PL150558B1 - Specific for glossy etching of copper and its alloys - Google Patents
Specific for glossy etching of copper and its alloysInfo
- Publication number
- PL150558B1 PL150558B1 PL27271688A PL27271688A PL150558B1 PL 150558 B1 PL150558 B1 PL 150558B1 PL 27271688 A PL27271688 A PL 27271688A PL 27271688 A PL27271688 A PL 27271688A PL 150558 B1 PL150558 B1 PL 150558B1
- Authority
- PL
- Poland
- Prior art keywords
- amount
- weight
- copper
- alloys
- etching
- Prior art date
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims description 10
- 229910045601 alloy Inorganic materials 0.000 title claims description 10
- 239000000956 alloy Substances 0.000 title claims description 10
- 229910052802 copper Inorganic materials 0.000 title claims description 10
- 239000010949 copper Substances 0.000 title claims description 10
- 238000005530 etching Methods 0.000 title description 11
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 claims description 12
- 239000003795 chemical substances by application Substances 0.000 claims description 12
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 claims description 10
- 229910017604 nitric acid Inorganic materials 0.000 claims description 10
- WXHLLJAMBQLULT-UHFFFAOYSA-N 2-[[6-[4-(2-hydroxyethyl)piperazin-1-yl]-2-methylpyrimidin-4-yl]amino]-n-(2-methyl-6-sulfanylphenyl)-1,3-thiazole-5-carboxamide;hydrate Chemical compound O.C=1C(N2CCN(CCO)CC2)=NC(C)=NC=1NC(S1)=NC=C1C(=O)NC1=C(C)C=CC=C1S WXHLLJAMBQLULT-UHFFFAOYSA-N 0.000 claims description 6
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Chemical compound NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 claims description 6
- BFNBIHQBYMNNAN-UHFFFAOYSA-N ammonium sulfate Chemical compound N.N.OS(O)(=O)=O BFNBIHQBYMNNAN-UHFFFAOYSA-N 0.000 claims description 6
- 229910052921 ammonium sulfate Inorganic materials 0.000 claims description 6
- 235000011130 ammonium sulphate Nutrition 0.000 claims description 6
- 239000004202 carbamide Substances 0.000 claims description 6
- 238000000034 method Methods 0.000 claims description 6
- 239000011780 sodium chloride Substances 0.000 claims description 6
- 235000019832 sodium triphosphate Nutrition 0.000 claims description 6
- 150000001639 boron compounds Chemical class 0.000 claims description 5
- 239000007864 aqueous solution Substances 0.000 claims description 4
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 claims description 3
- 235000010338 boric acid Nutrition 0.000 claims description 3
- 229960002645 boric acid Drugs 0.000 claims description 3
- 235000010339 sodium tetraborate Nutrition 0.000 claims description 3
- 229910021538 borax Inorganic materials 0.000 claims description 2
- UQGFMSUEHSUPRD-UHFFFAOYSA-N disodium;3,7-dioxido-2,4,6,8,9-pentaoxa-1,3,5,7-tetraborabicyclo[3.3.1]nonane Chemical compound [Na+].[Na+].O1B([O-])OB2OB([O-])OB1O2 UQGFMSUEHSUPRD-UHFFFAOYSA-N 0.000 claims description 2
- 238000005554 pickling Methods 0.000 claims description 2
- 239000004328 sodium tetraborate Substances 0.000 claims description 2
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 claims 1
- 239000001166 ammonium sulphate Substances 0.000 claims 1
- 229910052796 boron Inorganic materials 0.000 claims 1
- MWUXSHHQAYIFBG-UHFFFAOYSA-N nitrogen oxide Inorganic materials O=[N] MWUXSHHQAYIFBG-UHFFFAOYSA-N 0.000 description 18
- 239000000243 solution Substances 0.000 description 8
- 229910000881 Cu alloy Inorganic materials 0.000 description 6
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 6
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 5
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 4
- 229910001369 Brass Inorganic materials 0.000 description 3
- 239000010951 brass Substances 0.000 description 3
- 229910052793 cadmium Inorganic materials 0.000 description 3
- BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 description 3
- 230000029087 digestion Effects 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 229910052759 nickel Inorganic materials 0.000 description 3
- 239000002341 toxic gas Substances 0.000 description 3
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- 229960000583 acetic acid Drugs 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 238000005266 casting Methods 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- PAWQVTBBRAZDMG-UHFFFAOYSA-N 2-(3-bromo-2-fluorophenyl)acetic acid Chemical compound OC(=O)CC1=CC=CC(Br)=C1F PAWQVTBBRAZDMG-UHFFFAOYSA-N 0.000 description 1
- 229910000978 Pb alloy Inorganic materials 0.000 description 1
- 102220491117 Putative postmeiotic segregation increased 2-like protein 1_C23F_mutation Human genes 0.000 description 1
- 229910001128 Sn alloy Inorganic materials 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 238000005282 brightening Methods 0.000 description 1
- 229940065285 cadmium compound Drugs 0.000 description 1
- 150000001662 cadmium compounds Chemical class 0.000 description 1
- QCUOBSQYDGUHHT-UHFFFAOYSA-L cadmium sulfate Chemical compound [Cd+2].[O-]S([O-])(=O)=O QCUOBSQYDGUHHT-UHFFFAOYSA-L 0.000 description 1
- CDMADVZSLOHIFP-UHFFFAOYSA-N disodium;3,7-dioxido-2,4,6,8,9-pentaoxa-1,3,5,7-tetraborabicyclo[3.3.1]nonane;decahydrate Chemical compound O.O.O.O.O.O.O.O.O.O.[Na+].[Na+].O1B([O-])OB2OB([O-])OB1O2 CDMADVZSLOHIFP-UHFFFAOYSA-N 0.000 description 1
- 230000008030 elimination Effects 0.000 description 1
- 238000003379 elimination reaction Methods 0.000 description 1
- 238000003912 environmental pollution Methods 0.000 description 1
- 239000012362 glacial acetic acid Substances 0.000 description 1
- RUTXIHLAWFEWGM-UHFFFAOYSA-H iron(3+) sulfate Chemical compound [Fe+3].[Fe+3].[O-]S([O-])(=O)=O.[O-]S([O-])(=O)=O.[O-]S([O-])(=O)=O RUTXIHLAWFEWGM-UHFFFAOYSA-H 0.000 description 1
- 229910000360 iron(III) sulfate Inorganic materials 0.000 description 1
- 238000006386 neutralization reaction Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 239000002574 poison Substances 0.000 description 1
- 231100000614 poison Toxicity 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 238000007517 polishing process Methods 0.000 description 1
- LJCNRYVRMXRIQR-OLXYHTOASA-L potassium sodium L-tartrate Chemical compound [Na+].[K+].[O-]C(=O)[C@H](O)[C@@H](O)C([O-])=O LJCNRYVRMXRIQR-OLXYHTOASA-L 0.000 description 1
- 238000010992 reflux Methods 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 235000011006 sodium potassium tartrate Nutrition 0.000 description 1
- 231100000331 toxic Toxicity 0.000 description 1
- 230000002588 toxic effect Effects 0.000 description 1
- 239000002351 wastewater Substances 0.000 description 1
Landscapes
- ing And Chemical Polishing (AREA)
Description
OPIS PATENTOWYPATENT DESCRIPTION
150 558150 558
URZĄDOFFICE
PATENTOWYPATENT
RPRP
Patent dodatkowy do patentu nr--Zgłoszono: 88 05 25Additional patent to patent no.- Pending: 88 05 25
Pierwszeństwo-Zgłoszenie ogłoszono:Priority-Application announced:
(P. 272716) I(P. 272716)
Int. Cl.5 C23F 1/18Int. Cl. 5 C23F 1/18
CZYTELNIA ‘READING ROOM '
U ędu PatentowegoPatent Office
03 0603 06
Opis patentowy opublikowano: 1990 09 28Patent description published: 1990 09 28
Twórca wynalazku: Edward ZacnyInventor: Edward Zacny
Uprawniony z patentu: Edward Zacny,The holder of the patent: Edward Zacny,
Myślenice (Polska)Myślenice (Poland)
Λ · · ·Λ · ·
Środek do trawienia z połyskiem miedzi i jej stopówEtching agent with a gloss of copper and its alloys
Przedmiotem wynalazku jest środek do trawienia z połyskiem miedzi i jej stopów.The present invention relates to a bright etching agent for copper and its alloys.
