PH12012500611A1 - Bonding capillary - Google Patents

Bonding capillary

Info

Publication number
PH12012500611A1
PH12012500611A1 PH1/2012/500611A PH12012500611A PH12012500611A1 PH 12012500611 A1 PH12012500611 A1 PH 12012500611A1 PH 12012500611 A PH12012500611 A PH 12012500611A PH 12012500611 A1 PH12012500611 A1 PH 12012500611A1
Authority
PH
Philippines
Prior art keywords
bonding capillary
capillary
bonding
Prior art date
Application number
PH1/2012/500611A
Inventor
Mamoru Sakurai
Takeshi Uchimura
Masateru Wada
Yuichi Yoshii
Original Assignee
Toto Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toto Ltd filed Critical Toto Ltd
Publication of PH12012500611A1 publication Critical patent/PH12012500611A1/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
    • B23K20/004—Wire welding
    • B23K20/005—Capillary welding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/10—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating making use of vibrations, e.g. ultrasonic welding
    • B23K20/103—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating making use of vibrations, e.g. ultrasonic welding using a roller
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07531—Techniques
    • H10W72/07532—Compression bonding, e.g. thermocompression bonding
    • H10W72/07533—Ultrasonic bonding, e.g. thermosonic bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5525—Materials of bond wires comprising metals or metalloids, e.g. silver comprising copper [Cu]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/59—Bond pads specially adapted therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/951—Materials of bond pads
    • H10W72/952—Materials of bond pads comprising metals or metalloids, e.g. PbSn, Ag or Cu
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Wire Bonding (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
PH1/2012/500611A 2009-09-30 2010-09-30 Bonding capillary PH12012500611A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2009228080 2009-09-30
PCT/JP2010/067114 WO2011040543A1 (en) 2009-09-30 2010-09-30 Bonding capillary
JP2010220356A JP2011097042A (en) 2009-09-30 2010-09-30 Bonding capillary

Publications (1)

Publication Number Publication Date
PH12012500611A1 true PH12012500611A1 (en) 2017-08-23

Family

ID=43826355

Family Applications (1)

Application Number Title Priority Date Filing Date
PH1/2012/500611A PH12012500611A1 (en) 2009-09-30 2010-09-30 Bonding capillary

Country Status (5)

Country Link
JP (1) JP2011097042A (en)
KR (1) KR20120062813A (en)
CN (1) CN102549730B (en)
PH (1) PH12012500611A1 (en)
WO (1) WO2011040543A1 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014007430A (en) * 2009-09-30 2014-01-16 Toto Ltd Bonding capillary
JP2012039032A (en) * 2010-08-11 2012-02-23 Fujitsu Ltd Capillary for wire bonding device and ultrasonic transducer
JP5376413B1 (en) * 2013-01-25 2013-12-25 Ｔｏｔｏ株式会社 Bonding capillary
JP6270256B1 (en) 2016-11-28 2018-01-31 Toto株式会社 Bonding capillary

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5485949A (en) * 1993-04-30 1996-01-23 Matsushita Electric Industrial Co., Ltd. Capillary for a wire bonding apparatus and a method for forming an electric connection bump using the capillary
JP3022151B2 (en) * 1993-04-30 2000-03-15 松下電器産業株式会社 Capillary for wire bonding apparatus and method for forming electrical connection bump using the capillary
JP3139341B2 (en) * 1995-10-13 2001-02-26 松下電器産業株式会社 Capillary tool shape selection method
JP3333399B2 (en) * 1996-08-21 2002-10-15 株式会社新川 Capillary for wire bonding equipment
JP2000091372A (en) * 1998-09-11 2000-03-31 Matsushita Electronics Industry Corp Capillary used for electronic components and wire bonding
JP2001291736A (en) * 2000-04-06 2001-10-19 Seiko Epson Corp Capillary for wire bonding
US20040211814A1 (en) * 2003-04-23 2004-10-28 Jackson Hsieh Wire bonding capillary for an image sensor
JP2005197417A (en) * 2004-01-06 2005-07-21 Seiko Instruments Inc Capillary and capillary regeneration method
JP4137061B2 (en) * 2005-01-11 2008-08-20 株式会社カイジョー Wire loop shape, semiconductor device having the wire loop shape, and wire bonding method
KR100718889B1 (en) * 2005-11-28 2007-05-16 이정구 Wire Bonding Capillary with Two-Step High Bottleneck
US7597231B2 (en) * 2006-04-10 2009-10-06 Small Precision Tools Inc. Wire bonding capillary tool having multiple outer steps
JP4941268B2 (en) * 2007-12-17 2012-05-30 富士通株式会社 Wire bonding method and wire bonding apparatus

Also Published As

Publication number Publication date
CN102549730A (en) 2012-07-04
CN102549730B (en) 2015-02-11
JP2011097042A (en) 2011-05-12
KR20120062813A (en) 2012-06-14
WO2011040543A1 (en) 2011-04-07

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