PL2392196T3 - Rozciągliwe urządzenie elektroniczne - Google Patents

Rozciągliwe urządzenie elektroniczne

Info

Publication number
PL2392196T3
PL2392196T3 PL09779290T PL09779290T PL2392196T3 PL 2392196 T3 PL2392196 T3 PL 2392196T3 PL 09779290 T PL09779290 T PL 09779290T PL 09779290 T PL09779290 T PL 09779290T PL 2392196 T3 PL2392196 T3 PL 2392196T3
Authority
PL
Poland
Prior art keywords
electronic device
extended electronic
extended
electronic
Prior art date
Application number
PL09779290T
Other languages
English (en)
Inventor
Fabrice Axisa
Jan Vanfleteren
Frederick Bossuyt
Original Assignee
Imec Vzw
Univ Gent
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Imec Vzw, Univ Gent filed Critical Imec Vzw
Publication of PL2392196T3 publication Critical patent/PL2392196T3/pl

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/65—Shapes or dispositions of interconnections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/0283—Stretchable printed circuits
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/688—Flexible insulating substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0133—Elastomeric or compliant polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09118—Moulded substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09218—Conductive traces
    • H05K2201/09263—Meander
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09727—Varying width along a single conductor; Conductors or pads having different widths
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0271—Mechanical force other than pressure, e.g. shearing or pulling
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
    • H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/007—Manufacture or processing of a substrate for a printed circuit board supported by a temporary or sacrificial carrier
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
    • H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24942—Structurally defined web or sheet [e.g., overall dimension, etc.] including components having same physical characteristic in differing degree

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)
  • Physics & Mathematics (AREA)
  • Geometry (AREA)
PL09779290T 2009-01-30 2009-04-10 Rozciągliwe urządzenie elektroniczne PL2392196T3 (pl)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US14889409P 2009-01-30 2009-01-30
EP09779290.7A EP2392196B1 (en) 2009-01-30 2009-04-10 Stretchable electronic device
PCT/EP2009/054353 WO2010086034A1 (en) 2009-01-30 2009-04-10 Stretchable electronic device

Publications (1)

Publication Number Publication Date
PL2392196T3 true PL2392196T3 (pl) 2019-05-31

Family

ID=41211953

Family Applications (1)

Application Number Title Priority Date Filing Date
PL09779290T PL2392196T3 (pl) 2009-01-30 2009-04-10 Rozciągliwe urządzenie elektroniczne

Country Status (4)

Country Link
US (1) US9418927B2 (pl)
EP (1) EP2392196B1 (pl)
PL (1) PL2392196T3 (pl)
WO (1) WO2010086034A1 (pl)

