PL2027979T3 - Sposób wytwarzania przewodzących płyt z tworzywa drzewnego i płyty z tworzywa drzewnego - Google Patents

Sposób wytwarzania przewodzących płyt z tworzywa drzewnego i płyty z tworzywa drzewnego

Info

Publication number
PL2027979T3
PL2027979T3 PL08014789T PL08014789T PL2027979T3 PL 2027979 T3 PL2027979 T3 PL 2027979T3 PL 08014789 T PL08014789 T PL 08014789T PL 08014789 T PL08014789 T PL 08014789T PL 2027979 T3 PL2027979 T3 PL 2027979T3
Authority
PL
Poland
Prior art keywords
same
wood material
manufacturing conductive
material boards
conductive wood
Prior art date
Application number
PL08014789T
Other languages
English (en)
Inventor
Norbert Kalwa
Dirk Grunwald
Joachim Hasch
Original Assignee
SWISS KRONO Tec AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SWISS KRONO Tec AG filed Critical SWISS KRONO Tec AG
Publication of PL2027979T3 publication Critical patent/PL2027979T3/pl

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B27—WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL; NAILING OR STAPLING MACHINES IN GENERAL
    • B27N—MANUFACTURE BY DRY PROCESSES OF ARTICLES, WITH OR WITHOUT ORGANIC BINDING AGENTS, MADE FROM PARTICLES OR FIBRES CONSISTING OF WOOD OR OTHER LIGNOCELLULOSIC OR LIKE ORGANIC MATERIAL
    • B27N3/00—Manufacture of substantially flat articles, e.g. boards, from particles or fibres
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B27—WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL; NAILING OR STAPLING MACHINES IN GENERAL
    • B27N—MANUFACTURE BY DRY PROCESSES OF ARTICLES, WITH OR WITHOUT ORGANIC BINDING AGENTS, MADE FROM PARTICLES OR FIBRES CONSISTING OF WOOD OR OTHER LIGNOCELLULOSIC OR LIKE ORGANIC MATERIAL
    • B27N3/00—Manufacture of substantially flat articles, e.g. boards, from particles or fibres
    • B27N3/002—Manufacture of substantially flat articles, e.g. boards, from particles or fibres characterised by the type of binder
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B27—WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL; NAILING OR STAPLING MACHINES IN GENERAL
    • B27N—MANUFACTURE BY DRY PROCESSES OF ARTICLES, WITH OR WITHOUT ORGANIC BINDING AGENTS, MADE FROM PARTICLES OR FIBRES CONSISTING OF WOOD OR OTHER LIGNOCELLULOSIC OR LIKE ORGANIC MATERIAL
    • B27N7/00—After-treatment, e.g. reducing swelling or shrinkage, surfacing; Protecting the edges of boards against access of humidity
    • B27N7/005—Coating boards, e.g. with a finishing or decorating layer

Landscapes

  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Wood Science & Technology (AREA)
  • Forests & Forestry (AREA)
  • Dry Formation Of Fiberboard And The Like (AREA)
PL08014789T 2007-08-20 2008-08-20 Sposób wytwarzania przewodzących płyt z tworzywa drzewnego i płyty z tworzywa drzewnego PL2027979T3 (pl)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102007039267A DE102007039267B4 (de) 2007-08-20 2007-08-20 Verfahren zur Herstellung von leitfähigen Holzwerkstoffplatten und solche Holzwerkstoffplatten
EP08014789A EP2027979B1 (de) 2007-08-20 2008-08-20 Verfahren zur Herstellung von leitfähigen Holzwerkstoffplatten und solche Holzwerkstoffplatten

Publications (1)

Publication Number Publication Date
PL2027979T3 true PL2027979T3 (pl) 2013-07-31

Family

ID=39746480

Family Applications (1)

Application Number Title Priority Date Filing Date
PL08014789T PL2027979T3 (pl) 2007-08-20 2008-08-20 Sposób wytwarzania przewodzących płyt z tworzywa drzewnego i płyty z tworzywa drzewnego

Country Status (4)

Country Link
EP (1) EP2027979B1 (pl)
DE (1) DE102007039267B4 (pl)
ES (1) ES2405315T3 (pl)
PL (1) PL2027979T3 (pl)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102008049132A1 (de) * 2008-09-26 2010-04-08 Flooring Technologies Ltd. Verfahren zum Herstellen einer Holzfaserplatte und Holzfaserplattenherstellvorrichtung
CN103072179A (zh) * 2012-12-28 2013-05-01 青岛华顺昌木工机械制造有限公司 封边机胶锅快速更换装置
PL3017924T3 (pl) * 2014-11-06 2017-08-31 Flooring Technologies Ltd. Sposób produkcji płyty drewnianej, w szczególności kompozytu z drewna i tworzywa sztucznego
PT3215327T (pt) * 2014-11-06 2020-09-10 Flooring Technologies Ltd Painel de derivados de madeira, em particular na forma de um material compósito de madeira e material sintético e um processo para a sua produção
CN105235048A (zh) * 2015-09-25 2016-01-13 华南农业大学 一种高性能木质复合材料及其制备方法和应用
PL3181315T3 (pl) * 2015-12-16 2020-11-16 SWISS KRONO Tec AG Sposób produkowania płyty osb z gładką powierzchnią

