PL131484U1 - Moduł elektroniczny 3D o dużej gęstości - Google Patents

Moduł elektroniczny 3D o dużej gęstości

Info

Publication number
PL131484U1
PL131484U1 PL131484U PL13148421U PL131484U1 PL 131484 U1 PL131484 U1 PL 131484U1 PL 131484 U PL131484 U PL 131484U PL 13148421 U PL13148421 U PL 13148421U PL 131484 U1 PL131484 U1 PL 131484U1
Authority
PL
Poland
Prior art keywords
density
application
electronic module
improved
avionics
Prior art date
Application number
PL131484U
Other languages
English (en)
Other versions
PL73801Y1 (pl
Inventor
Yuriy Borisovich Sokolov
Original Assignee
Yuriy Borisovich Sokolov
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Yuriy Borisovich Sokolov filed Critical Yuriy Borisovich Sokolov
Publication of PL131484U1 publication Critical patent/PL131484U1/pl
Publication of PL73801Y1 publication Critical patent/PL73801Y1/pl

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of flexible or folded printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/005—Constructional details common to different types of electric apparatus arrangements of circuit components without supporting structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0084—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a single continuous metallic layer on an electrically insulating supporting structure, e.g. metal foil, film, plating coating, electro-deposition, vapour-deposition
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/028—Bending or folding regions of flexible printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/05—Flexible printed circuits [FPCs]
    • H05K2201/056—Folded around rigid support or component

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Electromagnetism (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

Zgłoszenie przedstawione na rysunku dotyczy urządzeń elektronicznych z układem elementów montowanych na powierzchni i może być stosowany w awionice, telekomunikacji, technice oświetleniowej i innych dziedzinach i jest konfigurowalny jako źródło zasilania, konwerter, czujniki i tym podobne. Rezultatem technicznym jest zwiększona gęstość komponentów, ulepszona wymiana ciepła i ulepszone środowisko elektromagnetyczne. Zgłoszenie charakteryzuje się tym, że zawiera elastyczną płytkę obwodu drukowanego na metalowej podstawie, która jest skonfigurowana w postaci ciągłej struktury spiralnej, której najbardziej zewnętrzna pętla ma zamknięty kontur, działając jako obudowa, ekran elektromagnetyczny i element grzejny powierzchnia wymiany.
PL131484U 2020-11-10 2021-11-08 Urządzenie stanowiące trójwymiarowy moduł elektroniczny o dużej gęstości upakowania elementów PL73801Y1 (pl)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
RU2020136760A RU2755530C1 (ru) 2020-11-10 2020-11-10 Трехмерный электронный модуль с высокой плотностью размещения компонентов
PCT/RU2021/000487 WO2022103300A1 (ru) 2020-11-10 2021-11-08 Трехмерный электронный модуль с высокой плотностью размещения компонентов

Publications (2)

Publication Number Publication Date
PL131484U1 true PL131484U1 (pl) 2023-12-04
PL73801Y1 PL73801Y1 (pl) 2025-02-24

Family

ID=77745529

Family Applications (1)

Application Number Title Priority Date Filing Date
PL131484U PL73801Y1 (pl) 2020-11-10 2021-11-08 Urządzenie stanowiące trójwymiarowy moduł elektroniczny o dużej gęstości upakowania elementów

Country Status (4)

Country Link
DE (1) DE212021000504U1 (pl)
PL (1) PL73801Y1 (pl)
RU (1) RU2755530C1 (pl)
WO (1) WO2022103300A1 (pl)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20010040793A1 (en) * 2000-02-01 2001-11-15 Tetsuya Inaba Electronic device and method of producing the same
JP2004128418A (ja) * 2002-10-07 2004-04-22 Matsushita Electric Ind Co Ltd 半導体装置およびその製造方法
CN103560125A (zh) * 2013-11-05 2014-02-05 华进半导体封装先导技术研发中心有限公司 三维柔性基板电磁屏蔽封装结构及制作方法
RU2657092C1 (ru) * 2017-05-25 2018-06-08 Закрытое акционерное общество "Научно-исследовательский институт микроприборов-технология" (ЗАО "НИИМП-Т") Способ изготовления трехмерного многокристального модуля на гибкой плате

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7005584B2 (en) * 2004-02-13 2006-02-28 Honeywell International Inc. Compact navigation device assembly
US9410665B2 (en) * 2012-07-16 2016-08-09 The Sloan Company, Inc. Flexible ribbon LED module
RU2688581C1 (ru) * 2018-06-18 2019-05-21 Юрий Борисович Соколов Способ изготовления трехмерного электронного модуля с высокой плотностью размещения компонентов и устройство

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20010040793A1 (en) * 2000-02-01 2001-11-15 Tetsuya Inaba Electronic device and method of producing the same
JP2004128418A (ja) * 2002-10-07 2004-04-22 Matsushita Electric Ind Co Ltd 半導体装置およびその製造方法
CN103560125A (zh) * 2013-11-05 2014-02-05 华进半导体封装先导技术研发中心有限公司 三维柔性基板电磁屏蔽封装结构及制作方法
RU2657092C1 (ru) * 2017-05-25 2018-06-08 Закрытое акционерное общество "Научно-исследовательский институт микроприборов-технология" (ЗАО "НИИМП-Т") Способ изготовления трехмерного многокристального модуля на гибкой плате

Also Published As

Publication number Publication date
PL73801Y1 (pl) 2025-02-24
WO2022103300A1 (ru) 2022-05-19
DE212021000504U1 (de) 2023-07-26
RU2755530C1 (ru) 2021-09-17

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