Families Citing this family (141)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8372726B2 (en) * 2008-10-07 2013-02-12 Mc10, Inc. Methods and applications of non-planar imaging arrays
JP5646492B2 (ja) 2008-10-07 2014-12-24 エムシー１０ インコーポレイテッドＭｃ１０，Ｉｎｃ． 伸縮可能な集積回路およびセンサアレイを有する装置
US9123614B2 (en) 2008-10-07 2015-09-01 Mc10, Inc. Methods and applications of non-planar imaging arrays
US8097926B2 (en) 2008-10-07 2012-01-17 Mc10, Inc. Systems, methods, and devices having stretchable integrated circuitry for sensing and delivering therapy
US9545216B2 (en) 2011-08-05 2017-01-17 Mc10, Inc. Catheter balloon methods and apparatus employing sensing elements
US8389862B2 (en) 2008-10-07 2013-03-05 Mc10, Inc. Extremely stretchable electronics
US8886334B2 (en) 2008-10-07 2014-11-11 Mc10, Inc. Systems, methods, and devices using stretchable or flexible electronics for medical applications
US9119533B2 (en) 2008-10-07 2015-09-01 Mc10, Inc. Systems, methods, and devices having stretchable integrated circuitry for sensing and delivering therapy
US20110218756A1 (en) * 2009-10-01 2011-09-08 Mc10, Inc. Methods and apparatus for conformal sensing of force and/or acceleration at a person's head
WO2011041727A1 (en) 2009-10-01 2011-04-07 Mc10, Inc. Protective cases with integrated electronics
EP2681538B1 (en) 2011-03-11 2019-03-06 Mc10, Inc. Integrated devices to facilitate quantitative assays and diagnostics
GB2529346A (en) 2011-03-31 2016-02-17 Plasyl Ltd Improvements for electrical circuits
KR102000302B1 (ko) 2011-05-27 2019-07-15 엠씨10, 인크 전자, 광학, 및/또는 기계 장치 및 시스템, 그리고 이를 제조하기 위한 방법
US9018532B2 (en) 2011-06-09 2015-04-28 Multi-Fineline Electronix, Inc. Stretchable circuit assemblies
US9757050B2 (en) 2011-08-05 2017-09-12 Mc10, Inc. Catheter balloon employing force sensing elements
EP3470830A1 (en) 2011-09-01 2019-04-17 MC10 Inc. Electronics for detection of a condition of tissue
JP6277130B2 (ja) 2011-10-05 2018-02-14 エムシーテン、インコーポレイテッド 医療用の装置およびそれの製造方法
JP5855979B2 (ja) * 2012-03-07 2016-02-09 日本メクトロン株式会社 伸縮性フレキシブル回路基板
EP2640168A1 (en) * 2012-03-15 2013-09-18 Nederlandse Organisatie voor toegepast-natuurwetenschappelijk Onderzoek TNO Submount, assembly including submount, method of assembling and assembling device
US8895864B2 (en) * 2012-03-30 2014-11-25 Nokia Corporation Deformable apparatus and method
US9247637B2 (en) 2012-06-11 2016-01-26 Mc10, Inc. Strain relief structures for stretchable interconnects
US9226402B2 (en) 2012-06-11 2015-12-29 Mc10, Inc. Strain isolation structures for stretchable electronics
KR20150031324A (ko) 2012-07-05 2015-03-23 엠씨10, 인크 유동 감지를 포함하는 카테터 장치
US9295842B2 (en) 2012-07-05 2016-03-29 Mc10, Inc. Catheter or guidewire device including flow sensing and use thereof
WO2014011090A1 (en) * 2012-07-12 2014-01-16 Volvo Lastvagnar Ab An arrangement for displaying information in a vehicle
WO2014058473A1 (en) 2012-10-09 2014-04-17 Mc10, Inc. Conformal electronics integrated with apparel
US9171794B2 (en) 2012-10-09 2015-10-27 Mc10, Inc. Embedding thin chips in polymer
US10528135B2 (en) 2013-01-14 2020-01-07 Ctrl-Labs Corporation Wearable muscle interface systems, devices and methods that interact with content displayed on an electronic display
US9613911B2 (en) * 2013-02-06 2017-04-04 The Board Of Trustees Of The University Of Illinois Self-similar and fractal design for stretchable electronics
US10497633B2 (en) 2013-02-06 2019-12-03 The Board Of Trustees Of The University Of Illinois Stretchable electronic systems with fluid containment
KR20150125946A (ko) * 2013-02-06 2015-11-10 더 보오드 오브 트러스티스 오브 더 유니버시티 오브 일리노이즈 인장성의 전자장치에 대한 자기 유사형 및 프랙탈 설계
US10840536B2 (en) 2013-02-06 2020-11-17 The Board Of Trustees Of The University Of Illinois Stretchable electronic systems with containment chambers
WO2014186370A1 (en) 2013-05-13 2014-11-20 Thalmic Labs Inc. Systems, articles and methods for wearable electronic devices that accommodate different user forms
US9706647B2 (en) 2013-05-14 2017-07-11 Mc10, Inc. Conformal electronics including nested serpentine interconnects
US8927338B1 (en) 2013-06-13 2015-01-06 International Business Machines Corporation Flexible, stretchable electronic devices
