PL1701605T3 - Taśma uszczelniająca przed promieniowaniem elektromagnetycznym wysokiej częstotliwości - Google Patents

Taśma uszczelniająca przed promieniowaniem elektromagnetycznym wysokiej częstotliwości

Info

Publication number
PL1701605T3
PL1701605T3 PL05005343T PL05005343T PL1701605T3 PL 1701605 T3 PL1701605 T3 PL 1701605T3 PL 05005343 T PL05005343 T PL 05005343T PL 05005343 T PL05005343 T PL 05005343T PL 1701605 T3 PL1701605 T3 PL 1701605T3
Authority
PL
Poland
Prior art keywords
emi shielding
shielding gasket
gasket
emi
shielding
Prior art date
Application number
PL05005343T
Other languages
English (en)
Inventor
Paul Rutherford
Michael Joist
Peter Dratwa
Original Assignee
Mtc Micro Tech Components Gmbh
Pentair Technical Solutions GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mtc Micro Tech Components Gmbh, Pentair Technical Solutions GmbH filed Critical Mtc Micro Tech Components Gmbh
Publication of PL1701605T3 publication Critical patent/PL1701605T3/pl

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/12—Resilient or clamping means for holding component to structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/0015—Gaskets or seals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W78/00—Detachable holders for supporting packaged chips in operation
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S277/00—Seal for a joint or juncture
    • Y10S277/92—Seal including electromagnetic shielding feature

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
PL05005343T 2005-03-11 2005-03-11 Taśma uszczelniająca przed promieniowaniem elektromagnetycznym wysokiej częstotliwości PL1701605T3 (pl)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP05005343A EP1701605B1 (de) 2005-03-11 2005-03-11 HF-Dichtungsstreifen

Publications (1)

Publication Number Publication Date
PL1701605T3 true PL1701605T3 (pl) 2008-07-31

Family

ID=34934206

Family Applications (1)

Application Number Title Priority Date Filing Date
PL05005343T PL1701605T3 (pl) 2005-03-11 2005-03-11 Taśma uszczelniająca przed promieniowaniem elektromagnetycznym wysokiej częstotliwości

Country Status (6)

Country Link
US (1) US7473855B2 (pl)
EP (1) EP1701605B1 (pl)
JP (1) JP4642676B2 (pl)
KR (1) KR101059616B1 (pl)
DE (1) DE502005002990D1 (pl)
PL (1) PL1701605T3 (pl)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090000818A1 (en) * 2007-06-29 2009-01-01 Michael Poulsen Perforated emi gaskets and related methods
CN101389206A (zh) * 2007-09-14 2009-03-18 鸿富锦精密工业（深圳）有限公司 屏蔽装置以及应用该屏蔽装置的电子设备
US7763810B2 (en) 2007-11-07 2010-07-27 Laird Technologies, Inc. Fabric-over-foam EMI gaskets having transverse slits and related methods
CN103098574A (zh) * 2010-07-20 2013-05-08 布雷迪转换公司 导电接地垫
US8724343B2 (en) * 2011-06-27 2014-05-13 Crestron Electronics Inc. Hi-definition multimedia interface shield with fingers
WO2014022125A1 (en) 2012-07-28 2014-02-06 Laird Technologies, Inc. Metallized film-over-foam contacts
US9226433B2 (en) 2013-03-15 2015-12-29 Laird Technologies, Inc. Selectively conductive EMI gaskets
US8884168B2 (en) 2013-03-15 2014-11-11 Laird Technologies, Inc. Selectively conductive EMI gaskets
US9447629B2 (en) * 2014-10-16 2016-09-20 Hoffman Enclosures, Inc. Strip gasket
US11483948B2 (en) 2019-08-28 2022-10-25 Laird Technologies, Inc. Thermal interface materials including memory foam cores
CN111590804B (zh) * 2020-05-11 2022-03-01 诺兰特新材料(北京)有限公司 用于制备电磁屏蔽密封条的方法和系统
US12209664B2 (en) 2020-12-10 2025-01-28 Laird Technologies (Shenzhen) Ltd. Electrically and thermally conductive gaskets
EP4013203B1 (en) 2020-12-10 2024-07-31 Laird Technologies (Shenzhen) Ltd. Electrically and thermally conductive gaskets

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2184294A (en) * 1985-12-13 1987-06-17 Instr Specialties Co Inc An electromagnetic shielding device
US5070216A (en) * 1990-04-27 1991-12-03 Chomerics, Inc. Emi shielding gasket
JP3815820B2 (ja) * 1996-02-14 2006-08-30 日本ジッパーチュービング株式会社 異形プロファイルの電磁波シールド性導通材の製造法
JP3794758B2 (ja) * 1996-05-20 2006-07-12 日本ジッパーチュービング株式会社 異形プロファイル導通体の製造法
US6294729B1 (en) * 1997-10-31 2001-09-25 Laird Technologies Clad polymer EMI shield
JP4115567B2 (ja) * 1997-11-06 2008-07-09 孝次 広野 電磁波シールド用ガスケット
JPH11274793A (ja) * 1998-03-19 1999-10-08 Porimatec Kk 電磁波シールド用パッキンおよびその製造法
US6282101B1 (en) * 1999-05-11 2001-08-28 Lucent Technologies Inc. EMI/ESD shielding assembly for an electronic system
KR200182453Y1 (ko) * 1999-11-22 2000-05-15 익스팬전자주식회사 접촉 신뢰성을 향상시킨 도전성 개스킷
US6483023B1 (en) * 2000-01-04 2002-11-19 Fujitsu Network Communications, Inc. Fabric wrapped over spring EMI gasket
JP3526825B2 (ja) * 2000-09-29 2004-05-17 北川工業株式会社 電磁波シールド用ガスケット
JP2003031984A (ja) * 2001-07-18 2003-01-31 Seiwa Electric Mfg Co Ltd 電磁波シールド用ガスケット
SE521689C2 (sv) * 2001-10-26 2003-11-25 Nolato Silikonteknik Ab Element för elektromagnetisk skärmning samt metod för framställning därav

Also Published As

Publication number Publication date
KR20060097674A (ko) 2006-09-14
US20060272855A1 (en) 2006-12-07
KR101059616B1 (ko) 2011-08-25
DE502005002990D1 (de) 2008-04-10
EP1701605A1 (de) 2006-09-13
JP2006253697A (ja) 2006-09-21
JP4642676B2 (ja) 2011-03-02
US7473855B2 (en) 2009-01-06
EP1701605B1 (de) 2008-02-27

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