PL137973B1 - Agent for chemically polishing brasses - Google Patents
Agent for chemically polishing brassesInfo
- Publication number
- PL137973B1 PL137973B1 PL24204983A PL24204983A PL137973B1 PL 137973 B1 PL137973 B1 PL 137973B1 PL 24204983 A PL24204983 A PL 24204983A PL 24204983 A PL24204983 A PL 24204983A PL 137973 B1 PL137973 B1 PL 137973B1
- Authority
- PL
- Poland
- Prior art keywords
- weight
- amount
- agent
- brasses
- polishing
- Prior art date
Links
- 238000005498 polishing Methods 0.000 title claims description 12
- 241001275902 Parabramis pekinensis Species 0.000 title description 5
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims description 15
- 239000000126 substance Substances 0.000 claims description 9
- NLXLAEXVIDQMFP-UHFFFAOYSA-N Ammonia chloride Chemical compound [NH4+].[Cl-] NLXLAEXVIDQMFP-UHFFFAOYSA-N 0.000 claims description 8
- 239000003795 chemical substances by application Substances 0.000 claims description 7
- PAWQVTBBRAZDMG-UHFFFAOYSA-N 2-(3-bromo-2-fluorophenyl)acetic acid Chemical compound OC(=O)CC1=CC=CC(Br)=C1F PAWQVTBBRAZDMG-UHFFFAOYSA-N 0.000 claims description 5
- 229910001369 Brass Inorganic materials 0.000 claims description 4
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Chemical compound NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 claims description 4
- 235000019270 ammonium chloride Nutrition 0.000 claims description 4
- 239000010951 brass Substances 0.000 claims description 4
- 239000004202 carbamide Substances 0.000 claims description 4
- MWUXSHHQAYIFBG-UHFFFAOYSA-N nitrogen oxide Inorganic materials O=[N] MWUXSHHQAYIFBG-UHFFFAOYSA-N 0.000 description 9
- 239000000243 solution Substances 0.000 description 7
- 229910052802 copper Inorganic materials 0.000 description 5
- 239000010949 copper Substances 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 2
- RAHZWNYVWXNFOC-UHFFFAOYSA-N Sulphur dioxide Chemical compound O=S=O RAHZWNYVWXNFOC-UHFFFAOYSA-N 0.000 description 2
- YKYOUMDCQGMQQO-UHFFFAOYSA-L cadmium dichloride Chemical compound Cl[Cd]Cl YKYOUMDCQGMQQO-UHFFFAOYSA-L 0.000 description 2
- 229910017604 nitric acid Inorganic materials 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 239000004254 Ammonium phosphate Substances 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 229910000148 ammonium phosphate Inorganic materials 0.000 description 1
- 235000019289 ammonium phosphates Nutrition 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- MNNHAPBLZZVQHP-UHFFFAOYSA-N diammonium hydrogen phosphate Chemical compound [NH4+].[NH4+].OP([O-])([O-])=O MNNHAPBLZZVQHP-UHFFFAOYSA-N 0.000 description 1
- 230000008030 elimination Effects 0.000 description 1
- 238000003379 elimination reaction Methods 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- AHADSRNLHOHMQK-UHFFFAOYSA-N methylidenecopper Chemical compound [Cu].[C] AHADSRNLHOHMQK-UHFFFAOYSA-N 0.000 description 1
- 150000007522 mineralic acids Chemical class 0.000 description 1
- 238000006386 neutralization reaction Methods 0.000 description 1
- 150000007524 organic acids Chemical class 0.000 description 1
- 235000005985 organic acids Nutrition 0.000 description 1
- 238000007517 polishing process Methods 0.000 description 1
- LWIHDJKSTIGBAC-UHFFFAOYSA-K potassium phosphate Substances [K+].[K+].[K+].[O-]P([O-])([O-])=O LWIHDJKSTIGBAC-UHFFFAOYSA-K 0.000 description 1
- 229910000160 potassium phosphate Inorganic materials 0.000 description 1
- 235000011009 potassium phosphates Nutrition 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 239000010865 sewage Substances 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 235000015424 sodium Nutrition 0.000 description 1
- 231100000331 toxic Toxicity 0.000 description 1
- 230000002588 toxic effect Effects 0.000 description 1
- 239000002341 toxic gas Substances 0.000 description 1
- NWONKYPBYAMBJT-UHFFFAOYSA-L zinc sulfate Chemical class [Zn+2].[O-]S([O-])(=O)=O NWONKYPBYAMBJT-UHFFFAOYSA-L 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F3/00—Brightening metals by chemical means
