PL2019579T3 - Półprzewodnikowy moduł mocy z dołączonym wspornikiem podłoża i sposób jego wytwarzania - Google Patents

Półprzewodnikowy moduł mocy z dołączonym wspornikiem podłoża i sposób jego wytwarzania

Info

Publication number
PL2019579T3
PL2019579T3 PL08012359T PL08012359T PL2019579T3 PL 2019579 T3 PL2019579 T3 PL 2019579T3 PL 08012359 T PL08012359 T PL 08012359T PL 08012359 T PL08012359 T PL 08012359T PL 2019579 T3 PL2019579 T3 PL 2019579T3
Authority
PL
Poland
Prior art keywords
semiconductor module
substrate carrier
production method
high performance
corresponding production
Prior art date
Application number
PL08012359T
Other languages
English (en)
Inventor
Christian Kroneder
Original Assignee
Semikron Elektronik Gmbh & Co Kg
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Semikron Elektronik Gmbh & Co Kg filed Critical Semikron Elektronik Gmbh & Co Kg
Publication of PL2019579T3 publication Critical patent/PL2019579T3/pl

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1422—Printed circuit boards receptacles, e.g. stacked structures, electronic circuit modules or box like frames
    • H05K7/1427—Housings
    • H05K7/1432—Housings specially adapted for power drive units or power converters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1422—Printed circuit boards receptacles, e.g. stacked structures, electronic circuit modules or box like frames
    • H05K7/1427—Housings
    • H05K7/1432—Housings specially adapted for power drive units or power converters
    • H05K7/14329—Housings specially adapted for power drive units or power converters specially adapted for the configuration of power bus bars

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
PL08012359T 2007-07-26 2008-07-09 Półprzewodnikowy moduł mocy z dołączonym wspornikiem podłoża i sposób jego wytwarzania PL2019579T3 (pl)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102007034849 2007-07-26
EP08012359A EP2019579B1 (de) 2007-07-26 2008-07-09 Leistungshalbleitermodul mit verbundenem Substratträger und Herstellungsverfahren hierzu

Publications (1)

Publication Number Publication Date
PL2019579T3 true PL2019579T3 (pl) 2010-10-29

Family

ID=39745350

Family Applications (1)

Application Number Title Priority Date Filing Date
PL08012359T PL2019579T3 (pl) 2007-07-26 2008-07-09 Półprzewodnikowy moduł mocy z dołączonym wspornikiem podłoża i sposób jego wytwarzania

Country Status (9)

Country Link
US (1) US7741711B2 (pl)
EP (1) EP2019579B1 (pl)
JP (1) JP5325487B2 (pl)
CN (1) CN101388366B (pl)
AT (1) ATE471066T1 (pl)
DE (1) DE502008000765D1 (pl)
DK (1) DK2019579T3 (pl)
ES (1) ES2345414T3 (pl)
PL (1) PL2019579T3 (pl)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102010000943B4 (de) * 2010-01-15 2021-02-04 Infineon Technologies Ag Leistungshalbleitermodul mit zwei miteinander verbundenen Gehäuseteilen und Verfahren zur Herstellung eines Leistungshalbleitermoduls mit zwei miteinander verbundenen Gehäuseteilen
US9431311B1 (en) 2015-02-19 2016-08-30 Semiconductor Components Industries, Llc Semiconductor package with elastic coupler and related methods

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6280348U (pl) * 1985-11-08 1987-05-22
JPH07249719A (ja) * 1994-03-14 1995-09-26 Omron Corp 電子機器
JPH0831967A (ja) * 1994-07-19 1996-02-02 Fuji Electric Co Ltd 半導体装置のパッケージ構造
KR100319198B1 (ko) * 1999-11-17 2001-12-29 윤종용 반도체 모듈에 히트 싱크를 조립하는 설비 및 그 조립 방법
DE10100460B4 (de) 2001-01-08 2006-06-01 Semikron Elektronik Gmbh & Co. Kg Leistungshalbleitermodul mit Gehäuse und Anschlußelementen
DE10139287A1 (de) 2001-08-09 2003-03-13 Bombardier Transp Gmbh Halbleitermodul
JP3894070B2 (ja) * 2002-08-06 2007-03-14 富士通株式会社 ヒートシンク、ヒートシンク装置、該ヒートシンクの固定方法及び該ヒートシンクを使用した電子装置
JP2004103846A (ja) * 2002-09-10 2004-04-02 Mitsubishi Electric Corp 電力用半導体装置
JP4055643B2 (ja) * 2003-05-06 2008-03-05 株式会社日立製作所 インバータ装置
DE102005055713B4 (de) * 2005-11-23 2011-11-17 Semikron Elektronik Gmbh & Co. Kg Leistungshalbleitermodul mit Anschlusselementen
CN2906924Y (zh) * 2006-03-17 2007-05-30 森洋工业有限公司 一种大功率集成电路封装结构

Also Published As

Publication number Publication date
DK2019579T3 (da) 2010-09-27
EP2019579B1 (de) 2010-06-09
CN101388366A (zh) 2009-03-18
US7741711B2 (en) 2010-06-22
EP2019579A1 (de) 2009-01-28
ES2345414T3 (es) 2010-09-22
DE502008000765D1 (de) 2010-07-22
JP5325487B2 (ja) 2013-10-23
US20090045500A1 (en) 2009-02-19
CN101388366B (zh) 2012-07-11
ATE471066T1 (de) 2010-06-15
JP2009033169A (ja) 2009-02-12

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PL2019579T3 (pl) Półprzewodnikowy moduł mocy z dołączonym wspornikiem podłoża i sposób jego wytwarzania
SG149711A1 (en) A method for electrical interconnection and an interconnection structure