PL2168082T3 - Sposób wytwarzania kart zawierających co najmniej jeden układ elektroniczny - Google Patents

Sposób wytwarzania kart zawierających co najmniej jeden układ elektroniczny

Info

Publication number
PL2168082T3
PL2168082T3 PL08760869T PL08760869T PL2168082T3 PL 2168082 T3 PL2168082 T3 PL 2168082T3 PL 08760869 T PL08760869 T PL 08760869T PL 08760869 T PL08760869 T PL 08760869T PL 2168082 T3 PL2168082 T3 PL 2168082T3
Authority
PL
Poland
Prior art keywords
electronic unit
boards including
manufacturing boards
manufacturing
electronic
Prior art date
Application number
PL08760869T
Other languages
English (en)
Inventor
François Droz
Original Assignee
Nagravision Sa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nagravision Sa filed Critical Nagravision Sa
Publication of PL2168082T3 publication Critical patent/PL2168082T3/pl

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00—Processes for applying liquids or other fluent materials
    • B05D1/02—Processes for applying liquids or other fluent materials performed by spraying
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D5/00—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures
    • B05D5/12—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures to obtain a coating with specific electrical properties
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07718—Constructional details, e.g. mounting of circuits in the carrier the record carrier being manufactured in a continuous process, e.g. using endless rolls
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00—Processes for applying liquids or other fluent materials
    • B05D1/26—Processes for applying liquids or other fluent materials performed by applying the liquid or other fluent material from an outlet device in contact with, or almost in contact with, the surface
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00—Processes for applying liquids or other fluent materials
    • B05D1/40—Distributing applied liquids or other fluent materials by members moving relatively to surface
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Credit Cards Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Moulding By Coating Moulds (AREA)
PL08760869T 2007-06-26 2008-06-11 Sposób wytwarzania kart zawierających co najmniej jeden układ elektroniczny PL2168082T3 (pl)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP07111079 2007-06-26
PCT/EP2008/057320 WO2009000653A1 (fr) 2007-06-26 2008-06-11 Procede de fabrication de cartes comprenant au moins une unite electronique
EP08760869A EP2168082B1 (fr) 2007-06-26 2008-06-11 Procede de fabrication de cartes comprenant au moins une unite electronique

Publications (1)

Publication Number Publication Date
PL2168082T3 true PL2168082T3 (pl) 2013-08-30

Family

ID=38819676

Family Applications (1)

Application Number Title Priority Date Filing Date
PL08760869T PL2168082T3 (pl) 2007-06-26 2008-06-11 Sposób wytwarzania kart zawierających co najmniej jeden układ elektroniczny

Country Status (13)

Country Link
US (1) US8993045B2 (pl)
EP (1) EP2168082B1 (pl)
JP (1) JP5160642B2 (pl)
KR (1) KR20100032882A (pl)
CN (1) CN101681445B (pl)
AU (1) AU2008267885B2 (pl)
CA (1) CA2691577C (pl)
ES (1) ES2406078T3 (pl)
MX (1) MX2009013713A (pl)
PL (1) PL2168082T3 (pl)
PT (1) PT2168082E (pl)
SI (1) SI2168082T1 (pl)
WO (1) WO2009000653A1 (pl)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5525980B2 (ja) * 2010-09-28 2014-06-18 トッパン・フォームズ株式会社 情報媒体およびその製造方法
JP5641845B2 (ja) * 2010-09-28 2014-12-17 トッパン・フォームズ株式会社 情報媒体

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4470858A (en) * 1982-12-06 1984-09-11 Deltaglass S.A. Lamination process and apparatus
US4995333A (en) * 1989-09-15 1991-02-26 Kimberly-Clark Corporation Sprayed adhesive system for applying a continuous filament of theroplastic material and imparting a swirling motion thereto
US5266349A (en) * 1991-02-25 1993-11-30 Specialty Coating Systems Inc. Method of discrete conformal coating
FR2691563B1 (fr) * 1992-05-19 1996-05-31 Francois Droz Carte comprenant au moins un element electronique et procede de fabrication d'une telle carte.
CA2098784A1 (en) * 1992-07-08 1994-01-09 Bentley Boger Apparatus and methods for applying conformal coatings to electronic circuit boards
JPH08123933A (ja) * 1994-08-30 1996-05-17 Shinko Neemupureeto Kk メモリカード及びその製造方法
JPH08230367A (ja) 1994-12-27 1996-09-10 Mitsubishi Electric Corp 非接触型ｉｃカードならびにその製造方法および装置
US5922402A (en) * 1996-02-15 1999-07-13 Speeney; Michael J. Method of making adhesive tape with adhesive free zones
KR100378341B1 (ko) * 2000-08-07 2003-03-29 유도실업주식회사 주입노즐의 히터선 고정홈을 가지는 상부금형
JP2002279384A (ja) * 2001-03-19 2002-09-27 Toshiba Corp 携帯可能電子媒体及びその製造方法
US20040217202A1 (en) * 2003-04-08 2004-11-04 Hynes Anthony J. Airless conformal coating apparatus and method
US7028867B2 (en) * 2003-10-30 2006-04-18 Nordson Corporation Conformal coating applicator and method
JP2005141567A (ja) * 2003-11-07 2005-06-02 Sony Corp Ｉｃカード及びその製造方法
JP2005234683A (ja) 2004-02-17 2005-09-02 Matsushita Electric Ind Co Ltd Ｉｃカード
KR100716815B1 (ko) * 2005-02-28 2007-05-09 삼성전기주식회사 칩 내장형 인쇄회로기판 및 그 제조방법
US20080166490A1 (en) * 2007-01-09 2008-07-10 Nordson Corporation Closed-loop bubble elimination system and methods for applying a conformal coating material to a substrate

Also Published As

Publication number Publication date
AU2008267885B2 (en) 2012-07-05
SI2168082T1 (sl) 2013-06-28
JP5160642B2 (ja) 2013-03-13
JP2011507721A (ja) 2011-03-10
AU2008267885A2 (en) 2010-01-28
PT2168082E (pt) 2013-05-08
HK1142424A1 (en) 2010-12-03
EP2168082B1 (fr) 2013-02-27
US8993045B2 (en) 2015-03-31
CN101681445A (zh) 2010-03-24
US20100196593A1 (en) 2010-08-05
CA2691577A1 (en) 2008-12-31
MX2009013713A (es) 2010-01-25
ES2406078T3 (es) 2013-06-05
CN101681445B (zh) 2013-11-13
EP2168082A1 (fr) 2010-03-31
AU2008267885A1 (en) 2008-12-31
KR20100032882A (ko) 2010-03-26
CA2691577C (en) 2014-11-18
WO2009000653A1 (fr) 2008-12-31

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