EP3013166B1 (en) * 2013-06-26 2018-02-07 IMEC vzw Methods for electrically connecting textile integrated conductive yarns
JP2016527649A (ja) 2013-08-05 2016-09-08 エムシー１０ インコーポレイテッドＭｃ１０，Ｉｎｃ． 適合する電子機器を含む可撓性温度センサ
US10042422B2 (en) 2013-11-12 2018-08-07 Thalmic Labs Inc. Systems, articles, and methods for capacitive electromyography sensors
US12504816B2 (en) 2013-08-16 2025-12-23 Meta Platforms Technologies, Llc Wearable devices and associated band structures for sensing neuromuscular signals using sensor pairs in respective pods with communicative pathways to a common processor
US11426123B2 (en) * 2013-08-16 2022-08-30 Meta Platforms Technologies, Llc Systems, articles and methods for signal routing in wearable electronic devices that detect muscle activity of a user using a set of discrete and separately enclosed pod structures
US11921471B2 (en) 2013-08-16 2024-03-05 Meta Platforms Technologies, Llc Systems, articles, and methods for wearable devices having secondary power sources in links of a band for providing secondary power in addition to a primary power source
US20150124566A1 (en) 2013-10-04 2015-05-07 Thalmic Labs Inc. Systems, articles and methods for wearable electronic devices employing contact sensors
US10231333B1 (en) 2013-08-27 2019-03-12 Flextronics Ap, Llc. Copper interconnect for PTH components assembly
US9788789B2 (en) * 2013-08-30 2017-10-17 Thalmic Labs Inc. Systems, articles, and methods for stretchable printed circuit boards
EP2845726A1 (en) 2013-09-04 2015-03-11 Nederlandse Organisatie voor toegepast -natuurwetenschappelijk onderzoek TNO Electrically interconnecting foil
US10467926B2 (en) 2013-10-07 2019-11-05 Mc10, Inc. Conformal sensor systems for sensing and analysis
JP6711750B2 (ja) 2013-11-22 2020-06-17 エムシー１０ インコーポレイテッドＭｃ１０，Ｉｎｃ． 心臓活動の検知および分析のためのコンフォーマルセンサシステム
WO2015081113A1 (en) 2013-11-27 2015-06-04 Cezar Morun Systems, articles, and methods for electromyography sensors
US9521748B1 (en) 2013-12-09 2016-12-13 Multek Technologies, Ltd. Mechanical measures to limit stress and strain in deformable electronics
KR20150067882A (ko) * 2013-12-10 2015-06-19 한국전자통신연구원 전자소자의 장착이 가능한 유연기판의 제조 방법
CA2935372C (en) 2014-01-06 2023-08-08 Mc10, Inc. Encapsulated conformal electronic systems and devices, and methods of making and using the same
US10485118B2 (en) 2014-03-04 2019-11-19 Mc10, Inc. Multi-part flexible encapsulation housing for electronic devices and methods of making the same
US9810623B2 (en) 2014-03-12 2017-11-07 Mc10, Inc. Quantification of a change in assay
US10199008B2 (en) 2014-03-27 2019-02-05 North Inc. Systems, devices, and methods for wearable electronic devices as state machines
US9880632B2 (en) 2014-06-19 2018-01-30 Thalmic Labs Inc. Systems, devices, and methods for gesture identification
EP3167695A4 (en) * 2014-07-08 2018-06-06 David Markus Elastic circuit
JP6470524B2 (ja) * 2014-08-12 2019-02-13 日本メクトロン株式会社 伸縮性フレキシブルプリント基板および伸縮性フレキシブルプリント基板の製造方法
EP2991460B1 (en) 2014-08-29 2018-11-21 Nokia Technologies OY An apparatus and associated methods for deformable electronics
KR102244435B1 (ko) 2014-09-03 2021-04-26 삼성디스플레이 주식회사 회로판 및 이를 포함하는 전자 장치
US10074294B2 (en) 2014-09-29 2018-09-11 Lg Display Co., Ltd. Flexible display device with reduced bend stress wires
US9349758B2 (en) * 2014-09-30 2016-05-24 Lg Display Co., Ltd. Flexible display device with divided power lines and manufacturing method for the same
US9899330B2 (en) 2014-10-03 2018-02-20 Mc10, Inc. Flexible electronic circuits with embedded integrated circuit die
US10297572B2 (en) 2014-10-06 2019-05-21 Mc10, Inc. Discrete flexible interconnects for modules of integrated circuits
USD781270S1 (en) 2014-10-15 2017-03-14 Mc10, Inc. Electronic device having antenna
EP3009822B1 (en) * 2014-10-16 2017-06-21 Nokia Technologies OY A deformable apparatus and method
EP3010315A1 (en) 2014-10-16 2016-04-20 Nokia Technologies OY A deformable apparatus and method
US9807221B2 (en) 2014-11-28 2017-10-31 Thalmic Labs Inc. Systems, devices, and methods effected in response to establishing and/or terminating a physical communications link
EP3241412A2 (en) * 2014-12-30 2017-11-08 3M Innovative Properties Company Electrical conductors
