PL2193900T3 - Matryca do formowania struktury typu plaster miodu i sposób wytwarzania matrycy do formowania struktury typu plaster miodu - Google Patents
Matryca do formowania struktury typu plaster miodu i sposób wytwarzania matrycy do formowania struktury typu plaster mioduInfo
- Publication number
- PL2193900T3 PL2193900T3 PL09252725T PL09252725T PL2193900T3 PL 2193900 T3 PL2193900 T3 PL 2193900T3 PL 09252725 T PL09252725 T PL 09252725T PL 09252725 T PL09252725 T PL 09252725T PL 2193900 T3 PL2193900 T3 PL 2193900T3
- Authority
- PL
- Poland
- Prior art keywords
- die
- honeycomb structure
- forming honeycomb
- manufacturing
- forming
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28B—SHAPING CLAY OR OTHER CERAMIC COMPOSITIONS; SHAPING SLAG; SHAPING MIXTURES CONTAINING CEMENTITIOUS MATERIAL, e.g. PLASTER
- B28B7/00—Moulds; Cores; Mandrels
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28B—SHAPING CLAY OR OTHER CERAMIC COMPOSITIONS; SHAPING SLAG; SHAPING MIXTURES CONTAINING CEMENTITIOUS MATERIAL, e.g. PLASTER
- B28B3/00—Producing shaped articles from the material by using presses; Presses specially adapted therefor
- B28B3/20—Producing shaped articles from the material by using presses; Presses specially adapted therefor wherein the material is extruded
- B28B3/26—Extrusion dies
- B28B3/269—For multi-channeled structures, e.g. honeycomb structures
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
- B23P15/00—Making specific metal objects by operations not covered by a single other subclass or a group in this subclass
- B23P15/24—Making specific metal objects by operations not covered by a single other subclass or a group in this subclass dies
- B23P15/243—Honeycomb dies
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28B—SHAPING CLAY OR OTHER CERAMIC COMPOSITIONS; SHAPING SLAG; SHAPING MIXTURES CONTAINING CEMENTITIOUS MATERIAL, e.g. PLASTER
- B28B3/00—Producing shaped articles from the material by using presses; Presses specially adapted therefor
- B28B3/20—Producing shaped articles from the material by using presses; Presses specially adapted therefor wherein the material is extruded
- B28B3/26—Extrusion dies
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/10—Methods of surface bonding and/or assembly therefor
- Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
- Y10T156/1056—Perforating lamina
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/10—Methods of surface bonding and/or assembly therefor
- Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
- Y10T156/1082—Partial cutting bonded sandwich [e.g., grooving or incising]
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Press-Shaping Or Shaping Using Conveyers (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008310357A JP5379460B2 (ja) | 2008-12-05 | 2008-12-05 | ハニカム構造体成形用口金及びハニカム構造体成形用口金の製造方法 |
| EP09252725.8A EP2193900B1 (en) | 2008-12-05 | 2009-12-03 | Die for forming honeycomb structure and manufacturing method of die for forming honeycomb structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| PL2193900T3 true PL2193900T3 (pl) | 2014-04-30 |
Family
ID=42017895
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PL09252725T PL2193900T3 (pl) | 2008-12-05 | 2009-12-03 | Matryca do formowania struktury typu plaster miodu i sposób wytwarzania matrycy do formowania struktury typu plaster miodu |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US7997888B2 (pl) |
