NO964367D0 - Elektronikkomponent og dens fremstilling - Google Patents

Elektronikkomponent og dens fremstilling

Info

Publication number
NO964367D0
NO964367D0 NO964367A NO964367A NO964367D0 NO 964367 D0 NO964367 D0 NO 964367D0 NO 964367 A NO964367 A NO 964367A NO 964367 A NO964367 A NO 964367A NO 964367 D0 NO964367 D0 NO 964367D0
Authority
NO
Norway
Prior art keywords
manufacture
electronics component
electronics
component
Prior art date
Application number
NO964367A
Other languages
English (en)
Other versions
NO964367L (no
Inventor
Wilfried Laun
Christian Halsig
Peter Kadvan
Original Assignee
Tele Filter Tft Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tele Filter Tft Gmbh filed Critical Tele Filter Tft Gmbh
Publication of NO964367L publication Critical patent/NO964367L/no
Publication of NO964367D0 publication Critical patent/NO964367D0/no

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W42/00—Arrangements for protection of devices
    • H10W42/20—Arrangements for protection of devices protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/682—Shapes or dispositions thereof comprising holes having chips therein
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07337—Connecting techniques using a polymer adhesive, e.g. an adhesive based on silicone or epoxy
    • H10W72/07339—Connecting techniques using a polymer adhesive, e.g. an adhesive based on silicone or epoxy hardening the adhesive by cooling, e.g. thermoplastics
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
NO964367A 1994-04-15 1996-10-14 Elektronikkomponent og dens fremstilling NO964367D0 (no)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE4413529A DE4413529C2 (de) 1994-04-15 1994-04-15 Verfahren zur Herstellung elektronischer Oberflächenwellenbauelemente sowie ein nach dem Verfahren hergestelltes elektronisches Bauelement
PCT/DE1995/000511 WO1995028739A1 (de) 1994-04-15 1995-04-13 Elektronisches bauelement und verfahren zu seiner herstellung

Publications (2)

Publication Number Publication Date
NO964367L NO964367L (no) 1996-10-14
NO964367D0 true NO964367D0 (no) 1996-10-14

Family

ID=6515837

Family Applications (1)

Application Number Title Priority Date Filing Date
NO964367A NO964367D0 (no) 1994-04-15 1996-10-14 Elektronikkomponent og dens fremstilling

Country Status (6)

Country Link
EP (1) EP0755573A1 (no)
AU (1) AU2254195A (no)
DE (1) DE4413529C2 (no)
FI (1) FI964115L (no)
NO (1) NO964367D0 (no)
WO (1) WO1995028739A1 (no)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6180261B1 (en) 1997-10-21 2001-01-30 Nitto Denko Corporation Low thermal expansion circuit board and multilayer wiring circuit board

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US515942A (en) * 1894-03-06 scates
EP0051165A1 (en) * 1980-11-03 1982-05-12 BURROUGHS CORPORATION (a Michigan corporation) Repairable IC package with thermoplastic chip attach
US4346124A (en) * 1981-05-04 1982-08-24 Laurier Associates, Inc. Method of applying an adhesive to a circuit chip
CA1222071A (en) * 1984-01-30 1987-05-19 Joseph A. Aurichio Conductive die attach tape
US4624724A (en) * 1985-01-17 1986-11-25 General Electric Company Method of making integrated circuit silicon die composite having hot melt adhesive on its silicon base
US4908086A (en) * 1985-06-24 1990-03-13 National Semiconductor Corporation Low-cost semiconductor device package process
DE3907261C2 (de) * 1989-03-07 2001-04-05 Nematel Dr Rudolf Eidenschink Klebstoff
US5212115A (en) * 1991-03-04 1993-05-18 Motorola, Inc. Method for microelectronic device packaging employing capacitively coupled connections

Also Published As

Publication number Publication date
EP0755573A1 (de) 1997-01-29
DE4413529A1 (de) 1995-10-19
DE4413529C2 (de) 1996-07-25
NO964367L (no) 1996-10-14
FI964115A0 (fi) 1996-10-14
AU2254195A (en) 1995-11-10
FI964115A7 (fi) 1996-12-13
FI964115L (fi) 1996-12-13
WO1995028739A1 (de) 1995-10-26

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