PL1580562T3 - Sonda kontaktowa do głowicy testującej - Google Patents

Sonda kontaktowa do głowicy testującej

Info

Publication number
PL1580562T3
PL1580562T3 PL04425205T PL04425205T PL1580562T3 PL 1580562 T3 PL1580562 T3 PL 1580562T3 PL 04425205 T PL04425205 T PL 04425205T PL 04425205 T PL04425205 T PL 04425205T PL 1580562 T3 PL1580562 T3 PL 1580562T3
Authority
PL
Poland
Prior art keywords
contact
testing head
probe
contact probe
eccentric
Prior art date
Application number
PL04425205T
Other languages
English (en)
Inventor
Giuseppe Crippa
Stefano Felici
Original Assignee
Technoprobe Spa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Technoprobe Spa filed Critical Technoprobe Spa
Publication of PL1580562T3 publication Critical patent/PL1580562T3/pl

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06733—Geometry aspects
    • G01R1/06738—Geometry aspects related to tip portion
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07357—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with flexible bodies, e.g. buckling beams
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Geometry (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
PL04425205T 2004-03-24 2004-03-24 Sonda kontaktowa do głowicy testującej PL1580562T3 (pl)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP04425205A EP1580562B1 (en) 2004-03-24 2004-03-24 Contact probe for a testing head

Publications (1)

Publication Number Publication Date
PL1580562T3 true PL1580562T3 (pl) 2008-02-29

Family

ID=34854753

Family Applications (1)

Application Number Title Priority Date Filing Date
PL04425205T PL1580562T3 (pl) 2004-03-24 2004-03-24 Sonda kontaktowa do głowicy testującej

Country Status (9)

Country Link
US (1) US7227368B2 (pl)
EP (1) EP1580562B1 (pl)
JP (1) JP2007530931A (pl)
CN (1) CN100510755C (pl)
AT (1) ATE376679T1 (pl)
DE (1) DE602004009662T2 (pl)
PL (1) PL1580562T3 (pl)
TW (1) TW200540427A (pl)
WO (1) WO2005091000A1 (pl)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5192899B2 (ja) * 2008-04-30 2013-05-08 東京特殊電線株式会社 プローブ針及びその製造方法
JP5372706B2 (ja) * 2009-11-04 2013-12-18 株式会社日本マイクロニクス プローブ針ガイド部材及びこれを備えたプローブカード並びにそれを用いる半導体装置の試験方法
TWI534432B (zh) * 2010-09-07 2016-05-21 瓊斯科技國際公司 用於微電路測試器之電氣傳導針腳
ITMI20110615A1 (it) * 2011-04-12 2012-10-13 Technoprobe Spa Testa di misura per un apparecchiatura di test di dispositivi elettronici
KR20170032381A (ko) * 2014-07-14 2017-03-22 테크노프로브 에스.피.에이. 테스트 헤드용 콘택 프로브 및 그 제조 방법
KR20170092523A (ko) * 2014-12-04 2017-08-11 테크노프로브 에스.피.에이. 수직형 프로브들을 포함하는 테스트 헤드
EP3268752A1 (en) * 2015-03-13 2018-01-17 Technoprobe S.p.A Testing head with vertical probes having an improved sliding movement within respective guide holes and correct holding of the probes within the testing head under different operative conditions
TWI704352B (zh) * 2015-03-13 2020-09-11 義大利商探針科技公司 測試頭之接觸探針
JP7032167B2 (ja) * 2018-02-09 2022-03-08 日置電機株式会社 プローブピン、プローブユニットおよび検査装置
CN108593980A (zh) * 2018-04-18 2018-09-28 强半导体（苏州）有限公司 一种接触探针、测试头及接触探针的制造方法
IT201800021253A1 (it) * 2018-12-27 2020-06-27 Technoprobe Spa Testa di misura a sonde verticali avente un contatto perfezionato con un dispositivo da testare
KR102158735B1 (ko) * 2019-02-15 2020-09-22 피닉슨컨트롤스 주식회사 플로팅 구조의 프로브 장치
KR102212346B1 (ko) * 2019-12-17 2021-02-04 주식회사 제네드 프로브 핀
JP7816951B2 (ja) * 2021-11-11 2026-02-18 株式会社エンプラス コンタクトプローブ
CN114460338A (zh) * 2022-01-25 2022-05-10 温州市坤顺数控科技有限公司 一种旋转探针接触模组

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0256541A3 (de) * 1986-08-19 1990-03-14 Feinmetall Gesellschaft mit beschrÀ¤nkter Haftung Kontaktiervorrichtung
DE3818728A1 (de) * 1988-06-01 1989-12-14 Feinmetall Gmbh Federkontaktstift
JPH08233860A (ja) * 1995-02-28 1996-09-13 Nec Corp 同軸高周波プローブ及びこの同軸高周波プローブを用いた基板の評価方法
US5923178A (en) * 1997-04-17 1999-07-13 Cerprobe Corporation Probe assembly and method for switchable multi-DUT testing of integrated circuit wafers
US6411112B1 (en) * 1998-02-19 2002-06-25 International Business Machines Corporation Off-axis contact tip and dense packing design for a fine pitch probe
CN1276259C (zh) * 1998-12-02 2006-09-20 佛姆法克特股份有限公司 光刻接触元件
TW459135B (en) * 1999-05-28 2001-10-11 Nhk Spring Co Ltd Conductive contact device
JP4398061B2 (ja) * 2000-04-28 2010-01-13 日置電機株式会社 コンタクトプローブの製造方法
ITMI20010567A1 (it) * 2001-03-19 2002-09-19 Technoprobe S R L Testa di misura a sonde verticali per dispositivi elettronici integrati su semiconduttore
JP2002296297A (ja) * 2001-03-29 2002-10-09 Isao Kimoto 接触子組立体
US6906540B2 (en) * 2001-09-20 2005-06-14 Wentworth Laboratories, Inc. Method for chemically etching photo-defined micro electrical contacts
US6859054B1 (en) * 2003-08-13 2005-02-22 Advantest Corp. Probe contact system using flexible printed circuit board
US6967492B2 (en) * 2003-11-26 2005-11-22 Asm Assembly Automation Ltd. Spring contact probe device for electrical testing

Also Published As

Publication number Publication date
DE602004009662T2 (de) 2008-08-28
WO2005091000A1 (en) 2005-09-29
US7227368B2 (en) 2007-06-05
DE602004009662D1 (de) 2007-12-06
EP1580562A1 (en) 2005-09-28
ATE376679T1 (de) 2007-11-15
CN1934453A (zh) 2007-03-21
US20050270044A1 (en) 2005-12-08
TW200540427A (en) 2005-12-16
JP2007530931A (ja) 2007-11-01
CN100510755C (zh) 2009-07-08
WO2005091000A8 (en) 2006-01-19
EP1580562B1 (en) 2007-10-24

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