Najczęściej stosowanym środkiem do trawienia miedzi i jej stopów z jednoczesnym wybłyszczaniem jest roztwór stężonego kwasu azotowego, jak również mieszaniny kwasu azotowego z kwasem fosforowym, siarkowym lub octowym. Wadą powyższych roztworów jest znaczna emisja silnie toksycznych tlenków azotu w procesie trawienia stopów miedzi, które stanowią zagrożenie dla zdrowia pracowników i powodują zanieczyszczenie środowiska, a neutralizacja tych tlenków jest procesem trudnym i mało efektywnym.The most commonly used means for etching copper and its alloys with simultaneous polishing is a solution of concentrated nitric acid, as well as mixtures of nitric acid with phosphoric, sulfuric or acetic acid. The disadvantage of the above solutions is the significant emission of highly toxic nitrogen oxides in the etching process of copper alloys, which pose a threat to workers' health and cause environmental pollution, and the neutralization of these oxides is a difficult and ineffective process.
Znane z polskich opisów patentowych nr nr 137971, 137972 oraz 137973 oraz z opisów patentowych RFN nr nr 3 418 620 i 3 418 574, jak również z opisów patentowych Wielkiej Brytanii nr nr 2 140038 i 2140039 środki do trawienia z połyskiem miedzi i jej stopów oparte są na roztworach kwasu siarkowego z dodatkiem azotanu amonu oraz innych dodatków. Stosowanie wyżej wymienionych środków nie powoduje emisji tlenków azotu w procesie polerowania.Known from Polish patents Nos. 137971, 137972 and 137973 and from German patents Nos. 3,418,620 and 3,418,574, as well as from Great Britain patents Nos. 2 140 038 and 2140 039 copper and copper alloys gloss etching agents are on solutions of sulfuric acid with the addition of ammonium nitrate and other additives. The use of the above-mentioned agents does not emit nitrogen oxides during the polishing process.
Znany z polskiego opisu patentowego środek do chemicznego wybłyszczania, zwłaszcza taśm mosiężnych, zawierający w 1 litrze wody 4,5-9,5% wagowych bezwodnego siarczanu żelazowego, 3-6% wagowych lodowatego kwasu octowego i 0,1 -1,0% wagowych soli Seignette'a, pozwala także na wyeliminowanie emisji toksycznych gazów. Do grupy środków trawiących z połyskiem stopy miedzi bez emisji tlenków azotu należą również roztwory oparte na kwasie azotowym.A chemical brightening agent known from the Polish patent, especially for brass strips, containing 4.5-9.5% by weight of anhydrous ferric sulfate, 3-6% by weight of glacial acetic acid and 0.1-1.0% by weight in 1 liter of water Seignette salt, also allows to eliminate the emission of toxic gases. The group of bright etching agents with copper alloys without the emission of nitrogen oxides also includes solutions based on nitric acid.
Znany z polskiego opisu patentowego nr 133668 środek do trawienia wybłyszczającego stopów miedzi zawiera 64% kwas azotowy w ilości 0,40-0,55 m3, wodę w ilości 0,45-0,60 m3, mocznik w ilości 5,0-19,0 kg/m3, siarczan amonu w ilości 4,0-14,5 kg/m3, trójpolifosforan sodu w ilości 5,0-15,0 kg/m3, chlorek sodu w ilości 0,15-1,5 kg/m3, uwodniony siarczan kadmu w ilości 0,08-0,8 kg/m3 oraz uwodniony kwas sulfosalicylowy w ilości 0,01-0,15 kg/m3.Known from the Polish patent specification No. 133668 an agent for etching wybłyszczającego copper alloy contains 64% nitric acid in an amount of 0,40-0,55 m 3 and water in an amount of 0.45-0.60 m 3, urea in an amount of 5,0- 19.0 kg / m 3 , ammonium sulfate in the amount of 4.0-14.5 kg / m 3 , sodium tripolyphosphate in the amount of 5.0-15.0 kg / m 3 , sodium chloride in the amount of 0.15-1, 5 kg / m 3 , hydrated cadmium sulphate in the amount of 0.08-0.8 kg / m 3 and hydrated sulfosalicylic acid in the amount of 0.01-0.15 kg / m 3 .
