PL1680800T3 - Sposób i urządzenie do obróbki powierzchni wiązką jonową - Google Patents

Sposób i urządzenie do obróbki powierzchni wiązką jonową

Info

Publication number
PL1680800T3
PL1680800T3 PL04802669T PL04802669T PL1680800T3 PL 1680800 T3 PL1680800 T3 PL 1680800T3 PL 04802669 T PL04802669 T PL 04802669T PL 04802669 T PL04802669 T PL 04802669T PL 1680800 T3 PL1680800 T3 PL 1680800T3
Authority
PL
Poland
Prior art keywords
ion beam
substrate
axis
properties
pattern
Prior art date
Application number
PL04802669T
Other languages
English (en)
Inventor
Joachim Mai
Dietmar Roth
Bernd Rau
Karl-Heinz Dittrich
Original Assignee
Roth & Rau Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=34530011&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=PL1680800(T3) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Roth & Rau Ag filed Critical Roth & Rau Ag
Publication of PL1680800T3 publication Critical patent/PL1680800T3/pl

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
    • H01J37/305—Electron-beam or ion-beam tubes for localised treatment of objects for casting, melting, evaporating, or etching
    • H01J37/3053—Electron-beam or ion-beam tubes for localised treatment of objects for casting, melting, evaporating, or etching for evaporating or etching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/36—Gas-filled discharge tubes for cleaning surfaces while plating with ions of materials introduced into the discharge, e.g. introduced by evaporation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y40/00—Manufacture or treatment of nanostructures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/02—Details
    • H01J37/20—Means for supporting or positioning the object or the material; Means for adjusting diaphragms or lenses associated with the support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
    • H01J37/305—Electron-beam or ion-beam tubes for localised treatment of objects for casting, melting, evaporating, or etching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
    • H01J37/317—Electron-beam or ion-beam tubes for localised treatment of objects for changing properties of the objects or for applying thin layers thereon, e.g. for ion implantation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
    • H01J37/317—Electron-beam or ion-beam tubes for localised treatment of objects for changing properties of the objects or for applying thin layers thereon, e.g. for ion implantation
    • H01J37/3174—Particle-beam lithography, e.g. electron beam lithography
    • H01J37/3177—Multi-beam, e.g. fly's eye, comb probe
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P30/00—Ion implantation into wafers, substrates or parts of devices
    • H10P30/20—Ion implantation into wafers, substrates or parts of devices into semiconductor materials, e.g. for doping
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/20—Positioning, supporting, modifying or maintaining the physical state of objects being observed or treated
    • H01J2237/202—Movement
    • H01J2237/20207—Tilt
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/20—Positioning, supporting, modifying or maintaining the physical state of objects being observed or treated
    • H01J2237/202—Movement
    • H01J2237/20214—Rotation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/20—Positioning, supporting, modifying or maintaining the physical state of objects being observed or treated
    • H01J2237/202—Movement
    • H01J2237/20221—Translation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/20—Positioning, supporting, modifying or maintaining the physical state of objects being observed or treated
    • H01J2237/202—Movement
    • H01J2237/20221—Translation
    • H01J2237/20228—Mechanical X-Y scanning
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/20—Positioning, supporting, modifying or maintaining the physical state of objects being observed or treated
    • H01J2237/202—Movement
    • H01J2237/20221—Translation
    • H01J2237/20235—Z movement or adjustment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/20—Positioning, supporting, modifying or maintaining the physical state of objects being observed or treated
    • H01J2237/206—Modifying objects while observing
    • H01J2237/2067—Surface alteration
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/245—Detection characterised by the variable being measured
    • H01J2237/24507—Intensity, dose or other characteristics of particle beams or electromagnetic radiation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/30—Electron or ion beam tubes for processing objects
    • H01J2237/304—Controlling tubes
    • H01J2237/30455—Correction during exposure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/30—Electron or ion beam tubes for processing objects
    • H01J2237/317—Processing objects on a microscale
    • H01J2237/31701—Ion implantation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/30—Electron or ion beam tubes for processing objects
    • H01J2237/317—Processing objects on a microscale
    • H01J2237/3174—Etching microareas
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/30—Electron or ion beam tubes for processing objects
    • H01J2237/317—Processing objects on a microscale
    • H01J2237/3175—Lithography
    • H01J2237/31774—Multi-beam

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Analytical Chemistry (AREA)
  • Nanotechnology (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Mathematical Physics (AREA)
  • Theoretical Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Physical Vapour Deposition (AREA)
  • Drying Of Semiconductors (AREA)
  • Welding Or Cutting Using Electron Beams (AREA)
  • ing And Chemical Polishing (AREA)
PL04802669T 2003-10-31 2004-10-29 Sposób i urządzenie do obróbki powierzchni wiązką jonową PL1680800T3 (pl)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE10351059A DE10351059B4 (de) 2003-10-31 2003-10-31 Verfahren und Vorrichtung zur Ionenstrahlbearbeitung von Oberflächen
EP04802669A EP1680800B1 (de) 2003-10-31 2004-10-29 Verfahren und vorrichtung zur ionenstrahlbearbeitung von oberflächen
PCT/DE2004/002436 WO2005042141A2 (de) 2003-10-31 2004-10-29 Verfahren und vorrichtung zur ionenstrahlbearbeitung von oberflächen

