PL1972405T3 - Urządzenie i sposób wstępnej obróbki podzespołów elektronicznych przed lutowaniem - Google Patents

Urządzenie i sposób wstępnej obróbki podzespołów elektronicznych przed lutowaniem

Info

Publication number
PL1972405T3
PL1972405T3 PL08001356T PL08001356T PL1972405T3 PL 1972405 T3 PL1972405 T3 PL 1972405T3 PL 08001356 T PL08001356 T PL 08001356T PL 08001356 T PL08001356 T PL 08001356T PL 1972405 T3 PL1972405 T3 PL 1972405T3
Authority
PL
Poland
Prior art keywords
pretreating
electronic components
components before
before soldering
soldering
Prior art date
Application number
PL08001356T
Other languages
English (en)
Inventor
Klaus W Gerstenberg
Ernst Wandke
Original Assignee
Linde Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Linde Ag filed Critical Linde Ag
Publication of PL1972405T3 publication Critical patent/PL1972405T3/pl

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
    • B23K1/206—Cleaning
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3489—Composition of fluxes; Application thereof; Other processes of activating the contact surfaces
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/09—Treatments involving charged particles
    • H05K2203/095—Plasma, e.g. for treating a substrate to improve adhesion with a conductor or for cleaning holes

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Plasma Technology (AREA)
  • Arc Welding In General (AREA)
  • Manufacturing Of Printed Wiring (AREA)
PL08001356T 2007-03-20 2008-01-24 Urządzenie i sposób wstępnej obróbki podzespołów elektronicznych przed lutowaniem PL1972405T3 (pl)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102007013326A DE102007013326A1 (de) 2007-03-20 2007-03-20 Vorrichtung und Verfahren zur Vorbehandlung von elektronischen Bauelementen vor dem Löten
EP07012718A EP1972404A1 (de) 2007-03-20 2007-06-28 Vorrichtung und Verfahren zur Vorbehandlung von elektronischen Bauelementen vor dem Löten
EP08001356A EP1972405B1 (de) 2007-03-20 2008-01-24 Vorrichtung und Verfahren zur Vorbehandlung von elektronischen Bauelementen vor dem Löten

Publications (1)

Publication Number Publication Date
PL1972405T3 true PL1972405T3 (pl) 2013-03-29

Family

ID=38521346

Family Applications (1)

Application Number Title Priority Date Filing Date
PL08001356T PL1972405T3 (pl) 2007-03-20 2008-01-24 Urządzenie i sposób wstępnej obróbki podzespołów elektronicznych przed lutowaniem

Country Status (8)

Country Link
US (1) US20080230591A1 (pl)
EP (2) EP1972404A1 (pl)
KR (1) KR101428658B1 (pl)
CN (1) CN101269431A (pl)
DE (1) DE102007013326A1 (pl)
MY (1) MY151672A (pl)
PL (1) PL1972405T3 (pl)
TW (1) TWI391198B (pl)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101998773A (zh) * 2009-08-20 2011-03-30 琳德股份公司 印刷电路板组装中有机可焊性防腐涂层的等离子体处理
DE112012002786A5 (de) 2011-07-01 2014-03-20 Reinhausen Plasma Gmbh Vorrichtung und Verfahren zur Plasmabehandlung von Oberflächen
JP2013143542A (ja) * 2012-01-12 2013-07-22 Tokyo Electron Ltd 半導体デバイス製造システム及び半導体デバイス製造方法
DE102013112348B4 (de) * 2013-11-11 2024-05-08 Endress+Hauser SE+Co. KG Lotauftragsstempel und Verfahren zur Reparatur einer Leiterplatte mit zumindest einem defekten Bauteil
CN117276086A (zh) * 2023-09-20 2023-12-22 液化空气(中国)投资有限公司 一种表面处理方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4032328A1 (de) * 1989-11-06 1991-09-19 Wls Karl Heinz Grasmann Weichl Verfahren und vorrichtung zur verarbeitung von zu verloetenden fuegepartnern
WO1995015832A1 (en) * 1993-12-09 1995-06-15 Seiko Epson Corporation Combining method and apparatus using solder
FR2713528B1 (fr) * 1993-12-15 1996-01-12 Air Liquide Procédé et dispositif de fluxage par voie sèche de surfaces métalliques avant brasage ou étamage.
KR19980032019A (ko) * 1996-10-28 1998-07-25 야스카와 히데아키 표면 처리 방법 및 그 장치
US6607613B2 (en) * 1998-07-10 2003-08-19 International Business Machines Corporation Solder ball with chemically and mechanically enhanced surface properties
US6521857B1 (en) * 2001-11-19 2003-02-18 Geomat Insights, Llc Plasma enhanced bonding method and device
US7434719B2 (en) * 2005-12-09 2008-10-14 Air Products And Chemicals, Inc. Addition of D2 to H2 to detect and calibrate atomic hydrogen formed by dissociative electron attachment

Also Published As

Publication number Publication date
US20080230591A1 (en) 2008-09-25
CN101269431A (zh) 2008-09-24
KR20080085688A (ko) 2008-09-24
TWI391198B (zh) 2013-04-01
TW200920531A (en) 2009-05-16
EP1972405A1 (de) 2008-09-24
EP1972405B1 (de) 2012-11-14
DE102007013326A1 (de) 2008-09-25
EP1972404A1 (de) 2008-09-24
MY151672A (en) 2014-06-30
KR101428658B1 (ko) 2014-08-08

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