NO993236L - Fremgangsmåte og innretning for oppvarming av en komponent - Google Patents

Fremgangsmåte og innretning for oppvarming av en komponent

Info

Publication number
NO993236L
NO993236L NO993236A NO993236A NO993236L NO 993236 L NO993236 L NO 993236L NO 993236 A NO993236 A NO 993236A NO 993236 A NO993236 A NO 993236A NO 993236 L NO993236 L NO 993236L
Authority
NO
Norway
Prior art keywords
component
heating
heated
circuit board
layers
Prior art date
Application number
NO993236A
Other languages
English (en)
Other versions
NO993236D0 (no
Inventor
Ari Isteri
Original Assignee
Nokia Telecommunications Oy
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nokia Telecommunications Oy filed Critical Nokia Telecommunications Oy
Publication of NO993236D0 publication Critical patent/NO993236D0/no
Publication of NO993236L publication Critical patent/NO993236L/no

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/10—Arrangements for heating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0212—Printed circuits or mounted components having integral heating means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors
    • H05K1/167—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors incorporating printed resistors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10151—Sensor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1115—Resistance heating, e.g. by current through the PCB conductors or through a metallic mask
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/165—Stabilizing, e.g. temperature stabilization
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Resistance Heating (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Transition And Organic Metals Composition Catalysts For Addition Polymerization (AREA)
  • General Induction Heating (AREA)
  • Mounting, Exchange, And Manufacturing Of Dies (AREA)
  • Laminated Bodies (AREA)

Abstract

Oppfinnelsen angår en fremgangsmåte og en innretning for oppvarming av minst en komponent (14) i et kretskort som omfatter en eller flere lag (10 og 11). Minst en komponent (14) som skal oppvarmes, varmes da med minst. en varmemotstand (15) i tilknytning til kretskortet.
NO993236A 1996-12-31 1999-06-29 Fremgangsmåte og innretning for oppvarming av en komponent NO993236L (no)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FI965301A FI965301L (fi) 1996-12-31 1996-12-31 Menetelmä ja järjestely komponentin lämmittämiseksi
PCT/FI1997/000834 WO1998030075A2 (en) 1996-12-31 1997-12-30 Method and arrangement for heating a component

Publications (2)

Publication Number Publication Date
NO993236D0 NO993236D0 (no) 1999-06-29
NO993236L true NO993236L (no) 1999-06-29

Family

ID=8547390

Family Applications (1)

Application Number Title Priority Date Filing Date
NO993236A NO993236L (no) 1996-12-31 1999-06-29 Fremgangsmåte og innretning for oppvarming av en komponent

Country Status (6)

Country Link
EP (1) EP0983714A2 (no)
JP (1) JP2001508942A (no)
AU (1) AU728378B2 (no)
FI (1) FI965301L (no)
NO (1) NO993236L (no)
WO (1) WO1998030075A2 (no)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FI981032A7 (fi) 1998-05-08 1999-11-09 Nokia Corp Lämmitysmenetelmä ja piirilevy
DE19851172A1 (de) * 1998-11-06 2000-05-11 Alcatel Sa Anordnung zur Erwärmung einer bestückten gedruckten Schaltung
GB2345453B (en) * 1999-09-14 2000-12-27 Lee John Robinson Laminated reflow soldering
DE202005001163U1 (de) * 2005-01-24 2005-03-31 Juma Leiterplattentechologie M Leiterplatte oder Platine mit Heizdraht
US11350490B2 (en) * 2017-03-08 2022-05-31 Raytheon Company Integrated temperature control for multi-layer ceramics and method
CN120653310A (zh) * 2024-03-07 2025-09-16 富联精密电子(天津)有限公司 服务器的低温启动方法及服务器

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3440407A (en) * 1966-12-29 1969-04-22 Rca Corp Temperature controlled circuit boards
US4769525A (en) * 1986-09-02 1988-09-06 Hughes Aircraft Company Circuit package attachment apparatus and method
US5010233A (en) * 1988-11-29 1991-04-23 Amp Incorporated Self regulating temperature heater as an integral part of a printed circuit board
FR2668876B1 (fr) * 1990-11-07 1992-12-24 Alcatel Espace Circuit electronique controle en temperature.
US5539186A (en) * 1992-12-09 1996-07-23 International Business Machines Corporation Temperature controlled multi-layer module
GB9508631D0 (en) * 1995-04-28 1995-06-14 Smiths Industries Ltd Electrical circuits

Also Published As

Publication number Publication date
AU5323998A (en) 1998-07-31
WO1998030075A3 (en) 1998-08-27
AU728378B2 (en) 2001-01-11
FI965301A7 (fi) 1998-07-01
EP0983714A2 (en) 2000-03-08
WO1998030075A2 (en) 1998-07-09
JP2001508942A (ja) 2001-07-03
FI965301A0 (fi) 1996-12-31
NO993236D0 (no) 1999-06-29
FI965301L (fi) 1998-07-01

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Legal Events

Date Code Title Description
FC2A Withdrawal, rejection or dismissal of laid open patent application