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10253455A1 (de) 2001-12-05 2003-06-18 Ihd Inst Fuer Holztechnologie Bindemittel für die Herstellung von quellungsvergüteten Holzwerkstoffen und die Verklebung von Holz und Holzwerkstoffen
DE10232874B4 (de) 2002-07-19 2010-01-28 Ghp Glunz Holzwerkstoffproduktions-Gmbh Platte und Verfahren zur Herstellung einer Platte
DE10344926B3 (de) * 2003-09-25 2005-01-20 Dynea Erkner Gmbh Verfahren zur Herstellung von Holzwerkstoffkörpern, Holzwerkstoffkörper sowie nachverformbarer Holzwerkstoffkörper
US7090897B2 (en) * 2003-10-10 2006-08-15 Hardesty Jon H Electrically conductive MDF surface
DE10354394B4 (de) * 2003-11-20 2005-12-08 Dynea Erkner Gmbh Bindemittel zur Herstellung und Verklebung von Holzwerkstoffen und/oder Faserstoffen und Verwendung desselben
DE102004024566B4 (de) * 2004-03-13 2014-03-13 Institut für Holztechnologie Dresden gGmbH Holzwerkstoff und Verfahren zu dessen Herstellung
EP1781750A4 (en) * 2004-07-27 2012-08-08 Duluxgroup Australia Pty Ltd SYSTEM FOR PROVIDING A POWDER-COATED WOOD MATERIAL
DE202005006966U1 (de) 2004-11-23 2005-07-14 Glunz Ag Elektrisch leitfähige Holzwerkstoffplatte
ITMI20051025A1 (it) * 2005-06-01 2006-12-02 Mauro Soli Soluzione acquosa e metodo per rendere copnduttiva una superficie di un materiale non conduttivo
DE102005061222A1 (de) * 2005-12-20 2007-06-21 Dynea Erkner Gmbh Pflanzliche Faser, Formkörper auf Faserbasis sowie Verfahren zur Herstellung von mit Novolak versehenen pflanzlichen Fasern

Also Published As

Publication number Publication date
DE102007039267B4 (de) 2013-04-04
DE102007039267A1 (de) 2009-02-26
EP2027979B1 (de) 2013-03-06
ES2405315T3 (es) 2013-05-30
EP2027979A1 (de) 2009-02-25

Similar Documents

Publication Publication Date Title
TWI341706B (en) Circuit board and manufacture method thereof
PL2272668T3 (pl) Płyta z tworzywa drzewnego z równomierną warstwą wierzchnią i sposób jej wytwarzania
EP2068605A4 (en) CIRCUIT BOARD
EP2381748A4 (en) PCB AND METHOD FOR THE PRODUCTION THEREOF
EP2096648A4 (en) CONDUCTIVE FILM AND METHOD FOR MANUFACTURING THE SAME
EP2370621A4 (en) CONDUCTIVE STRIPS AND METHOD FOR MANUFACTURING THE SAME
GB0711074D0 (en) Electrolyte pattern and method for manufacturing an electrolyte pattern
EP2274962A4 (en) Wiring board and method for manufacturing the same
EP2009656A4 (en) ELECTRICAL CONTACT MATERIAL AND MANUFACTURING METHOD THEREFOR
TWI347159B (en) Method for forming transcriptional circuit and method for manufacturing circuit board
PL2156931T3 (pl) Urządzenie i sposób wytwarzania płyt gipsowych
EP2200179A4 (en) LAMINATED ELECTRONIC COMPONENTS AND METHOD FOR THE PRODUCTION THEREOF
EP2334744A4 (en) LEIM FOR GLUEING OF WOODEN MATERIAL AND WOODEN MATERIAL
EP2295618A4 (en) COMPOSITE FOR ELECTRICAL / ELECTRONIC COMPONENT AND ELECTRICAL / ELECTRONIC COMPONENT THEREFOR
EP2250017A4 (en) SELF-ADHESIVE MATERIAL FOR WOODEN PLATE AND WOODEN PLATE
TWI340614B (en) Circuit board and method of fabricating the same
EP2208545A4 (en) METHOD OF MODIFYING SURFACE AND MATERIAL WITH MODIFIED SURFACE
PL2098380T3 (pl) Sposób i urządzenie do wytwarzania płyty drewnopochodnej z tłoczoną powierzchnią
TWI371998B (en) Printed circuit board structure and method for manufacturing the same
TWI319699B (en) Circuit board and method of fabricating the same
TWI367712B (en) Wiring board and process for fabricating the same
TWI350137B (en) Circuit board structure and method thereof
TWI368469B (en) Printed circuit board and method for manufacturing the same
EP2173147A4 (en) PCB AND MANUFACTURING METHOD THEREFOR
EP2119812A4 (en) COMPOSITE MATERIAL FOR ELECTRICAL / ELECTRONIC COMPONENT, ELECTRICAL / ELECTRONIC COMPONENT, AND METHOD FOR PRODUCING COMPOSITE MATERIAL FOR ELECTRICAL / ELECTRONIC COMPONENT