PL1945729T3 - Układ klejący o niskiej emisji - Google Patents

Układ klejący o niskiej emisji

Info

Publication number: PL1945729T3
Authority: PL; Poland
Prior art keywords: adhesive system; low emission; emission adhesive; urea; formaldehyde scavenger
Prior art date: 2005-10-05

Application number

PL06799568T

Other languages

English (en)

Inventor

Astrid Pedersen

Per Olav Sandbakken

Original Assignee

Dynea As

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2005-10-05

Filing date

2006-10-05

Publication date

2012-11-30

Family has litigation

First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=35307892&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=PL1945729(T3) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.

2006-10-05 Application filed by Dynea As filed Critical Dynea As

2012-11-30 Publication of PL1945729T3 publication Critical patent/PL1945729T3/pl

Links

239000000853 adhesive Substances 0.000 title abstract 4
230000001070 adhesive effect Effects 0.000 title abstract 4
WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 abstract 6
239000002516 radical scavenger Substances 0.000 abstract 2
GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 abstract 2
XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Chemical compound NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 abstract 1
229920001807 Urea-formaldehyde Polymers 0.000 abstract 1
GZCGUPFRVQAUEE-SLPGGIOYSA-N aldehydo-D-glucose Chemical compound OC[C@@H](O)[C@@H](O)[C@H](O)[C@@H](O)C=O GZCGUPFRVQAUEE-SLPGGIOYSA-N 0.000 abstract 1
239000004202 carbamide Substances 0.000 abstract 1
239000003795 chemical substances by application Substances 0.000 abstract 1
239000004815 dispersion polymer Substances 0.000 abstract 1
238000004519 manufacturing process Methods 0.000 abstract 1
238000000034 method Methods 0.000 abstract 1
239000004848 polyfunctional curative Substances 0.000 abstract 1

Classifications

- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J161/00—Adhesives based on condensation polymers of aldehydes or ketones; Adhesives based on derivatives of such polymers
- C09J161/20—Condensation polymers of aldehydes or ketones with only compounds containing hydrogen attached to nitrogen
- C09J161/22—Condensation polymers of aldehydes or ketones with only compounds containing hydrogen attached to nitrogen of aldehydes with acyclic or carbocyclic compounds
- C09J161/24—Condensation polymers of aldehydes or ketones with only compounds containing hydrogen attached to nitrogen of aldehydes with acyclic or carbocyclic compounds with urea or thiourea
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J159/00—Adhesives based on polyacetals; Adhesives based on derivatives of polyacetals
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
- C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
- C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
- C08L2666/04—Macromolecular compounds according to groups C08L7/00 - C08L49/00, or C08L55/00 - C08L57/00; Derivatives thereof
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L59/00—Compositions of polyacetals; Compositions of derivatives of polyacetals

Landscapes

Chemical & Material Sciences (AREA)
Organic Chemistry (AREA)
Adhesives Or Adhesive Processes (AREA)

PL06799568T 2005-10-05 2006-10-05 Układ klejący o niskiej emisji PL1945729T3 (pl)

Applications Claiming Priority (3)

Application Number	Priority Date	Filing Date	Title
NO20054572A NO20054572L (no)	2005-10-05	2005-10-05	Lavemisjons parkettlim
PCT/NO2006/000343 WO2007040410A1 (en)	2005-10-05	2006-10-05	Low emission adhesive system
EP06799568A EP1945729B1 (en)	2005-10-05	2006-10-05	Low emission adhesive system

Publications (1)

Publication Number	Publication Date
PL1945729T3 true PL1945729T3 (pl)	2012-11-30

Family

ID=35307892

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
PL06799568T PL1945729T3 (pl)	2005-10-05	2006-10-05	Układ klejący o niskiej emisji

Country Status (6)

Country	Link
EP (1)	EP1945729B1 (pl)
AT (1)	ATE556123T1 (pl)
DK (1)	DK1945729T3 (pl)
NO (2)	NO20054572L (pl)
PL (1)	PL1945729T3 (pl)
WO (1)	WO2007040410A1 (pl)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
NZ582044A (en)	2007-07-05	2012-05-25	Akzo Nobel Coatings Int Bv	Hardener composition, adhesive system and method of gluing
MX2010002532A (es)	2007-09-21	2010-07-02	Saint Gobain Abrasives Inc	Formulacion de resina fenolica y revestimientos para productos abrasivos.
FI122590B (fi) *	2007-12-03	2012-04-13	Upm Kymmene Oyj	Menetelmä ja laitteisto lämpötilojen mittaamiseksi liimalevyn tai vastaavan tuotteen valmistuksen yhteydessä
GB2462619A (en)	2008-08-13	2010-02-17	Dynea Austria Gmbh	Two-component adhesive system
FI121623B (fi)	2008-12-08	2011-02-15	Metsaeliitto Osuuskunta	Menetelmä puuviilulevyn valmistamiseksi
CN102407553A (zh) *	2010-09-21	2012-04-11	大亚科技股份有限公司	增白型e1级地板基材用高密度纤维板的制造方法
GB201105583D0 (en) *	2011-04-01	2011-05-18	Dynea Oy	System for form pressing with high production efficiency
DK2731976T3 (en)	2011-07-15	2017-07-10	Akzo Nobel Coatings Int Bv	ADHESIVE SYSTEM
WO2014008947A1 (en)	2012-07-13	2014-01-16	Akzo Nobel Coatings International B.V.	Adhesive system