Ponadto znany jest także z polskiego opisu patentowego nr 136 855 roztwór wodny do trawienia miedzi i jej stopów, zawierający w sw'oim składzie: 15-33% kwas azotowy oraz następujące substancje wprowadzone do lm3 roztworu kwasu azotowego: mocznik w ilości 3,5-20,0 kg, siarczan amonu w ilości 1,0-12,5 kg, trójpolifosforan sodu w ilości 2,0-20,0 kg, chlorek sodu wMoreover, it is also known from the Polish patent specification No. 136 855 an aqueous solution for etching copper and its alloys, containing in its composition: 15-33% nitric acid and the following substances added to 1m 3 of nitric acid solution: urea in the amount of 3.5 -20.0 kg, ammonium sulfate in the amount of 1.0-12.5 kg, sodium tripolyphosphate in the amount of 2.0-20.0 kg, sodium chloride in
150 558 ilości 0,1-5,0 kg, kwas sulfosalicylowy w ilości 0,01-0,2 kg oraz rozdrobniony kadm metaliczny lub jego stopy w ilości 0,05-3,0 kg/m3 roztworu.150 558 in the amount of 0.1-5.0 kg, sulfosalicylic acid in the amount of 0.01-0.2 kg and crushed metal cadmium or its alloys in the amount of 0.05-3.0 kg / m 3 of solution.
Wadą powyższego środka jest konieczność stosowania dodatków kadmu w postaci metalicznej lub jego soli ze względu na to, że związki kadmu należą do trucizn, a obecność kadmu w roztworze trawiącym utrudnia oczyszczanie ścieków potrąwiennych.The disadvantage of the above measure is the necessity to use metal cadmium or its salt additives due to the fact that cadmium compounds are poisons, and the presence of cadmium in the pickling solution makes it difficult to treat reflux wastewater.
Środek do trawienia z połyskiem miedzi i jej stopów, według wynalazku, stanowi wodny roztwór, zawierający kwas azotowy w ilości 10-50% wagowych, mocznik w ilości 0,3-3,0% wagowych, siarczan amonowy w ilości 0,2-5,0% wagowych, trójpolifosforan sodu w ilości 0,1-5,0% wagowych, chlorek sodu w ilości 0,05-2,0% wagowych, kwas sulfosalicylowy w ilości 0,0001-0,1% wagowych oraz nieorganiczne związki boru w ilości 0,001-3,0% wagowych. Jako związki boru stosuje się uwodniony czteroboran sodu, korzystnie w ilości 0,7% wagowych lub kwas ortoborowy, korzystnie o stężeniu 0,35% wagowych.The bright etching agent for copper and its alloys according to the invention is an aqueous solution containing nitric acid in an amount of 10-50% by weight, urea in an amount of 0.3-3.0% by weight, ammonium sulfate in an amount of 0.2-5 , 0% by weight, sodium tripolyphosphate in the amount of 0.1-5.0% by weight, sodium chloride in the amount of 0.05-2.0% by weight, sulfosalicylic acid in the amount of 0.0001-0.1% by weight and inorganic boron compounds in an amount of 0.001-3.0% by weight. The boron compounds used are hydrated sodium tetraborate, preferably in an amount of 0.7% by weight, or orthoboric acid, preferably in a concentration of 0.35% by weight.
