2
(en)
|
2003-03-06 |
2008-01-29 |
Zygo Corporation |
Interferometer and method for measuring characteristics of optically unresolved surface features
|
|
US7106454B2
(en)
|
2003-03-06 |
2006-09-12 |
Zygo Corporation |
Profiling complex surface structures using scanning interferometry
|
|
US7271918B2
(en)
|
2003-03-06 |
2007-09-18 |
Zygo Corporation |
Profiling complex surface structures using scanning interferometry
|
|
US7371992B2
(en)
|
2003-03-07 |
2008-05-13 |
Rapt Industries, Inc. |
Method for non-contact cleaning of a surface
|
|
WO2004084279A1
(en)
*
|
2003-03-14 |
2004-09-30 |
Midwest Research Institute |
Wafer characteristics via reflectometry
|
|
KR100947228B1
(ko)
*
|
2003-06-20 |
2010-03-11 |
엘지전자 주식회사 |
광디스크의 두께 측정 방법
|
|
US7297892B2
(en)
*
|
2003-08-14 |
2007-11-20 |
Rapt Industries, Inc. |
Systems and methods for laser-assisted plasma processing
|
|
US7304263B2
(en)
*
|
2003-08-14 |
2007-12-04 |
Rapt Industries, Inc. |
Systems and methods utilizing an aperture with a reactive atom plasma torch
|
|
WO2005029193A2
(en)
|
2003-09-15 |
2005-03-31 |
Zygo Corporation |
Interferometric analysis of surfaces.
|
|
TWI335417B
(en)
|
2003-10-27 |
2011-01-01 |
Zygo Corp |
Method and apparatus for thin film measurement
|
|
CA2559324A1
(en)
*
|
2004-03-11 |
2005-09-22 |
Nano-Or Technologies (Israel) Ltd. |
Methods and apparatus for wavefront manipulations and improved 3-d measurements
|
|
US7142311B2
(en)
*
|
2004-05-18 |
2006-11-28 |
Zygo Corporation |
Methods and systems for determining optical properties using low-coherence interference signals
|
|
US20060012582A1
(en)
*
|
2004-07-15 |
2006-01-19 |
De Lega Xavier C |
Transparent film measurements
|
|
US7785526B2
(en)
*
|
2004-07-20 |
2010-08-31 |
Molecular Imprints, Inc. |
Imprint alignment method, system, and template
|
|
US7630067B2
(en)
|
2004-11-30 |
2009-12-08 |
Molecular Imprints, Inc. |
Interferometric analysis method for the manufacture of nano-scale devices
|
|
US20070231421A1
(en)
*
|
2006-04-03 |
2007-10-04 |
Molecular Imprints, Inc. |
Enhanced Multi Channel Alignment
|
|
EP1853874B1
(en)
|
2005-01-20 |
2009-09-02 |
Zygo Corporation |
Interferometer for determining characteristics of an object surface
|
|
US7884947B2
(en)
*
|
2005-01-20 |
2011-02-08 |
Zygo Corporation |
Interferometry for determining characteristics of an object surface, with spatially coherent illumination
|
|
US7193214B1
(en)
*
|
2005-04-08 |
2007-03-20 |
The United States Of America As Represented By The Secretary Of The Army |
Sensor having differential polarization and a network comprised of several such sensors
|
|
TWI394930B
(zh)
|
2005-05-19 |
2013-05-01 |
Zygo Corp |
取得薄膜結構資訊之低同調干涉信號的分析方法及裝置
|
|
US7636168B2
(en)
*
|
2005-10-11 |
2009-12-22 |
Zygo Corporation |
Interferometry method and system including spectral decomposition
|
|
WO2008011510A2
(en)
*
|
2006-07-21 |
2008-01-24 |
Zygo Corporation |
Compensation of systematic effects in low coherence interferometry
|
|
US7924435B2
(en)
*
|
2006-12-22 |
2011-04-12 |
Zygo Corporation |
Apparatus and method for measuring characteristics of surface features
|
|
US7889355B2
(en)
*
|
2007-01-31 |
2011-02-15 |
Zygo Corporation |
Interferometry for lateral metrology
|
|
US7619746B2
(en)
*
|
2007-07-19 |
2009-11-17 |
Zygo Corporation |
Generating model signals for interferometry
|
|
US8072611B2
(en)
*
|
2007-10-12 |
2011-12-06 |
Zygo Corporation |
Interferometric analysis of under-resolved features
|
|
KR101274517B1
(ko)
*
|
2007-11-13 |
2013-06-13 |
지고 코포레이션 |
편광 스캐닝을 이용한 간섭계
|
|
JP5290322B2
(ja)
*
|
2007-12-14 |
2013-09-18 |
ザイゴ コーポレーション |
走査干渉法を使用した表面構造の解析
|
|
US8120781B2
(en)
*
|
2008-11-26 |
2012-02-21 |
Zygo Corporation |
Interferometric systems and methods featuring spectral analysis of unevenly sampled data
|
|
US8603839B2
(en)
|
2010-07-23 |
2013-12-10 |
First Solar, Inc. |
In-line metrology system
|
|
US8860937B1
(en)
|
2012-10-24 |
2014-10-14 |
Kla-Tencor Corp. |
Metrology systems and methods for high aspect ratio and large lateral dimension structures
|
|
US8912495B2
(en)
*
|
2012-11-21 |
2014-12-16 |
Kla-Tencor Corp. |
Multi-spectral defect inspection for 3D wafers
|
|
US9341580B2
(en)
|
2014-06-27 |
2016-05-17 |
Applied Materials, Inc. |
Linear inspection system
|
|
DE102024117232A1
(de)
|
2024-06-19 |
2025-12-24 |
Hamm Ag |
Bedienstandsystem für eine Arbeitsmaschine
|
|
CN121443037B
(zh)
*
|
2025-12-31 |
2026-04-17 |
上海车仪田科技有限公司 |
半导体晶圆薄膜厚度的检测方法、装置和系统
|