PL2341471T3 - Sposób wytwarzania kart elektronicznych - Google Patents

Sposób wytwarzania kart elektronicznych

Info

Publication number
PL2341471T3
PL2341471T3 PL09180782T PL09180782T PL2341471T3 PL 2341471 T3 PL2341471 T3 PL 2341471T3 PL 09180782 T PL09180782 T PL 09180782T PL 09180782 T PL09180782 T PL 09180782T PL 2341471 T3 PL2341471 T3 PL 2341471T3
Authority
PL
Poland
Prior art keywords
electronic cards
manufacturing electronic
manufacturing
cards
electronic
Prior art date
Application number
PL09180782T
Other languages
English (en)
Inventor
François Droz
Original Assignee
Nagravision Sa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nagravision Sa filed Critical Nagravision Sa
Publication of PL2341471T3 publication Critical patent/PL2341471T3/pl

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/072—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips the record carrier comprising a plurality of integrated circuit chips
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/0772—Physical layout of the record carrier
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49126—Assembling bases
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49165—Manufacturing circuit on or in base by forming conductive walled aperture in base

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Credit Cards Or The Like (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
PL09180782T 2009-12-28 2009-12-28 Sposób wytwarzania kart elektronicznych PL2341471T3 (pl)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP09180782A EP2341471B1 (fr) 2009-12-28 2009-12-28 Procédé de fabrication de cartes électroniques

Publications (1)

Publication Number Publication Date
PL2341471T3 true PL2341471T3 (pl) 2013-08-30

Family

ID=42126329

Family Applications (1)

Application Number Title Priority Date Filing Date
PL09180782T PL2341471T3 (pl) 2009-12-28 2009-12-28 Sposób wytwarzania kart elektronicznych

Country Status (13)

Country Link
US (1) US8402646B2 (pl)
EP (1) EP2341471B1 (pl)
JP (1) JP5408801B2 (pl)
KR (1) KR101665140B1 (pl)
CN (1) CN102110241B (pl)
AU (1) AU2010257415B2 (pl)
CA (1) CA2725309C (pl)
ES (1) ES2405981T3 (pl)
MX (1) MX2010014342A (pl)
PL (1) PL2341471T3 (pl)
PT (1) PT2341471E (pl)
SG (1) SG172580A1 (pl)
SI (1) SI2341471T1 (pl)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NO20093601A1 (no) 2009-12-29 2011-06-30 Idex Asa Overflatesensor
GB201208680D0 (en) 2012-05-17 2012-06-27 Origold As Method of manufacturing an electronic card
WO2017048280A1 (en) * 2015-09-18 2017-03-23 X-Card Holdings, Llc Self-centered inlay and core layer for information carrying card, process and resulting products
CN105721749B (zh) * 2016-02-24 2020-07-24 宁波舜宇光电信息有限公司 摄像模组及其电气支架和线路板组件及制造方法
US10984304B2 (en) 2017-02-02 2021-04-20 Jonny B. Vu Methods for placing an EMV chip onto a metal card
USD956760S1 (en) * 2018-07-30 2022-07-05 Lion Credit Card Inc. Multi EMV chip card
DE102020122437A1 (de) 2020-08-27 2022-03-03 Infineon Technologies Ag Package, Verfahren zum Bilden eines Packages, Trägerband, Chipkarte und Verfahren zum Bilden eines Trägerbands
US12528279B2 (en) 2022-10-20 2026-01-20 X-Card Holdings, Llc Core layer for information carrying card, resulting information carrying card, and methods of making the same
US12220897B2 (en) 2022-10-20 2025-02-11 X-Card Holdings, Llc Core layer for information carrying card, resulting information carrying card, and methods of making the same

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3466108D1 (en) 1983-06-09 1987-10-15 Flonic Sa Method of producing memory cards, and cards obtained thereby
DE19601389A1 (de) * 1996-01-16 1997-07-24 Siemens Ag Chipkartenkörper
JP4249381B2 (ja) 2000-10-06 2009-04-02 Ｎｅｃ液晶テクノロジー株式会社 回路基板およびそれを用いた液晶表示装置
PA8584401A1 (es) * 2002-10-11 2005-02-04 Nagraid Sa Modulo electronico que implica un elemento aparente sobre una cara y metodo de fabricacion de tal modulo
KR100716815B1 (ko) 2005-02-28 2007-05-09 삼성전기주식회사 칩 내장형 인쇄회로기판 및 그 제조방법
JP4396618B2 (ja) 2005-11-10 2010-01-13 パナソニック株式会社 カード型情報装置およびその製造方法

Also Published As

Publication number Publication date
US20110154662A1 (en) 2011-06-30
EP2341471B1 (fr) 2013-02-20
CN102110241B (zh) 2014-10-22
JP2011138508A (ja) 2011-07-14
HK1157904A1 (en) 2012-07-06
CA2725309A1 (en) 2011-06-28
KR101665140B1 (ko) 2016-10-11
AU2010257415A1 (en) 2011-07-14
US8402646B2 (en) 2013-03-26
EP2341471A1 (fr) 2011-07-06
CA2725309C (en) 2018-01-23
JP5408801B2 (ja) 2014-02-05
AU2010257415B2 (en) 2016-07-21
ES2405981T3 (es) 2013-06-04
PT2341471E (pt) 2013-05-08
MX2010014342A (es) 2011-06-27
SG172580A1 (en) 2011-07-28
CN102110241A (zh) 2011-06-29
SI2341471T1 (sl) 2013-06-28
KR20110076772A (ko) 2011-07-06

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