NO943603L - Sealed box for microcomponents and method of encapsulation in such a box - Google Patents

Sealed box for microcomponents and method of encapsulation in such a box

Info

Publication number
NO943603L
NO943603L NO943603A NO943603A NO943603L NO 943603 L NO943603 L NO 943603L NO 943603 A NO943603 A NO 943603A NO 943603 A NO943603 A NO 943603A NO 943603 L NO943603 L NO 943603L
Authority
NO
Norway
Prior art keywords
box
container
microcomponents
encapsulation
microcomponent
Prior art date
Application number
NO943603A
Other languages
Norwegian (no)
Other versions
NO943603D0 (en
Inventor
Jean-Pierre Cointrel
Original Assignee
Sagem
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sagem filed Critical Sagem
Publication of NO943603D0 publication Critical patent/NO943603D0/en
Publication of NO943603L publication Critical patent/NO943603L/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P1/00—Details of instruments
    • G01P1/02—Housings
    • G01P1/023—Housings for acceleration measuring devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/15—Containers comprising an insulating or insulated base
    • H10W76/157—Containers comprising an insulating or insulated base having interconnections parallel to the insulating or insulated base
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/60—Seals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5445—Dispositions of bond wires being orthogonal to a side surface of the chip, e.g. parallel arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5524—Materials of bond wires comprising metals or metalloids, e.g. silver comprising aluminium [Al]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H10W72/932—Plan-view shape, i.e. in top view
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Connector Housings Or Holding Contact Members (AREA)
  • Glass Compositions (AREA)
  • Infusion, Injection, And Reservoir Apparatuses (AREA)
  • Micromachines (AREA)

Abstract

En tett boks som kan oppta aktive eller passive mikrokomponenter omfatter en beholder (10) av termo- plastisk eller termoherdbart materiale, støpt på elektriske utgangskontakter (14,20) fra mikrokomponent- en (18), samt et lokk som danner beholderen og sammen med denne danner et hulrom. Inneholdende et fluid, for opptak av mikrokomponenten. Beholdermaterialet blir likeledes støpt på en metallisk krone (12) og lokket (22) er av metall. Dette festes på tett måte på kronen ved lodding, sveising eller liming.A sealed box capable of accommodating active or passive microcomponents comprises a container (10) of thermoplastic or thermosettable material, cast on electrical output contacts (14,20) from the microcomponent (18), and a lid forming the container and together with this forms a cavity. Containing a fluid, for uptake of the microcomponent. The container material is likewise cast on a metallic crown (12) and the lid (22) is of metal. This is tightly secured to the crown by soldering, welding or gluing.

NO943603A 1993-09-29 1994-09-28 Sealed box for microcomponents and method of encapsulation in such a box NO943603L (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR9311587A FR2710810B1 (en) 1993-09-29 1993-09-29 Waterproof micro-component housing and method of encapsulation in such a housing.

Publications (2)

Publication Number Publication Date
NO943603D0 NO943603D0 (en) 1994-09-28
NO943603L true NO943603L (en) 1995-03-30

Family

ID=9451361

Family Applications (1)

Application Number Title Priority Date Filing Date
NO943603A NO943603L (en) 1993-09-29 1994-09-28 Sealed box for microcomponents and method of encapsulation in such a box

Country Status (4)

Country Link
DE (1) DE9415696U1 (en)
FI (1) FI944465L (en)
FR (1) FR2710810B1 (en)
NO (1) NO943603L (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0793859B1 (en) * 1994-11-25 2002-09-11 AMI Doduco GmbH Plastic housing designed to accommodate electronic and/or micromechanical components and into which conductor tracks pass
FR2729253A1 (en) * 1995-01-11 1996-07-12 Sagem HOUSING SENSOR MODULE AND METHOD FOR MANUFACTURING SUCH A MODULE
US5866818A (en) * 1995-11-30 1999-02-02 Matsushita Electric Works, Ltd. Acceleration sensor device
DE102007019096B4 (en) * 2007-04-23 2015-03-12 Continental Automotive Gmbh electronics housing

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL261398A (en) * 1960-03-18 1900-01-01
CA1042116A (en) * 1973-12-03 1978-11-07 John F. Krumme Heat recoverable cap
FR2518812A1 (en) * 1981-12-23 1983-06-24 Cit Alcatel Package for hybrid electronic circuits - is filled with fluorocarbon liq. to withstand high pressures, esp. when immersed at great depth in sea-water
US4675472A (en) * 1986-08-04 1987-06-23 Beta Phase, Inc. Integrated circuit package and seal therefor
NO911774D0 (en) * 1991-05-06 1991-05-06 Sensonor As DEVICE FOR ENCAPLING A FUNCTIONAL ORGANIZATION AND PROCEDURE FOR PRODUCING THE SAME.

Also Published As

Publication number Publication date
FI944465A0 (en) 1994-09-27
FR2710810B1 (en) 1995-12-01
FI944465A7 (en) 1995-03-30
DE9415696U1 (en) 1994-12-15
NO943603D0 (en) 1994-09-28
FR2710810A1 (en) 1995-04-07
FI944465L (en) 1995-03-30

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