NO974041L - Skjermet innkapsling for elektroniske kretser - Google Patents

Skjermet innkapsling for elektroniske kretser

Info

Publication number
NO974041L
NO974041L NO974041A NO974041A NO974041L NO 974041 L NO974041 L NO 974041L NO 974041 A NO974041 A NO 974041A NO 974041 A NO974041 A NO 974041A NO 974041 L NO974041 L NO 974041L
Authority
NO
Norway
Prior art keywords
cover plate
chemical compound
shielding
rfi
gasket
Prior art date
Application number
NO974041A
Other languages
English (en)
Norwegian (no)
Other versions
NO974041D0 (no
Inventor
Jr Joseph A Salvi
Original Assignee
Parker Hannifin Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Parker Hannifin Corp filed Critical Parker Hannifin Corp
Publication of NO974041D0 publication Critical patent/NO974041D0/no
Publication of NO974041L publication Critical patent/NO974041L/no

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
    • H05K9/003—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields made from non-conductive materials comprising an electro-conductive coating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H05K9/0037—Housings with compartments containing a PCB, e.g. partitioning walls

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Casings For Electric Apparatus (AREA)
  • Dental Preparations (AREA)
NO974041A 1995-03-03 1997-09-03 Skjermet innkapsling for elektroniske kretser NO974041L (no)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US08/398,476 US5566055A (en) 1995-03-03 1995-03-03 Shieled enclosure for electronics
PCT/US1996/002818 WO1996028007A1 (en) 1995-03-03 1996-03-01 Shielded enclosure for electronics

Publications (2)

Publication Number Publication Date
NO974041D0 NO974041D0 (no) 1997-09-03
NO974041L true NO974041L (no) 1997-09-03

Family

ID=23575519

Family Applications (1)

Application Number Title Priority Date Filing Date
NO974041A NO974041L (no) 1995-03-03 1997-09-03 Skjermet innkapsling for elektroniske kretser

Country Status (12)

Country Link
US (1) US5566055A (de)
EP (1) EP0813805B1 (de)
JP (1) JPH11502672A (de)
CN (1) CN1098622C (de)
AT (1) ATE171589T1 (de)
BR (1) BR9607119A (de)
CA (1) CA2214434A1 (de)
DE (1) DE69600696T2 (de)
DK (1) DK0813805T3 (de)
ES (1) ES2122803T3 (de)
NO (1) NO974041L (de)
WO (1) WO1996028007A1 (de)

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US7170277B2 (en) * 2005-04-12 2007-01-30 Texas Instruments Incorporated Shield for tester load boards
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CN101689537B (zh) * 2007-04-26 2013-08-21 陶瓷技术有限责任公司 用于元件或电路的冷却盒
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EP2338319B1 (de) * 2008-09-26 2015-02-11 Parker-Hannifin Corporation Emi-abschirmung aus elektrisch leitendem schaumstoff
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KR101658821B1 (ko) * 2009-12-24 2016-10-04 삼성전자주식회사 휴대 단말기의 쉴드 캔
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US10588248B1 (en) * 2014-10-24 2020-03-10 L-3 Communications Corp. Radial EMI and environmental gasket
US20160192544A1 (en) * 2014-12-26 2016-06-30 Intel Corporation Integrated thermal emi structure for electronic devices
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Also Published As

Publication number Publication date
US5566055A (en) 1996-10-15
CN1098622C (zh) 2003-01-08
EP0813805B1 (de) 1998-09-23
BR9607119A (pt) 1997-11-04
EP0813805A2 (de) 1997-12-29
WO1996028007A1 (en) 1996-09-12
DE69600696T2 (de) 1999-02-18
ATE171589T1 (de) 1998-10-15
NO974041D0 (no) 1997-09-03
DK0813805T3 (da) 1999-06-14
ES2122803T3 (es) 1998-12-16
HK1004853A1 (en) 1998-12-11
CA2214434A1 (en) 1996-09-12
DE69600696D1 (de) 1998-10-29
JPH11502672A (ja) 1999-03-02
CN1182527A (zh) 1998-05-20
MX9706573A (es) 1997-11-29

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