Zaletą środka, według wynalazku, jest wyeliminowanie emisji tlenków azotu podczas procesu trawienia. Ponadto trawi on z połyskiem większość przemysłowych stopów miedzi, w tym ołowiowe mosiądze wielofazowe. W czasie płukania wyrobów ze stopów miedzi, trawionych w środku, według wynalazku, praktycznie nie zachodzi zjawisko cementacji powierzchni stopu warstewkami miedzi.The advantage of the agent according to the invention is the elimination of nitrogen oxide emissions during the digestion process. In addition, it brightens most industrial copper alloys, including leaded multiphase brass. During rinsing of products made of copper alloys etched inside, according to the invention, there is practically no cementation of the alloy surface with copper layers.
Przykład I. Odlewy mosiężne ze stopu M059 trawiono w roztworze zawierającym wagowo: 33% kwasu azotowego, 0,8% mocznika, 1,5% siarczanu amonu, 0,8% trójpolifosforanu sodu, 0,1% chlorku sodu, 0,01 % kwasu sulfosalicylowego i 0,2% kwasu ortoborowego. W czasie trawienia nie zaobserwowano emisji tlenków azotu lub innych toksycznych gazów. Wytrawione wyroby charakteryzowały się dobrym połyskiem, bez wad powierzchni. Powłoki niklu, nałożone metodą galwaniczną na wytrawione wyroby posiadały bardzo dobrą przyczepność do podłoża metalu.Example I. Brass castings made of M059 alloy were etched in a solution containing by weight: 33% nitric acid, 0.8% urea, 1.5% ammonium sulfate, 0.8% sodium tripolyphosphate, 0.1% sodium chloride, 0.01% sulfosalicylic acid and 0.2% orthoboric acid. No emissions of nitrogen oxides or other toxic gases were observed during digestion. The etched products were glossy with no surface defects. Nickel coatings, electroplated on the etched products, had very good adhesion to the metal substrate.
Przykład II. Odlewy z mosiądzu jednofazowego, zawierającego 70% wagowych miedzi, trawiono w roztworze wodnym zawierającym wagowo: 30% kwasu azotowego, 1,0% mocznika, 1,2% siarczanu amonu, 0,3% trójpolifosforanu sodu, 0,08% chlorku sodu, 0,001% kwasu sulfosalicylowego oraz 0,7% dziesięciowodnego czteroboranu sodu. W czasie trawienia nie obserwowano emisji tlenków azotu lub innych gazów toksycznych. Wytrawione wyroby charakteryzowały się dobrym połyskiem, bez wad powierzchniowych w postaci niedotrawień. Wytrawione detale bezpośrednio po procesie trawienia poddano niklowaniu metodą galwaniczną. Powłoki niklu wykazywały wysoką przyczepność do podłoża, w tym również w miejscach lutowanych stopem cyny i ołowiu.Example II. Single-phase brass castings, containing 70% by weight of copper, were etched in an aqueous solution containing: 30% by weight of nitric acid, 1.0% of urea, 1.2% of ammonium sulfate, 0.3% of sodium tripolyphosphate, 0.08% of sodium chloride, 0.001% sulfosalicylic acid and 0.7% sodium tetraborate decahydrate. No emissions of nitrogen oxides or other toxic gases were observed during digestion. The etched products showed a good gloss, without surface defects in the form of nicks. The etched details were subjected to galvanic nickel plating immediately after the etching process. The nickel coatings showed high adhesion to the substrate, also in places soldered with a tin and lead alloy.
Claims (3)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PL27271688A PL150558B1 (en) | 1988-05-25 | 1988-05-25 | Specific for glossy etching of copper and its alloys |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PL27271688A PL150558B1 (en) | 1988-05-25 | 1988-05-25 | Specific for glossy etching of copper and its alloys |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| PL272716A2 PL272716A2 (en) | 1989-03-06 |
| PL150558B1 true PL150558B1 (en) | 1990-06-30 |
Family
ID=20042383
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PL27271688A PL150558B1 (en) | 1988-05-25 | 1988-05-25 | Specific for glossy etching of copper and its alloys |
Country Status (1)
| Country | Link |
|---|---|
| PL (1) | PL150558B1 (en) |
-
1988
- 1988-05-25 PL PL27271688A patent/PL150558B1/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| PL272716A2 (en) | 1989-03-06 |
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