KR102327582B1 (ko) 2015-01-06 2021-11-17 삼성디스플레이 주식회사 신축성 표시 장치 및 그 제조 방법
US10416030B2 (en) * 2015-01-26 2019-09-17 Wacoh-Tech Inc. Force sensor
WO2016134306A1 (en) 2015-02-20 2016-08-25 Mc10, Inc. Automated detection and configuration of wearable devices based on on-body status, location, and/or orientation
WO2016140961A1 (en) 2015-03-02 2016-09-09 Mc10, Inc. Perspiration sensor
KR102282492B1 (ko) 2015-03-10 2021-07-27 삼성디스플레이 주식회사 유기 발광 표시 장치
CN107210269B (zh) * 2015-03-11 2020-07-28 英特尔公司 利用应变重分布层的可拉伸电子器件制造方法
US10154583B1 (en) 2015-03-27 2018-12-11 Flex Ltd Mechanical strain reduction on flexible and rigid-flexible circuits
US10098225B2 (en) * 2015-03-31 2018-10-09 Industrial Technology Research Institute Flexible electronic module and manufacturing method thereof
US10078435B2 (en) 2015-04-24 2018-09-18 Thalmic Labs Inc. Systems, methods, and computer program products for interacting with electronically displayed presentation materials
KR102432345B1 (ko) 2015-04-30 2022-08-12 삼성디스플레이 주식회사 신축성 표시 장치
JP6712764B2 (ja) * 2015-05-25 2020-06-24 パナソニックＩｐマネジメント株式会社 伸縮性フレキシブル基板およびその製造方法
JP6484133B2 (ja) * 2015-07-09 2019-03-13 日東電工株式会社 配線回路基板の製造方法
JP6491556B2 (ja) * 2015-07-09 2019-03-27 日東電工株式会社 配線回路基板
US10653332B2 (en) 2015-07-17 2020-05-19 Mc10, Inc. Conductive stiffener, method of making a conductive stiffener, and conductive adhesive and encapsulation layers
US10709384B2 (en) 2015-08-19 2020-07-14 Mc10, Inc. Wearable heat flux devices and methods of use
US10466118B1 (en) 2015-08-28 2019-11-05 Multek Technologies, Ltd. Stretchable flexible durable pressure sensor
US10327331B2 (en) * 2015-09-25 2019-06-18 Intel Corporation Stretchable computing device
US10300371B2 (en) 2015-10-01 2019-05-28 Mc10, Inc. Method and system for interacting with a virtual environment
CN108289630A (zh) 2015-10-05 2018-07-17 Mc10股份有限公司 用于神经调节和刺激的方法和系统
CN105578738B (zh) * 2015-12-21 2019-01-25 上海交通大学 基于弹性衬底的可拉伸电路板的制备方法及可拉伸电路板
WO2017147053A1 (en) 2016-02-22 2017-08-31 Mc10, Inc. System, device, and method for coupled hub and sensor node on-body acquisition of sensor information
US10277386B2 (en) 2016-02-22 2019-04-30 Mc10, Inc. System, devices, and method for on-body data and power transmission
WO2017157753A1 (en) * 2016-03-15 2017-09-21 Philips Lighting Holding B.V. An elongated lead frame and a method of manufacturing an elongated lead frame
US10993635B1 (en) 2016-03-22 2021-05-04 Flextronics Ap, Llc Integrating biosensor to compression shirt textile and interconnect method
CN109310340A (zh) 2016-04-19 2019-02-05 Mc10股份有限公司 用于测量汗液的方法和系统
US11216069B2 (en) 2018-05-08 2022-01-04 Facebook Technologies, Llc Systems and methods for improved speech recognition using neuromuscular information
WO2018022602A1 (en) 2016-07-25 2018-02-01 Ctrl-Labs Corporation Methods and apparatus for predicting musculo-skeletal position information using wearable autonomous sensors
US12554325B2 (en) 2016-07-25 2026-02-17 Meta Platforms Technologies, Llc Methods and apparatuses for low latency body state prediction based on neuromuscular data
US10447347B2 (en) 2016-08-12 2019-10-15 Mc10, Inc. Wireless charger and high speed data off-loader
EP3300467B1 (en) * 2016-09-26 2023-04-05 IMEC vzw Method for manufacturing shape-retaining non-flat devices
FI127173B (fi) * 2016-09-27 2017-12-29 Tty-Säätiö Sr Venyvä rakenne käsittäen johtavan polun ja menetelmä rakenteen valmistamiseksi
EP3364731A1 (en) 2017-02-20 2018-08-22 IMEC vzw A system including a conductive textile and an electronic circuit unit and a method
CN108538799B (zh) 2017-03-02 2024-02-27 弗莱克斯有限公司 互连部件和互连组件
US10338757B2 (en) 2017-03-09 2019-07-02 Google Llc Connector integration for smart clothing
US10113325B1 (en) 2017-04-19 2018-10-30 Kohler Co. Generator enclosure system
US12071533B2 (en) 2017-04-21 2024-08-27 Ares Materials Inc. Polymer substrate design parameters for electronic microfabrication
US10535845B1 (en) 2017-07-14 2020-01-14 Flex Ltd. Flexible and stretchable chain battery
FI20175818A1 (en) * 2017-09-14 2019-03-15 Clothing Plus Mbu Oy Electrical signal transmission system
WO2019074105A1 (ja) 2017-10-12 2019-04-18 大日本印刷株式会社 配線基板及び配線基板の製造方法
