PH12016500567A1 - Reductive electroless gold plating solution, and electroless gold plating method using said plating solution - Google Patents

Reductive electroless gold plating solution, and electroless gold plating method using said plating solution

Info

Publication number
PH12016500567A1
PH12016500567A1 PH12016500567A PH12016500567A PH12016500567A1 PH 12016500567 A1 PH12016500567 A1 PH 12016500567A1 PH 12016500567 A PH12016500567 A PH 12016500567A PH 12016500567 A PH12016500567 A PH 12016500567A PH 12016500567 A1 PH12016500567 A1 PH 12016500567A1
Authority
PH
Philippines
Prior art keywords
plating solution
electroless gold
gold plating
electroless
reductive
Prior art date
Application number
PH12016500567A
Other versions
PH12016500567B1 (en
Inventor
Kato Tomohito
Watanabe Hideto
Original Assignee
Kojima Chemicals Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kojima Chemicals Co Ltd filed Critical Kojima Chemicals Co Ltd
Publication of PH12016500567A1 publication Critical patent/PH12016500567A1/en
Publication of PH12016500567B1 publication Critical patent/PH12016500567B1/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/42—Coating with noble metals
    • C23C18/44—Coating with noble metals using reducing agents
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1635—Composition of the substrate
    • C23C18/1637—Composition of the substrate metallic substrate
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1646—Characteristics of the product obtained
    • C23C18/165—Multilayered product
    • C23C18/1651—Two or more layers only obtained by electroless plating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)

Abstract

The purpose of the present invention is to provide an electroless gold plating solution which does not contain harmful substances and is capable of achieving good wire bonding performance, while suppressing corrosion of a base metal. In order to achieve this purpose, an electroless plating solution that contains a water-soluble gold compound, citric acid or a citrate, ethylenediaminetetraacetic acid or an ethylenediaminetetraacetate, hexamethylenetetramine and a chain polyamine containing three or more amino groups and an alkyl group having three or more carbon atoms is employed as a reduction-type electroless gold plating solution which is used for the purpose of forming an electroless gold plating film on the surface of an object to be plated by means of electroless plating.
PH12016500567A 2014-08-25 2016-03-28 Reductive electroless gold plating solution, and electroless gold plating method using said plating solution PH12016500567B1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014170558 2014-08-25
PCT/JP2015/073551 WO2016031723A1 (en) 2014-08-25 2015-08-21 Reduction-type electroless gold plating solution and electroless gold plating method using said plating solution

Publications (2)

Publication Number Publication Date
PH12016500567A1 true PH12016500567A1 (en) 2016-05-30
PH12016500567B1 PH12016500567B1 (en) 2016-05-30

Family

ID=55399615

Family Applications (1)

Application Number Title Priority Date Filing Date
PH12016500567A PH12016500567B1 (en) 2014-08-25 2016-03-28 Reductive electroless gold plating solution, and electroless gold plating method using said plating solution

Country Status (7)

Country Link
US (1) US20160230287A1 (en)
JP (1) JP6017726B2 (en)
KR (1) KR101733119B1 (en)
CN (1) CN105745355B (en)
PH (1) PH12016500567B1 (en)
TW (1) TWI567234B (en)
WO (1) WO2016031723A1 (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3144413B1 (en) * 2015-09-21 2018-04-25 ATOTECH Deutschland GmbH Plating bath composition for electroless plating of gold
CN110770371A (en) 2017-05-23 2020-02-07 萨克森爱德美塔尔有限责任公司 Precious metal salt preparation, method for its production and use for electroplating
CN107190251B (en) * 2017-06-19 2018-11-16 广东东硕科技有限公司 A kind of gold plating liquid and preparation method thereof
JP6466521B2 (en) * 2017-06-28 2019-02-06 小島化学薬品株式会社 Electroless plating process
JP6474860B2 (en) * 2017-06-28 2019-02-27 小島化学薬品株式会社 Electroless nickel strike plating solution and method for forming nickel plating film
US11380602B2 (en) * 2018-03-07 2022-07-05 Sumitomo Electric Industries, Ltd. Plating film and plated member
CN117987815B (en) * 2024-01-31 2024-07-09 珠海斯美特电子材料有限公司 High-stability reduction type electroless gold plating solution and application thereof