- C23F3/04—Heavy metals
- C23F3/06—Heavy metals with acidic solutions
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- ing And Chemical Polishing (AREA)
- Chemical Treatment Of Metals (AREA)
Description
Przedmiotem wynalazku jest srodek do chemicz¬ nego polerowania mosiadzów, a zwlaszcza mosia¬ dzów wysokomiedziowych.Najczesciej stosowanym roztworem do chemicz¬ nego polerowania mosiadzów jest stezony kwas azotowy lub roztwory tego kwasu z dodatkiem niektórych kwasów nieorganicznych lub organicz¬ nych oraz dodatkiem róznych soli i tlenków metali.Zastosowanie tych roztworów pomimo dobrych wlas¬ nosci polerujacych jest ograniczone z uwagi na to, ze w czasie obróbki chemicznej wydzielaja sie sil¬ nie toksyczne tlenki azotu, co powoduje zagrozenie zdrowia pracowników i zanieczyszczenie ekologicz¬ ne atmosfery.Znany jest takze z polskiego opisu patentowego nr 133 213 srodek do chemicznego polerowania sto¬ pów miedzi, a zwlaszcza mosiadzów, który zawiera w swoim skladzie stezony kwas siarkowy w ilosci 35—45% wagowych, stezony kwas azotowy w ilos¬ ci 15—40% wagowych, azotan amonowy w ilosci 10—30% wagowych, chlorek kadmowy w ilosci 0,05—5,0% wagowych, fosforan sodowy lub potaso¬ wy lub amonowy w ilosci 2—15% wagowych oraz wode w ilosci 1—30% wagowych. Srodek ten znaj¬ duje zastosowanie do polerowania glównie mosia¬ dzów nisko i sredniomiedziowych, zawierajacych do 63% wagowych miedzi. Obróbka chemiczna mo¬ siadzów o wysokiej zawartosci miedzi daje slabe wypolerowanie powierzchni. 20 Srodek do chemicznego polerowania mosiadzów, wedlug wynalazku, stanowi wodny roztwór, zawie¬ rajacy kwas siarkowy w ilosci 40—65% wagowych, azotan amonu w ilosci 0,05—4,0% wagowych, mocz¬ nik w ilosci 0,05—1,0% wagowych oraz chlorek amonu w ilosci 0,02—0,30% wagowych.Zaleta srodka, wedlug wynalazku, jest wyelimi¬ nowanie emisji tlenków azotu^ w procesie polero¬ wania oraz mozliwosc zastosowania taniej metody neutralizacji scieków, ze wzgledu na to, ze zawie¬ raja one glównie siarczany miedzi i cynku. Rozt¬ wór, wedlug wynalazku, znajduje glównie zasto¬ sowanie do tych wyrobów, które pokryte sa war¬ stewka tlenków, przy braku innych zanieczyszczen, w tym glównie tluszczy i smarów.Przyklad. Roztwór do chemicznego polero¬ wania zawiera wagowo: 60% kwasu siarkowego, 3%azotanu amonu, 0,8% mocznika, 0^°/oj chlorku amonu, 36% wody.W powyzszym roztworze o temperaturze 398 K polerowano przez okres 70 sekund prasowane ele¬ menty z mosiadzu o zawartosci 70% wagowych miedzi, pokryte warstewka zgorzeliny. Wypolero¬ wana powierzchnia pozbawiona byla jakichkolwiek wad powierzchniowych. Podczas polerowania nie zaobserwowano wydzielania sie gazów toksycznych, jak tlenki azotu, dwutlenek siarki i inne.Zastrzezenie patentowe Srodek do chemicznego polerowania mosiadzów, zawierajacy kwas siarkowy, znamienny tym, ze 137 973137 973 3 4 stanowi go roztwór zawierajacy kwas siarkowy w wagowych oraz chlorek amonu w ilosci 0,02—0,3% ilosci 45—65% wagowych, azotan amonu w ilosci wagowych. 0,05—4,0% wagowych, mocznik w ilosci 0,05—1,0% OZGraf. Z.P. Dz-WO, z. 287 (90+15) 9.86 C*n» 100 rf PLThe subject of the invention is an agent for chemical polishing of brasses, especially high-copper brasses. The most commonly used solution for chemical polishing of brass is concentrated nitric acid or solutions of this acid with the addition of some inorganic or organic acids and the addition of various salts and oxides. The application of these solutions, despite their good polishing properties, is limited due to the fact that during chemical treatment, highly toxic nitrogen oxides are released, which endangers the health of workers and ecological pollution of the atmosphere. It is also known from the Polish description No. 133,213 chemical polishing agent for copper alloys, especially brass, which contains concentrated sulfuric acid in the amount of 35-45% by weight, concentrated nitric acid in the amount of 15-40% by weight, ammonium nitrate in the amount 10-30 wt%, 0.05-5.0 wt% cadmium chloride, sodium or