US11612054B2 (en) 2017-10-12 2023-03-21 Dai Nippon Printing Co., Ltd. Wiring board and method for manufacturing wiring board
EP3697180A4 (en) * 2017-10-12 2021-06-30 Dai Nippon Printing Co., Ltd. CIRCUIT BOARD AND METHOD OF MANUFACTURING THE CIRCUIT BOARD
CN112040858B (zh) 2017-10-19 2024-06-07 元平台技术有限公司 用于识别与神经肌肉源信号相关的生物结构的系统和方法
US20190156971A1 (en) * 2017-11-18 2019-05-23 Applied Cavitation, Inc Conductive trace geometry for high stretch applications
US10426029B1 (en) 2018-01-18 2019-09-24 Flex Ltd. Micro-pad array to thread flexible attachment
US10937414B2 (en) 2018-05-08 2021-03-02 Facebook Technologies, Llc Systems and methods for text input using neuromuscular information
US11481030B2 (en) 2019-03-29 2022-10-25 Meta Platforms Technologies, Llc Methods and apparatus for gesture detection and classification
US11907423B2 (en) 2019-11-25 2024-02-20 Meta Platforms Technologies, Llc Systems and methods for contextualized interactions with an environment
US11961494B1 (en) 2019-03-29 2024-04-16 Meta Platforms Technologies, Llc Electromagnetic interference reduction in extended reality environments
US11493993B2 (en) 2019-09-04 2022-11-08 Meta Platforms Technologies, Llc Systems, methods, and interfaces for performing inputs based on neuromuscular control
US12579768B2 (en) 2018-01-25 2026-03-17 Meta Platforms Technologies, Llc Wearable electronic devices, extended reality systems including neuromuscular sensors, and methods for generating text from speech input and modifying the generated text based on neuromuscular data
US11150730B1 (en) 2019-04-30 2021-10-19 Facebook Technologies, Llc Devices, systems, and methods for controlling computing devices via neuromuscular signals of users
US10687421B1 (en) 2018-04-04 2020-06-16 Flex Ltd. Fabric with woven wire braid
US10592001B2 (en) 2018-05-08 2020-03-17 Facebook Technologies, Llc Systems and methods for improved speech recognition using neuromuscular information
EP3573434A1 (en) * 2018-05-25 2019-11-27 Nederlandse Organisatie voor toegepast- natuurwetenschappelijk onderzoek TNO Stretchable electronic device
WO2020018256A1 (en) * 2018-07-20 2020-01-23 Shenzhen Royole Technologies Co. Ltd. Stretchable electronics and monolithic integration method for fabricating the same
US10905350B2 (en) 2018-08-31 2021-02-02 Facebook Technologies, Llc Camera-guided interpretation of neuromuscular signals
EP3853698A4 (en) 2018-09-20 2021-11-17 Facebook Technologies, LLC NEUROMUSCULAR TEXT ENTRY, WRITING AND DRAWING IN SYSTEMS WITH EXTENDED REALITY
US10985484B1 (en) * 2018-10-01 2021-04-20 Flex Ltd. Electronic conductive interconnection for bridging across irregular areas in a textile product
EP3873182A4 (en) * 2018-10-22 2023-01-25 Toyobo Co., Ltd. METHOD OF MAKING DEVICE CONNECTED BODY AND DEVICE CONNECTED BODY
EP3876681A4 (en) * 2018-10-31 2022-09-07 Dai Nippon Printing Co., Ltd. WIRING SUBSTRATE AND METHOD OF MAKING THE WIRING SUBSTRATE
EP3886693A4 (en) 2018-11-27 2022-06-08 Facebook Technologies, LLC. METHOD AND DEVICE FOR AUTOCALIBRATION OF A PORTABLE ELECTRODE SENSING SYSTEM
JP7251165B2 (ja) * 2019-01-24 2023-04-04 大日本印刷株式会社 配線基板及び配線基板の製造方法
EP3705989A1 (en) 2019-03-07 2020-09-09 Stereyo BVBA Real-time deformable and transparent display
WO2020196745A1 (ja) 2019-03-27 2020-10-01 パナソニックＩｐマネジメント株式会社 伸縮性回路基板
US11561243B2 (en) 2019-09-12 2023-01-24 International Business Machines Corporation Compliant organic substrate assembly for rigid probes
US11322473B2 (en) * 2019-09-12 2022-05-03 International Business Machines Corporation Interconnect and tuning thereof
TWI731517B (zh) 2019-12-18 2021-06-21 財團法人工業技術研究院 軟性混合電子系統及降低此軟性混合電子系統衝擊的方法
KR102368540B1 (ko) * 2020-09-03 2022-02-28 한국기계연구원 신축성 기판 및 이를 이용한 소자 간격 제어방법
US12521270B2 (en) 2020-09-28 2026-01-13 Coloplast A/S Medical appliance
CN113790666A (zh) * 2020-11-10 2021-12-14 友达光电股份有限公司 应力感测组件和显示装置
JP7574868B2 (ja) * 2021-02-12 2024-10-29 株式会社村田製作所 回路基板
US11868531B1 (en) 2021-04-08 2024-01-09 Meta Platforms Technologies, Llc Wearable device providing for thumb-to-finger-based input gestures detected based on neuromuscular signals, and systems and methods of use thereof
AT526502B1 (de) * 2023-03-23 2024-04-15 Sendance Gmbh Verformbarer Gegenstand

