PH22688A - Apparatus and method of solder coating integrated circuit leads - Google Patents

Apparatus and method of solder coating integrated circuit leads

Info

Publication number
PH22688A
PH22688A PH34432A PH34432A PH22688A PH 22688 A PH22688 A PH 22688A PH 34432 A PH34432 A PH 34432A PH 34432 A PH34432 A PH 34432A PH 22688 A PH22688 A PH 22688A
Authority
PH
Philippines
Prior art keywords
integrated circuit
solder coating
circuit leads
coating integrated
leads
Prior art date
Application number
PH34432A
Other languages
English (en)
Inventor
Lee Jong Sang
Original Assignee
American Micro Syst
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by American Micro Syst filed Critical American Micro Syst
Publication of PH22688A publication Critical patent/PH22688A/en

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/012—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3465—Application of solder
    • H05K3/3468—Application of molten solder, e.g. dip soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/046—Surface mounting
    • H05K13/0465—Surface mounting by soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components
    • H05K3/3426—Leaded components characterised by the leads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/011—Apparatus therefor
    • H10W72/0112—Apparatus for manufacturing bump connectors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10984—Component carrying a connection agent, e.g. solder, adhesive
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
PH34432A 1985-10-31 1986-10-30 Apparatus and method of solder coating integrated circuit leads PH22688A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/794,038 US4657172A (en) 1985-10-31 1985-10-31 Apparatus and method of solder coating integrated circuit leads

Publications (1)

Publication Number Publication Date
PH22688A true PH22688A (en) 1988-11-14

Family

ID=25161497

Family Applications (1)

Application Number Title Priority Date Filing Date
PH34432A PH22688A (en) 1985-10-31 1986-10-30 Apparatus and method of solder coating integrated circuit leads

Country Status (4)

Country Link
US (1) US4657172A (ja)
JP (1) JPS62108564A (ja)
KR (1) KR920010190B1 (ja)
PH (1) PH22688A (ja)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4795079A (en) * 1985-03-29 1989-01-03 Canon Kabushiki Kaisha Structure of joining printed circuit boards and process for producing the same
US5189507A (en) * 1986-12-17 1993-02-23 Raychem Corporation Interconnection of electronic components
US4766842A (en) * 1987-04-29 1988-08-30 Jon Long Method and means for wave soldering of leads of an integrated circuit package
US4759491A (en) * 1987-05-18 1988-07-26 American Telephone And Telegraph Company Method and apparatus for applying bonding material to component leads
FI883320L (fi) * 1987-08-07 1989-02-08 Sankei Yakuhin Kk --laktam, dess framstaellning och mellanprodukter foer dess framstaellning.
US5241134A (en) * 1990-09-17 1993-08-31 Yoo Clarence S Terminals of surface mount components
US5541447A (en) * 1992-04-22 1996-07-30 Yamaha Corporation Lead frame
NL195026C (nl) * 1992-04-22 2003-06-18 Yamaha Corporation Werkwijze voor het bewerken van een raam van elektrische geleiders voor een halfgeleiderelement.
US5379943A (en) * 1993-10-19 1995-01-10 Ncr Corporation Hot air circulation apparatus and method for wave soldering machines
JP3209977B2 (ja) * 1999-04-02 2001-09-17 沖電気工業株式会社 半導体モジュ−ル
US6805277B1 (en) * 2003-04-16 2004-10-19 Lotes Co., Ltd. Process for soldering electric connector onto circuit board
US9647363B2 (en) * 2014-09-19 2017-05-09 Intel Corporation Techniques and configurations to control movement and position of surface mounted electrical devices

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3726007A (en) * 1971-02-02 1973-04-10 Martin Marietta Corp Component side printed circuit soldering
US4011980A (en) * 1976-03-25 1977-03-15 Western Electric Company, Inc. Flow-over mass soldering
JPS5376372A (en) * 1976-12-17 1978-07-06 Matsushita Electric Industrial Co Ltd Device for attaching chip circuit parts
NL7805800A (nl) * 1978-05-29 1979-12-03 Philips Nv Werkwijze en inrichting voor het solderen van onderde- len op een gatloos dikke-film substraat alsmede dikke-film substraat met onderdelen gesoldeerd met de werkwijze.
US4195193A (en) * 1979-02-23 1980-03-25 Amp Incorporated Lead frame and chip carrier housing
US4390120A (en) * 1980-12-15 1983-06-28 Bell Telephone Laboratories, Incorporated Soldering methods and apparatus
JPS5827354A (ja) * 1981-07-27 1983-02-18 テキサス・インスツルメンツ・インコ−ポレイテツド 集積回路用キャリア
US4463217A (en) * 1981-09-14 1984-07-31 Texas Instruments Incorporated Plastic surface mounted high pinout integrated circuit package
US4515304A (en) * 1982-09-27 1985-05-07 Northern Telecom Limited Mounting of electronic components on printed circuit boards
JPS5976662A (ja) * 1982-10-22 1984-05-01 Tamura Seisakusho Co Ltd 被はんだ付け物整列支持用の治具
JPS5984500A (ja) * 1982-11-05 1984-05-16 株式会社タムラ製作所 部品挿入方法

Also Published As

Publication number Publication date
KR870004511A (ko) 1987-05-11
US4657172A (en) 1987-04-14
JPS62108564A (ja) 1987-05-19
KR920010190B1 (ko) 1992-11-19

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