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
GB589131A (en)	1944-01-29	1947-06-12	Arthur Mark Howald	Adhesives
JPS5615837A (en) *	1979-07-19	1981-02-16	Mitsubishi Paper Mills Ltd	Removal of residual formaldehyde
US4409293A (en)	1982-09-10	1983-10-11	Borden, Inc.	Wood composites of low formaldehyde emission
IT1244634B (it) *	1991-02-08	1994-08-08	Nat Starch & Chemical S P A	Composizione indurente per colle urea-formaldeide, procedimento per lasua produzione e kit che la comprende.
DE4420484C2 (de)	1994-06-11	1999-02-04	Clariant Gmbh	Wäßriger Dispersionsklebstoff auf Polyvinylester-Basis, Verfahren zur Herstellung sowie dessen Verwendung
US5684118A (en)	1996-03-26	1997-11-04	Georgia-Pacific Resins, Inc.	Method of scavenging formaldehyde using a low mole ratio melamine-urea-formaldehyde resin
EP1368169B1 (en)	2001-03-12	2008-10-01	Akzo Nobel Coatings International B.V.	Method of reducing the emission of formaldehyde from formaldehyde laden layered products
US6906132B2 (en)	2001-09-04	2005-06-14	Awi Licensing Company	Low formaldehyde emission coatings and binders from formaldehyde-based resins

2005
- 2005-10-05 NO NO20054572A patent/NO20054572L/no not_active Application Discontinuation
2006
- 2006-10-05 DK DK06799568.8T patent/DK1945729T3/da active
- 2006-10-05 PL PL06799568T patent/PL1945729T3/pl unknown
- 2006-10-05 WO PCT/NO2006/000343 patent/WO2007040410A1/en not_active Ceased
- 2006-10-05 AT AT06799568T patent/ATE556123T1/de active
- 2006-10-05 EP EP06799568A patent/EP1945729B1/en not_active Revoked
2008
- 2008-05-02 NO NO20082037A patent/NO20082037L/no not_active Application Discontinuation

Also Published As

Publication number	Publication date
NO20054572L (no)	2007-04-10
DK1945729T3 (da)	2012-07-23
EP1945729B1 (en)	2012-05-02
NO20054572D0 (no)	2005-10-05
NO20082037L (no)	2008-07-01
EP1945729A1 (en)	2008-07-23
ATE556123T1 (de)	2012-05-15
WO2007040410A1 (en)	2007-04-12

Similar Documents

Publication	Publication Date	Title
NO20082037L (no)	2008-07-01	Lavemisjons parkettlim
MX2009005356A (es)	2009-07-31	Resinas epoxicas comprendiendo un agente de curado de diamina cicloalifatica.
TW200738837A (en)	2007-10-16	Adhesive for polarizer plate and method for manufacturing the same
WO2010024642A3 (en)	2010-06-24	Phenol novolac resin, phenol novolac epoxy resin and epoxy resin composition
MX2009003036A (es)	2009-06-01	Resinas de alquilresorcinol modificadas y aplicaciones de las mismas.
WO2005072260A3 (en)	2006-03-16	Formaldehyde-free adhesives and lignocellulosic composites made from the adhesives
MY148111A (en)	2013-02-28	Curable silicone composition and electronic component
EP1125960A3 (de)	2002-08-21	Latente Kombinationsverbindungen und latente Ammoniumsalze aus Epoxidharzhärter und Flammschutzmittel sowie daraus hergestellte Epoxidharz-Systeme und -Produkte
NO20043469L (no)	2005-02-23	Straleherdbare harpikser og en fremgangsmate til deres fremstilling
MY163329A (en)	2017-09-15	Maleimide resins
TW200643062A (en)	2006-12-16	Method of manufacturing water-absorbent resin agglomerates, and water-absorbent resin agglomerates
DE602004030281D1 (de)	2011-01-05	Neue phenolharze
DK1448741T3 (da)	2007-09-10	Fremgangsmåde til limning af træmaterialer
WO2008143253A1 (ja)	2008-11-27	接着剤組成物及びこれを用いた接着フィルム
TW200700453A (en)	2007-01-01	Method for producing cure system, adhesive system, and electronic device
TW200708545A (en)	2007-03-01	Cure system, adhesive system, electronic device
WO2010033593A3 (en)	2010-07-08	Rosin derived epoxides and curing agents
BRPI0417564A (pt)	2007-03-27	fertilizante nitrogenado granular com liberação prolongada
TW200613432A (en)	2006-05-01	Cationic photopolymerizable epoxy resin composition, minute structural member using the same and method for manufacturing minute structural member
EP2098561A3 (en)	2011-03-09	Composite material formulation
TW200634123A (en)	2006-10-01	Heat-activatable adhesive tape for FPCB-adhesion
TW200801109A (en)	2008-01-01	Solder-resistant flexible thermal-set epoxy resin system
WO2007061748A3 (en)	2009-04-16	Adhesive system and method of making same
TW200609278A (en)	2006-03-16	Sheet-like nonflammable molded form
MY152852A (en)	2014-11-28	Liquid epoxy resin composition and adhesive using same