Publications (1)

Publication Number Publication Date
PL1680800T3 true PL1680800T3 (pl) 2010-07-30

Family

ID=34530011

Family Applications (1)

Application Number Title Priority Date Filing Date
PL04802669T PL1680800T3 (pl) 2003-10-31 2004-10-29 Sposób i urządzenie do obróbki powierzchni wiązką jonową

Country Status (9)

Country Link
US (1) US8790498B2 (pl)
EP (1) EP1680800B1 (pl)
JP (1) JP4786541B2 (pl)
KR (1) KR101119282B1 (pl)
CN (1) CN1886818B (pl)
AT (1) ATE450881T1 (pl)
DE (2) DE10351059B4 (pl)
PL (1) PL1680800T3 (pl)
WO (1) WO2005042141A2 (pl)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102007048559B4 (de) * 2007-10-09 2009-10-01 Ntg Neue Technologien Gmbh & Co Kg Vorrichtung zur Strahlbearbeitung von Werkstücken, Ionenstrahlbearbeitungsanlage
CN101551527B (zh) * 2009-05-07 2011-09-14 厦门美澜光电科技有限公司 光学基片隐形图案的制备方法
CN101559627B (zh) * 2009-05-25 2011-12-14 天津大学 粒子束辅助单晶脆性材料超精密加工方法
DE102010040324B3 (de) 2010-09-07 2012-05-10 Asphericon Gmbh Ionenstrahlvorrichtung zur Bearbeitung eines Substrats
DE102011111686B4 (de) 2011-08-26 2017-04-13 Asphericon Gmbh Verfahren zur Bearbeitung eines Substrats mittels eines Ionenstrahls und Ionenstrahlvorrichtung zur Bearbeitung eines Substrats
US8502172B1 (en) * 2012-06-26 2013-08-06 Fei Company Three dimensional fiducial
DE102015214468A1 (de) 2015-07-30 2016-07-28 Carl Zeiss Smt Gmbh Verfahren zum Bearbeiten eines Werkstücks bei der Herstellung eines optischen Elements
WO2017056138A1 (ja) 2015-10-02 2017-04-06 キヤノンアネルバ株式会社 イオンビームエッチング方法およびイオンビームエッチング装置
US20170307839A1 (en) * 2016-04-26 2017-10-26 Ofs Fitel, Llc Surface Treated Optical Fibers And Cables For Installation At Customer Premises
DE102016119437B4 (de) * 2016-10-12 2024-05-23 scia Systems GmbH Verfahren zum Bearbeiten einer Oberfläche mittels eines Teilchenstrahls
DE102016119791A1 (de) * 2016-10-18 2018-04-19 scia Systems GmbH Verfahren und Vorrichtung zum Bearbeiten einer Oberfläche eines Substrates mittels eines Teilchenstrahls
DE102017209350A1 (de) 2017-06-01 2017-08-03 Carl Zeiss Smt Gmbh Ionenstrahlbearbeitungsverfahren und vorrichtung hierfür
CN110666596B (zh) * 2019-09-02 2021-08-06 中国兵器科学研究院宁波分院 一种用于光学元件的定位及姿态调整装置
DE102024204310A1 (de) * 2024-05-08 2025-11-13 Carl Zeiss Smt Gmbh Vorrichtung und Verfahren zur Strahlbearbeitung einer optischen Komponente
DE102024211308A1 (de) 2024-11-26 2025-10-16 Carl Zeiss Smt Gmbh Vorrichtung zur Ionenstrahlbearbeitung und Verfahren zum zumindest teilweisen Entfernen von Kontaminationen

