PL1606981T3 - Sposób i urządzenie do wyrównywania ustawienia substratu i szablonu drukarskiego podczas nadrukowywania z użyciem pasty lutowniczej - Google Patents

Sposób i urządzenie do wyrównywania ustawienia substratu i szablonu drukarskiego podczas nadrukowywania z użyciem pasty lutowniczej

Info

Publication number
PL1606981T3
PL1606981T3 PL04719948T PL04719948T PL1606981T3 PL 1606981 T3 PL1606981 T3 PL 1606981T3 PL 04719948 T PL04719948 T PL 04719948T PL 04719948 T PL04719948 T PL 04719948T PL 1606981 T3 PL1606981 T3 PL 1606981T3
Authority
PL
Poland
Prior art keywords
substrate
printing
printing screen
detection device
optical detection
Prior art date
Application number
PL04719948T
Other languages
English (en)
Inventor
Roland Heynen
Original Assignee
Ekra Eduard Kraft Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ekra Eduard Kraft Gmbh filed Critical Ekra Eduard Kraft Gmbh
Publication of PL1606981T3 publication Critical patent/PL1606981T3/pl

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/166—Alignment or registration; Control of registration
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0008—Apparatus or processes for manufacturing printed circuits for aligning or positioning of tools relative to the circuit board

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Screen Printers (AREA)
  • Manufacturing Of Printed Wiring (AREA)
PL04719948T 2003-03-13 2004-03-12 Sposób i urządzenie do wyrównywania ustawienia substratu i szablonu drukarskiego podczas nadrukowywania z użyciem pasty lutowniczej PL1606981T3 (pl)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE10311821A DE10311821B4 (de) 2003-03-13 2003-03-13 Verfahren und Vorrichtung zum Ausrichten von Substrat und Druckschablone beim Lotpastendruck
EP04719948A EP1606981B1 (de) 2003-03-13 2004-03-12 Verfahren und vorrichtung zum ausrichten von substrat und druckschablone beim lotpastendruck
PCT/EP2004/002592 WO2004082345A2 (de) 2003-03-13 2004-03-12 Verfahren und vorrichtung zum ausrichten von substrat und druckschablone beim lotpastendruck

Publications (1)

Publication Number Publication Date
PL1606981T3 true PL1606981T3 (pl) 2011-06-30

Family

ID=32920879

Family Applications (1)

Application Number Title Priority Date Filing Date
PL04719948T PL1606981T3 (pl) 2003-03-13 2004-03-12 Sposób i urządzenie do wyrównywania ustawienia substratu i szablonu drukarskiego podczas nadrukowywania z użyciem pasty lutowniczej

Country Status (8)

Country Link
EP (1) EP1606981B1 (pl)
KR (1) KR100998999B1 (pl)
CN (1) CN100539810C (pl)
AT (1) ATE494764T1 (pl)
DE (2) DE10311821B4 (pl)
ES (1) ES2359241T3 (pl)
PL (1) PL1606981T3 (pl)
WO (1) WO2004082345A2 (pl)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102005043833A1 (de) * 2005-09-13 2007-03-29 Ersa Gmbh Vorrichtung zur Ermittlung der Relativposition zwischen zwei im Wesentlichen flächigen Elementen
JP4696861B2 (ja) * 2005-11-11 2011-06-08 パナソニック株式会社 スクリーン印刷装置
JP4964522B2 (ja) 2006-07-12 2012-07-04 ヤマハ発動機株式会社 スクリーン印刷装置
GB2458463B (en) * 2008-03-17 2013-02-20 Dek Int Gmbh Imaging system and method
CN102027812B (zh) * 2008-05-14 2014-10-29 先进装配系统有限责任两合公司 利用固定式印刷头来施加粘滞材料
DE102009053575B4 (de) 2009-11-06 2016-06-30 Ekra Automatisierungssysteme Gmbh Verfahren und Vorrichtung zum Bedrucken eines Substrats, insbesondere einer Leiterplatte, mit einer Druckpaste
DE102010048909A1 (de) 2010-10-11 2012-04-12 Ekra Automatisierungssysteme Gmbh Prozessmaschine, insbesondere zum Bearbeiten und/oder Inspizieren von Substraten
CN102785472A (zh) * 2012-05-08 2012-11-21 常州天合光能有限公司 一种持续监控丝网印刷质量的方法
CN112770503B (zh) * 2020-11-18 2022-07-01 石家庄辐科电子科技有限公司 一种电路板元器件定位方法及装置