| EP (1) | EP2193900B1 (pl) |
| JP (1) | JP5379460B2 (pl) |
| KR (1) | KR101633111B1 (pl) |
| CN (1) | CN101745975B (pl) |
| CA (1) | CA2686774C (pl) |
| PL (1) | PL2193900T3 (pl) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012125882A (ja) * | 2010-12-15 | 2012-07-05 | Ngk Insulators Ltd | ハニカム構造体成形口金用電極 |
| WO2013145151A1 (ja) * | 2012-03-28 | 2013-10-03 | イビデン株式会社 | ハニカム構造体の製造方法、及び、押出成形用金型 |
| JP6002209B2 (ja) * | 2012-03-29 | 2016-10-05 | イビデン株式会社 | 押出成形用金型の製造方法 |
| CN104379310B (zh) * | 2012-06-04 | 2016-11-09 | 日本碍子株式会社 | 蜂窝结构体成形用模头及其制造方法 |
| KR20150001008A (ko) * | 2013-06-26 | 2015-01-06 | 기아자동차주식회사 | 핫스탬핑 냉간트림 양산용 프레스 금형의 제조방법 및 이를 이용한 핫스탬핑 냉간트림 양산용 프레스 금형 |
| JP6615649B2 (ja) | 2016-03-11 | 2019-12-04 | 日本碍子株式会社 | ハニカム構造体成形用口金の製造方法 |
| US11780115B2 (en) | 2019-11-27 | 2023-10-10 | Corning Incorporated | Multi-piece layered honeycomb extrusion dies and methods of making same |
| KR102390200B1 (ko) * | 2021-03-31 | 2022-04-25 | 한국에스에스(주) | 알루미늄 하니컴 구조체의 압출장치 및 압출방법 |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57170707A (en) * | 1981-04-16 | 1982-10-21 | Nippon Soken Inc | Manufacture for honeycomb forming die |
| US6183687B1 (en) * | 1995-08-11 | 2001-02-06 | Kennametal Inc. | Hard composite and method of making the same |
| US5761787A (en) * | 1995-11-30 | 1998-06-09 | Corning Incorporated | Method of making bonded pin extrusion die |
| JP4332980B2 (ja) * | 1999-03-18 | 2009-09-16 | 株式会社デンソー | ハニカム構造体成形用金型の製造方法 |
| JP4210446B2 (ja) * | 2001-09-19 | 2009-01-21 | 日本碍子株式会社 | ハニカム押出成形用口金及びその製造方法 |
| JP2003285309A (ja) * | 2002-03-28 | 2003-10-07 | Ngk Insulators Ltd | ハニカム成形用口金 |
| JP2003285308A (ja) | 2002-03-28 | 2003-10-07 | Ngk Insulators Ltd | ハニカム成形用口金及びこれを用いたハニカム成形用口金治具 |
| JP4373294B2 (ja) * | 2004-07-09 | 2009-11-25 | 日本碍子株式会社 | ハニカム構造体成形用口金、及びその製造方法 |
| JP4426400B2 (ja) * | 2004-08-11 | 2010-03-03 | 日本碍子株式会社 | ハニカム構造体成形用口金及びその製造方法 |
| JPWO2007114089A1 (ja) * | 2006-03-31 | 2009-08-13 | 日本碍子株式会社 | ハニカム構造体成形用口金、及びその製造方法 |
| WO2008078644A1 (ja) * | 2006-12-26 | 2008-07-03 | Ngk Insulators, Ltd. | ハニカム構造体成形用口金 |
| JP5361224B2 (ja) * | 2008-03-17 | 2013-12-04 | 日本碍子株式会社 | ハニカム構造体成形用口金、及びその製造方法 |
-
2008
- 2008-12-05 JP JP2008310357A patent/JP5379460B2/ja not_active Expired - Fee Related
-
2009
- 2009-11-24 US US12/624,651 patent/US7997888B2/en active Active
- 2009-11-25 CN CN200910246596.2A patent/CN101745975B/zh not_active Expired - Fee Related
- 2009-12-01 KR KR1020090117793A patent/KR101633111B1/ko not_active Expired - Fee Related
- 2009-12-01 CA CA2686774A patent/CA2686774C/en active Active
- 2009-12-03 EP EP09252725.8A patent/EP2193900B1/en not_active Not-in-force
- 2009-12-03 PL PL09252725T patent/PL2193900T3/pl unknown
Also Published As
| Publication number | Publication date |
|---|---|
| JP2010131872A (ja) | 2010-06-17 |
| JP5379460B2 (ja) | 2013-12-25 |
| CA2686774C (en) | 2012-08-14 |
| EP2193900A2 (en) | 2010-06-09 |
| EP2193900B1 (en) | 2013-11-13 |
| CA2686774A1 (en) | 2010-06-05 |
| KR20100065103A (ko) | 2010-06-15 |
| US20100143529A1 (en) | 2010-06-10 |
| CN101745975B (zh) | 2014-01-15 |
| CN101745975A (zh) | 2010-06-23 |
| KR101633111B1 (ko) | 2016-06-23 |
| EP2193900A3 (en) | 2012-05-02 |
| US7997888B2 (en) | 2011-08-16 |
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