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE39724C (de) J. RÖMHELD in Mainz Mahlgang mit schwingendem walzenförmigem Mühlsteine
US3699334A (en) * 1969-06-16 1972-10-17 Kollsman Instr Corp Apparatus using a beam of positive ions for controlled erosion of surfaces
JPS63279552A (ja) * 1987-05-11 1988-11-16 Nissin Electric Co Ltd イオンビ−ム照射装置
DD298750A5 (de) 1990-04-09 1992-03-12 Veb Carl Zeiss Jena,De Verfahren zur steuerung der ionenstrahlbearbeitung von festkoerperoberflaechen
JP2886649B2 (ja) * 1990-09-27 1999-04-26 株式会社日立製作所 イオンビーム加工方法及びその装置
JP2558341Y2 (ja) * 1991-06-12 1997-12-24 日新電機株式会社 ビームプロファイルモニタ
JP3230834B2 (ja) * 1992-04-07 2001-11-19 株式会社東芝 成膜方法およびその装置
JPH0613013A (ja) * 1992-06-29 1994-01-21 Sumitomo Electric Ind Ltd イオンビームを集束して加工を行う装置
JP3236484B2 (ja) * 1994-09-22 2001-12-10 株式会社荏原製作所 エネルギービーム加工法
JPH08241841A (ja) * 1995-03-03 1996-09-17 Hitachi Ltd パターンイオンビーム投射方法およびその装置
JPH10321175A (ja) * 1997-05-20 1998-12-04 Kobe Steel Ltd イオンビーム発生装置
DE19814760A1 (de) 1998-04-02 1999-10-07 Inst Oberflaechenmodifizierung Verfahren zur Ionenstrahlbearbeitung von Festkörperoberflächen bei rechteckförmigem Strahlquerschnitt
JP2001077058A (ja) * 1999-09-08 2001-03-23 Seiko Instruments Inc 集束イオンビームを用いた加工方法
RU2173003C2 (ru) * 1999-11-25 2001-08-27 Септре Электроникс Лимитед Способ образования кремниевой наноструктуры, решетки кремниевых квантовых проводков и основанных на них устройств
EP1303866B1 (en) * 2000-07-10 2009-12-09 TEL Epion Inc. System and method for improving thin films by gas cluster ion be am processing
JP4647820B2 (ja) * 2001-04-23 2011-03-09 キヤノン株式会社 荷電粒子線描画装置、および、デバイスの製造方法

Also Published As

Publication number Publication date
US20080110745A1 (en) 2008-05-15
DE10351059B4 (de) 2007-03-01
KR101119282B1 (ko) 2012-03-15
JP2007513465A (ja) 2007-05-24
ATE450881T1 (de) 2009-12-15
EP1680800A2 (de) 2006-07-19
DE10351059A1 (de) 2005-06-16
DE502004010464D1 (de) 2010-01-14
CN1886818A (zh) 2006-12-27
JP4786541B2 (ja) 2011-10-05
KR20060105011A (ko) 2006-10-09
WO2005042141A2 (de) 2005-05-12
US8790498B2 (en) 2014-07-29
WO2005042141A3 (de) 2005-10-13
EP1680800B1 (de) 2009-12-02
CN1886818B (zh) 2010-10-06

Similar Documents

Publication Publication Date Title
PL1680800T3 (pl) Sposób i urządzenie do obróbki powierzchni wiązką jonową
WO2002019374A3 (en) Methods and apparatus for adjusting beam parallelism in ion implanters
SG125965A1 (en) Laser beam processing method and laser beam processing machine
TW200608489A (en) Plasma treatment method and plasma etching method
DE60033664D1 (de) Veränderbarer gasionenclusterstrahl zur glättung von oberflächen
ATE524771T1 (de) Verfahren und vorrichtung zum einrichten einer bahnkurve einer robotervorrichtung
DE50208035D1 (de) Vorrichtung zur Randbearbeitung von optischen Linsen
GB2445333A (en) X & Y orthogonal cut direction processing with set beam separation using 45 degree beam split orientation apparatus and method
DE50103034D1 (de) Vorrichtung und Verfahren zur Oberflächenbehandlung von Werkstücken
TW200717661A (en) Method and apparatus for laser annealing
EP0964074A3 (en) Ion implantation control using optical emission spectroscopy
DE602005002593D1 (de) Verfahren und Vorrichtung zur Innenbeschichtung von vorgefertigter Rohrleitungen an Ort und Stelle
TW200741950A (en) Electrostatic chuck assembly with dielectric material and/or cavity having varying thickness, profile and/or shape, method of use and apparatus incorporating same
WO2008091242A3 (en) Systems and methods of laser texturing and crystallization of material surfaces
EP0942453A3 (en) Monitoring of plasma constituents using optical emission spectroscopy
DE602004024675D1 (de) Plasmaverarbeitungsvorrichtung und plasmaverarbeitungsverfahren
DE60015270D1 (de) Verfahren und gerät zur stabilisierung eines plasmas
TW200503062A (en) Surface processing apparatus and method for plasma treatment
ATE511939T1 (de) Positionierverfahren und -vorrichtung
TW200707556A (en) Methods and apparatus for adjusting ion implant parameters for improved process control
ATE381909T1 (de) Implantat, beispielsweise zahnimplantat
DK0780485T3 (da) Fremgangsmåde og indretning til at dekapere et metalsubstrat
WO2003070998A8 (en) Method and apparatus for ion beam coating
TW200726559A (en) Cutting off processing system for brittle material and method for the same
DE60333098D1 (de) Verfahren und vorrichtung zum aufbringen eines überzugs auf eine dreidimensionale fläche