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US3589916A (en) * 1964-06-24 1971-06-29 Photocircuits Corp Autocatalytic gold plating solutions
JPS5948951B2 (en) * 1978-08-05 1984-11-29 日本特殊陶業株式会社 Electroless gold plating solution
DE4021681A1 (en) * 1989-07-12 1991-03-14 Kojima Chemicals Co Ltd NON-ELECTROLYTIC GOLD PLATTLER SOLUTION
JPH05222541A (en) 1992-02-07 1993-08-31 Hitachi Ltd Gold plating method
JPH05295558A (en) * 1992-04-17 1993-11-09 Okuno Chem Ind Co Ltd High-speed substitutional electroless gold plating solution
US5803957A (en) * 1993-03-26 1998-09-08 C. Uyemura & Co.,Ltd. Electroless gold plating bath
EP0618307B1 (en) * 1993-03-26 1997-11-12 C. Uyemura & Co, Ltd Electroless gold plating bath
JP2927142B2 (en) * 1993-03-26 1999-07-28 上村工業株式会社 Electroless gold plating bath and electroless gold plating method
KR0183645B1 (en) * 1996-03-26 1999-03-20 이대원 Semiconductor lead frame with multi-layer plated layer
JP3565302B2 (en) * 1996-11-18 2004-09-15 日立化成工業株式会社 Electroless gold plating method
JP3566498B2 (en) * 1997-05-14 2004-09-15 株式会社大和化成研究所 Displacement gold plating bath
DE19745602C1 (en) * 1997-10-08 1999-07-15 Atotech Deutschland Gmbh Method and solution for the production of gold layers
JP3466521B2 (en) * 1999-10-04 2003-11-10 新光電気工業株式会社 Substitution type electroless gold plating solution and electroless gold plating method
JP2003518552A (en) * 1999-11-05 2003-06-10 シップレーカンパニー エル エル シー Electroless gold plating composition and method of using the same
EP1327700A1 (en) * 2000-08-21 2003-07-16 Shipley Company LLC Electroless displacement gold plating solution and additive for preparing said plating solution
JP4356319B2 (en) * 2000-09-18 2009-11-04 日立化成工業株式会社 Electroless gold plating solution and electroless gold plating method
US6445069B1 (en) * 2001-01-22 2002-09-03 Flip Chip Technologies, L.L.C. Electroless Ni/Pd/Au metallization structure for copper interconnect substrate and method therefor
JP5526440B2 (en) 2007-01-17 2014-06-18 奥野製薬工業株式会社 Printed wiring board formed using reduced deposition type electroless gold plating solution for palladium film
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JP2009149958A (en) * 2007-12-21 2009-07-09 Ne Chemcat Corp Pattern plating and pattern plating forming method
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JP4831710B1 (en) * 2010-07-20 2011-12-07 日本エレクトロプレイテイング・エンジニヤース株式会社 Electroless gold plating solution and electroless gold plating method
US8753748B2 (en) * 2010-10-04 2014-06-17 Kunio Mori Process for forming metal film, and product equipped with metal film
US20140072706A1 (en) * 2012-09-11 2014-03-13 Ernest Long Direct Electroless Palladium Plating on Copper

Also Published As

Publication number Publication date
US20160230287A1 (en) 2016-08-11
JPWO2016031723A1 (en) 2017-04-27
KR101733119B1 (en) 2017-05-08
TW201623687A (en) 2016-07-01
CN105745355A (en) 2016-07-06
CN105745355B (en) 2018-03-30
KR20160145533A (en) 2016-12-20
PH12016500567B1 (en) 2016-05-30
JP6017726B2 (en) 2016-11-02
WO2016031723A1 (en) 2016-03-03
TWI567234B (en) 2017-01-21

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