potassium or ammonium phosphate y in an amount of 2 - 15% by weight and water in an amount of 1 - 30% by weight. This agent is used for polishing mainly low and mid-copper brasses containing up to 63% by weight of copper. Chemical treatment of high copper carbon pots results in poor surface polishing. The chemical brasses polishing agent according to the invention is an aqueous solution containing sulfuric acid in an amount of 40-65% by weight, ammonium nitrate in an amount of 0.05-4.0% by weight, urea in an amount of 0.05- 1.0% by weight and ammonium chloride in the amount of 0.02-0.30% by weight. The advantage of the agent, according to the invention, is the elimination of nitrogen oxide emissions in the polishing process and the possibility of using a cheaper method of sewage neutralization due to the that they contain mainly copper and zinc sulfates. The solution, according to the invention, is mainly applicable to those products which are covered with an oxide film, in the absence of other impurities, mainly grease and lubricants. The chemical polishing solution contains by weight: 60% sulfuric acid, 3% ammonium nitrate, 0.8% urea, 0% per cent ammonium chloride, 36% water. The above solution at a temperature of 398 K was polished for 70 seconds. Brass elements with 70% by weight of copper, covered with a layer of scale. The polished surface was devoid of any surface defects. During polishing, no emission of toxic gases such as nitrogen oxides, sulfur dioxide etc. was observed. Patent claim Chemical polishing agent containing sulfuric acid, characterized in that 137 973 137 973 3 4 is a solution containing sulfuric acid in weight and ammonium chloride in an amount of 0.02-0.3% in an amount, 45-65% by weight, ammonium nitrate in an amount by weight. 0.05-4.0% by weight, urea in the amount of 0.05-1.0% OZGraf. Z.P. Dz-WO, issue 287 (90 + 15) 9.86 C * n »100 rf PL
Claims (1)
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PL24204983A PL137973B1 (en) | 1983-05-19 | 1983-05-19 | Agent for chemically polishing brasses |
| GB08412496A GB2140038B (en) | 1983-05-19 | 1984-05-16 | Solution for chemical polishing brasses |
| DE19843418620 DE3418620C2 (en) | 1983-05-19 | 1984-05-18 | Preparations for chemical polishing of brass |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PL24204983A PL137973B1 (en) | 1983-05-19 | 1983-05-19 | Agent for chemically polishing brasses |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| PL242049A1 PL242049A1 (en) | 1984-12-03 |
| PL137973B1 true PL137973B1 (en) | 1986-08-30 |
Family
ID=20017101
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PL24204983A PL137973B1 (en) | 1983-05-19 | 1983-05-19 | Agent for chemically polishing brasses |
Country Status (3)
| Country | Link |
|---|---|
| DE (1) | DE3418620C2 (en) |
| GB (1) | GB2140038B (en) |
| PL (1) | PL137973B1 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2582675B1 (en) * | 1985-06-03 | 1992-10-02 | Solvay | BATHS AND METHODS FOR CHEMICAL POLISHING OF STAINLESS STEEL SURFACES |
| RU2303079C1 (en) * | 2006-04-27 | 2007-07-20 | Государственное образовательное учреждение высшего профессионального образования "Ивановский государственный химико-технологический университет" (ИГХТУ) | Solution for chemical polishing of copper and alloys thereof |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB478209A (en) * | 1935-07-25 | 1938-01-13 | Max Landauer | Improvements in connection with the removal of scale-like deposits from vessels madeof aluminium or aluminium alloys |
-
1983
- 1983-05-19 PL PL24204983A patent/PL137973B1/en unknown
-
1984
- 1984-05-16 GB GB08412496A patent/GB2140038B/en not_active Expired
- 1984-05-18 DE DE19843418620 patent/DE3418620C2/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| GB8412496D0 (en) | 1984-06-20 |
| DE3418620A1 (en) | 1984-11-22 |
| GB2140038B (en) | 1986-09-10 |
| PL242049A1 (en) | 1984-12-03 |
| DE3418620C2 (en) | 1986-04-24 |
| GB2140038A (en) | 1984-11-21 |
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