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8217381B2 (en) * 2004-06-04 2012-07-10 The Board Of Trustees Of The University Of Illinois Controlled buckling structures in semiconductor interconnects and nanomembranes for stretchable electronics
US7629691B2 (en) 2004-06-16 2009-12-08 Honeywell International Inc. Conductor geometry for electronic circuits fabricated on flexible substrates
WO2007116344A1 (en) 2006-04-07 2007-10-18 Koninklijke Philips Electronics N.V. Elastically deformable integrated-circuit device
WO2008030960A2 (en) 2006-09-06 2008-03-13 The Board Of Trustees Of The University Of Illinois Controlled buckling structures in semiconductor interconnects and nanomembranes for stretchable electronics
DE102006055576A1 (de) * 2006-11-21 2008-05-29 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren zum Herstellen eines dehnbaren Schaltungsträgers und dehnbarer Schaltungsträger
EP2255378B1 (en) * 2008-03-05 2015-08-05 The Board of Trustees of the University of Illinois Stretchable and foldable electronic devices

Also Published As

Publication number Publication date
WO2010086034A1 (en) 2010-08-05
EP2392196B1 (en) 2018-08-22
US20120052268A1 (en) 2012-03-01
US9418927B2 (en) 2016-08-16
EP2392196A1 (en) 2011-12-07

Similar Documents

Publication Publication Date Title
PL2392196T3 (pl) Rozciągliwe urządzenie elektroniczne
BRPI0903704A2 (pt) Dispositivo eletrônico
DK2506745T3 (da) Patron-ekstraktionsindretning
BR112012004536A2 (pt) dispositivo
UA19989S (uk) Пристрій гіпертермомасажний
BRPI1013266A2 (pt) unidade eletrônica aperfeiçoada
DK2209031T3 (da) Anordningsomformer
BR112012010974A2 (pt) dispositivo
DK2335370T3 (da) Organ-på-en-chip-anordning
IT1396181B1 (it) Dispositivo assicuratore
BR112012008158A2 (pt) substrato de dispositivo
DE102009043179B8 (de) Verbindungsvorrichtung
EP2508747A4 (en) Engine starting apparatus
UA19621S (uk) Обчислювальний пристрій
ES1067341Y (es) Dispositivo perforador-fijador
DK2493768T3 (da) Etiketfjernelses-indretning
BR112012002883A2 (pt) dispositivo
FI20095860L (fi) Elektroniikkalaite
FI20095844A (fi) Elektroniikkalaite
BR112013010141A2 (pt) aparelho eletrônico
EP2434544A4 (en) Integrated circuit
BRPI1011536A2 (pt) aparelho terminal
BR112012002889A2 (pt) dispositivo
UA20090S (uk) Обчислювальний пристрій
PL2268115T3 (pl) Urządzenie elektroniczne