PL2218101T3 - Podłoże kompozytowe krzemowo-ceramiczne i jego wytwarzanie - Google Patents

Podłoże kompozytowe krzemowo-ceramiczne i jego wytwarzanie

Info

Publication number
PL2218101T3
PL2218101T3 PL08856359T PL08856359T PL2218101T3 PL 2218101 T3 PL2218101 T3 PL 2218101T3 PL 08856359 T PL08856359 T PL 08856359T PL 08856359 T PL08856359 T PL 08856359T PL 2218101 T3 PL2218101 T3 PL 2218101T3
Authority
PL
Poland
Prior art keywords
manufacture
ceramic substrate
composite silicon
composite
silicon
Prior art date
Application number
PL08856359T
Other languages
English (en)
Inventor
Michael Fischer
Heike Bartsch De Torres
Martin Hoffmann
Jens Müller
Beate Pawlowski
Stefan Barth
Original Assignee
Technische Universität Ilmenau
Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Technische Universität Ilmenau, Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. filed Critical Technische Universität Ilmenau
Publication of PL2218101T3 publication Critical patent/PL2218101T3/pl

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/69—Insulating materials thereof
    • H10W70/692—Ceramics or glasses
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/69—Insulating materials thereof
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24479—Structurally defined web or sheet [e.g., overall dimension, etc.] including variation in thickness
    • Y10T428/24521—Structurally defined web or sheet [e.g., overall dimension, etc.] including variation in thickness with component conforming to contour of nonplanar surface
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24479—Structurally defined web or sheet [e.g., overall dimension, etc.] including variation in thickness
    • Y10T428/24521—Structurally defined web or sheet [e.g., overall dimension, etc.] including variation in thickness with component conforming to contour of nonplanar surface
    • Y10T428/24545—Containing metal or metal compound
PL08856359T 2007-12-06 2008-12-04 Podłoże kompozytowe krzemowo-ceramiczne i jego wytwarzanie PL2218101T3 (pl)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102007059609 2007-12-06
PCT/EP2008/066837 WO2009071645A2 (de) 2007-12-06 2008-12-04 Silizium-keramik-verbundsubstrat
EP08856359.8A EP2218101B1 (de) 2007-12-06 2008-12-04 Silizium-keramik-verbundsubstrat und dessen herstellung

Publications (1)

Publication Number Publication Date
PL2218101T3 true PL2218101T3 (pl) 2018-08-31

Family

ID=40639500

Family Applications (1)

Application Number Title Priority Date Filing Date
PL08856359T PL2218101T3 (pl) 2007-12-06 2008-12-04 Podłoże kompozytowe krzemowo-ceramiczne i jego wytwarzanie

Country Status (5)

Country Link
US (1) US8391013B2 (pl)
EP (1) EP2218101B1 (pl)
PL (1) PL2218101T3 (pl)
SI (1) SI2218101T1 (pl)
WO (1) WO2009071645A2 (pl)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102009059304B4 (de) 2009-12-23 2014-07-03 CiS Forschungsinstitut für Mikrosensorik und Photovoltaik GmbH Siliziumchip mit einem daran befestigten Kabel und Verfahen zur Befestigung des Kabels
US9368436B2 (en) * 2014-08-04 2016-06-14 Infineon Technologies Ag Source down semiconductor devices and methods of formation thereof
US9640419B2 (en) * 2014-08-04 2017-05-02 Infineon Technologies Ag Carrier system for processing semiconductor substrates, and methods thereof
DE102018103372A1 (de) 2017-09-04 2019-03-07 Technische Universität Ilmenau Verfahren zur Herstellung eines mikro-elektrofluidischen Moduls und seine Verwendung
DE102020103487B4 (de) 2020-02-11 2022-05-12 Koa Corporation Verfahren zur Herstellung eines Glas-Keramik-Verbundsubstrates

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3284921B2 (ja) * 1997-04-24 2002-05-27 富士電機株式会社 加速度センサならびに角加速度センサおよびそれらの製造方法
US6544651B2 (en) * 2000-05-18 2003-04-08 Georgia Tech Research Corp. High dielectric constant nano-structure polymer-ceramic composite
US7235745B2 (en) * 2005-01-10 2007-06-26 Endicott Interconnect Technologies, Inc. Resistor material with metal component for use in circuitized substrates, circuitized substrate utilizing same, method of making said ciruitized substrate, and information handling system utilizing said ciruitized substrate
JP2006133245A (ja) * 2006-02-16 2006-05-25 Mitsubishi Electric Corp 容量式加速度センサ
US7623340B1 (en) * 2006-08-07 2009-11-24 Nanotek Instruments, Inc. Nano-scaled graphene plate nanocomposites for supercapacitor electrodes
KR20100073704A (ko) * 2008-12-23 2010-07-01 삼성전기주식회사 복합산화물 나노 입자의 제조방법 및 그로부터 제조된 복합산화물 나노입자

Also Published As

Publication number Publication date
EP2218101A2 (de) 2010-08-18
WO2009071645A3 (de) 2009-11-12
WO2009071645A2 (de) 2009-06-11
SI2218101T1 (en) 2018-07-31
US8391013B2 (en) 2013-03-05
EP2218101B1 (de) 2018-02-14
US20100254099A1 (en) 2010-10-07

Similar Documents

Publication Publication Date Title
EP1998904A4 (en) COMPOSITE SCREEN
EP2216169A4 (en) Compound sheet
BRPI0719715A2 (pt) Estrutura composta
EP2167999A4 (en) COMPOSITE DISPLAY
BRPI0819573A2 (pt) Composição e artigo
EP2180160A4 (en) TURBOCHARGER
EP2226484A4 (en) TURBOCHARGER
EP2220009A4 (en) Anti-tarnish coating
DE602007013240D1 (de) Zusammensetzung mit sarsasapogenin
BRPI0907231A2 (pt) pirrolpirimidinas e pirrolpiridinas
BRPI0816087A2 (pt) Revestimento fotocatalítico
BRPI0820937A2 (pt) Peças em material compósito eletroestrutural
HRP20170963T1 (hr) Modificirani saharidi
HRP20141261T1 (xx) Spojevi tioninija i njihove uporabe
EP2152937A4 (en) COATING
BRPI0917195A2 (pt) estrutura compósita curada-plana
BRPI0815649A2 (pt) Revestimento
BRPI0920510A2 (pt) substrato com aderência para fezes e fluxo mesntrual
EP2188332A4 (en) NANOCOMPOSITE MATERIALS BASED ON STARCH
EP2123719A4 (en) RESIN COMPOSITION AND MULTILAYER STRUCTURE
EP1977888A4 (en) LAMINATE
EP1981039A4 (en) COMPOSED SUPRALEITER
BRPI0816288A2 (pt) Processos e compostos
ATE488617T1 (de) Al-ti-ru-n-c hartstoffschicht
DE602007008903D1 (de) Auspuffrohrstruktur