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3928527A1 (de) * 1989-08-29 1991-03-14 Ind Siebdruck Systeme Neckarwe Flachbett-siebdruckmaschine zum bedrucken einer elektrischen leiterplatte
DE4222804A1 (de) 1991-07-10 1993-04-01 Raytheon Co Einrichtung und verfahren zur automatischen visuellen pruefung elektrischer und elektronischer baueinheiten
JP3310540B2 (ja) * 1996-05-22 2002-08-05 松下電器産業株式会社 スクリーン印刷方法とその装置
KR100207004B1 (ko) 1996-12-27 1999-07-01 이종수 인쇄회로기판의 솔더 페이스트 인쇄 형상 검사방법 및 그 장치
JPH11218406A (ja) * 1998-02-03 1999-08-10 Tani Denki Kogyo Kk 基板位置認識マーク検出装置および基板位置認識マーク検出方法
JP2001127420A (ja) 1999-10-22 2001-05-11 Takeda Itsuo 電子パーツ搭載時の位置決め方法及び装置
GB2377908A (en) * 2001-05-31 2003-01-29 Blakell Europlacer Ltd Screen printer for PCB with alignment apparatus

Also Published As

Publication number Publication date
KR100998999B1 (ko) 2010-12-09
ES2359241T3 (es) 2011-05-19
CN1788529A (zh) 2006-06-14
WO2004082345A2 (de) 2004-09-23
EP1606981B1 (de) 2011-01-05
DE10311821B4 (de) 2008-11-20
DE10311821A1 (de) 2004-09-30
DE502004012088D1 (de) 2011-02-17
ATE494764T1 (de) 2011-01-15
EP1606981A2 (de) 2005-12-21
CN100539810C (zh) 2009-09-09
WO2004082345A3 (de) 2005-04-21
KR20060002812A (ko) 2006-01-09

Similar Documents

Publication Publication Date Title
WO2003083876A3 (en) Method and apparatus for aligning patterns on a substrate
WO2002063492A8 (en) Method and system for compliance management
EP1381080A3 (en) Component-embedded board fabrication method and apparatus
SG145697A1 (en) Image processing method and system for microfluidic devices
EP1244178A3 (en) Connector for flash memory card, connection structure using connector and electronic apparatus using connection structure
DK1621041T3 (da) Fremgangsmåde og apparatur til forbedring af luftgrænsefladens informationsudveksling under en pakkedata-session i passivstilling
WO2001093310A3 (fr) Dispositif semiconducteur a injection electronique verticale et son procede de fabrication
EP1032251A3 (en) Electric-component mounting apparatus and electric-component mounting method
TW200618233A (en) Connecting substrate, connecting structure, connection method and electronic apparatus
TWI265349B (en) Substrate for electro-optical device, method of manufacturing substrate for electro-optical device, electro-optical device and electronic apparatus
PL1606981T3 (pl) Sposób i urządzenie do wyrównywania ustawienia substratu i szablonu drukarskiego podczas nadrukowywania z użyciem pasty lutowniczej
FI20020927A7 (fi) Menetelmä vastaanottimen tahdistamiseksi, järjestelmä ja elektroniikkalaite
EP2533456A3 (en) A method for receiving data
ITMI20032199A1 (it) Dispositivo di centraggio, per l'allineamento, su macchine
EP1413615A4 (en) DOUBLE-COATED ADHESIVE TAPE AND ITS USE IN MANUFACTURING AN IC-CHIP
TW200720855A (en) Exposure method and exposure apparatus
WO2004097933A3 (en) Method and apparatus for optically aligning integrated circuit devices
ITRE20000124A0 (it) Attrezzatura atta a tipicamente trasformare un telaio montato su cingoli in una macchina posatubi.
ATE334748T1 (de) Verfahren zum befüllen von löchern in substraten
ATE383737T1 (de) Verfahren zum zusammenbau einer schaltung
TW200636521A (en) All surface data for use in substrate inspection
TW200603264A (en) Mask, method for producing the same, deposition method, electronic device, and electronic apparatus
WO2004062428A3 (en) Support apparatus and method
TW200603706A (en) A method of fabricating a built-in chip type substrate
PL1702293T3 (pl) Sposób drukowania i/lub wycinania obrazu