PL2257975T3 - Sposób i urządzenie aplikowania modułu chipa - Google Patents

Sposób i urządzenie aplikowania modułu chipa

Info

Publication number
PL2257975T3
PL2257975T3 PL09726423T PL09726423T PL2257975T3 PL 2257975 T3 PL2257975 T3 PL 2257975T3 PL 09726423 T PL09726423 T PL 09726423T PL 09726423 T PL09726423 T PL 09726423T PL 2257975 T3 PL2257975 T3 PL 2257975T3
Authority
PL
Poland
Prior art keywords
application
chip module
chip
module
Prior art date
Application number
PL09726423T
Other languages
English (en)
Inventor
Manfred Rietzler
Raymond Freeman
Original Assignee
Smartrac Invest B V
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Smartrac Invest B V filed Critical Smartrac Invest B V
Publication of PL2257975T3 publication Critical patent/PL2257975T3/pl

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/077—Connecting of TAB connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/701—Tape-automated bond [TAB] connectors
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49016—Antenna or wave energy "plumbing" making
    • Y10T29/49018—Antenna or wave energy "plumbing" making with other electrical component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
PL09726423T 2008-03-28 2009-03-20 Sposób i urządzenie aplikowania modułu chipa PL2257975T3 (pl)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102008016830A DE102008016830A1 (de) 2008-03-28 2008-03-28 Verfahren und Vorrichtung zur Applikation eines Chipmoduls
EP09726423A EP2257975B1 (de) 2008-03-28 2009-03-20 Verfahren und vorrichtung zur applikation eines chipmoduls
PCT/EP2009/002067 WO2009118132A1 (de) 2008-03-28 2009-03-20 Verfahren und vorrichtung zur applikation eines chipmoduls

Publications (1)

Publication Number Publication Date
PL2257975T3 true PL2257975T3 (pl) 2013-03-29

Family

ID=40942827

Family Applications (1)

Application Number Title Priority Date Filing Date
PL09726423T PL2257975T3 (pl) 2008-03-28 2009-03-20 Sposób i urządzenie aplikowania modułu chipa

Country Status (6)

Country Link
US (1) US8522422B2 (pl)
EP (1) EP2257975B1 (pl)
CN (2) CN102945815B (pl)
DE (1) DE102008016830A1 (pl)
PL (1) PL2257975T3 (pl)
WO (1) WO2009118132A1 (pl)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20160140197A1 (en) * 2014-11-14 2016-05-19 Tim Gast Cross-system synchronization of hierarchical applications

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3536728B2 (ja) 1998-07-31 2004-06-14 セイコーエプソン株式会社 半導体装置及びテープキャリア並びにそれらの製造方法、回路基板、電子機器並びにテープキャリア製造装置
US7242996B2 (en) 2003-03-25 2007-07-10 Id Solutions, Inc. Attachment of RFID modules to antennas
JP4438558B2 (ja) * 2003-11-12 2010-03-24 株式会社日立製作所 Ｒｆｉｄタグの製造方法
JP4742526B2 (ja) * 2003-12-26 2011-08-10 シンフォニアテクノロジー株式会社 Ｉｃチップ実装体の製造方法及び製造装置
CN101156235A (zh) * 2005-03-09 2008-04-02 米尔鲍尔股份公司 在芯片接触表面和天线接触表面之间建立电连接和机械连接的方法及应答器
DE102005015656B4 (de) * 2005-03-09 2007-02-01 Mühlbauer Ag Verfahren zum elektrischen Verbinden von RFID-Chipmodulen mit RFID-Antennen und Transpondern
US7842156B2 (en) * 2005-04-27 2010-11-30 Avery Dennison Corporation Webs and methods of making same
DE102005033196A1 (de) * 2005-07-13 2007-01-25 Arccure Technologies Gmbh Verfahren und Anordnung zur Herstellung von RFID-Tags
US7727809B2 (en) * 2006-05-31 2010-06-01 Semiconductor Energy Laboratory Co., Ltd. Attachment method, attachment apparatus, manufacturing method of semiconductor device, and manufacturing apparatus of semiconductor device

Also Published As

Publication number Publication date
EP2257975B1 (de) 2012-10-17
WO2009118132A1 (de) 2009-10-01
EP2257975A1 (de) 2010-12-08
DE102008016830A1 (de) 2009-10-15
CN102945815A (zh) 2013-02-27
US20110016703A1 (en) 2011-01-27
CN101981682B (zh) 2013-11-27
CN101981682A (zh) 2011-02-23
CN102945815B (zh) 2015-05-20
US8522422B2 (en) 2013-09-03

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