PL2414567T3 - Semipolarny kryształ półprzewodnika i sposób jego wytwarzania - Google Patents
Semipolarny kryształ półprzewodnika i sposób jego wytwarzaniaInfo
- Publication number
- PL2414567T3 PL2414567T3 PL11709883T PL11709883T PL2414567T3 PL 2414567 T3 PL2414567 T3 PL 2414567T3 PL 11709883 T PL11709883 T PL 11709883T PL 11709883 T PL11709883 T PL 11709883T PL 2414567 T3 PL2414567 T3 PL 2414567T3
- Authority
- PL
- Poland
- Prior art keywords
- production
- semipolar semiconductor
- semipolar
- semiconductor
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 title 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B23/00—Single-crystal growth by condensing evaporated or sublimed materials
- C30B23/02—Epitaxial-layer growth
- C30B23/025—Epitaxial-layer growth characterised by the substrate
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B23/00—Single-crystal growth by condensing evaporated or sublimed materials
- C30B23/02—Epitaxial-layer growth
- C30B23/04—Pattern deposit, e.g. by using masks
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B25/00—Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
- C30B25/02—Epitaxial-layer growth
- C30B25/04—Pattern deposit, e.g. by using masks
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B25/00—Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
- C30B25/02—Epitaxial-layer growth
- C30B25/18—Epitaxial-layer growth characterised by the substrate
- C30B25/186—Epitaxial-layer growth characterised by the substrate being specially pre-treated by, e.g. chemical or physical means
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
- C30B29/10—Inorganic compounds or compositions
- C30B29/40—AIIIBV compounds wherein A is B, Al, Ga, In or Tl and B is N, P, As, Sb or Bi
- C30B29/403—AIII-nitrides
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Crystallography & Structural Chemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102010011895A DE102010011895B4 (de) | 2010-03-18 | 2010-03-18 | Verfahren zur Herstellung eines semipolaren Gruppe III-Nitrid-Kristalls, Substrat, freistehendes semipolares Substrat und Verwendung der Substrate |
| EP11709883.0A EP2414567B1 (de) | 2010-03-18 | 2011-03-18 | Semipolarer halbleiterkristall und verfahren zur herstellung desselben |
| PCT/EP2011/001339 WO2011113605A1 (de) | 2010-03-18 | 2011-03-18 | Semipolarer halbleiterkristall und verfahren zur herstellung desselben |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| PL2414567T3 true PL2414567T3 (pl) | 2014-04-30 |
Family
ID=43828177
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PL11709883T PL2414567T3 (pl) | 2010-03-18 | 2011-03-18 | Semipolarny kryształ półprzewodnika i sposób jego wytwarzania |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US8536030B2 (pl) |
| EP (1) | EP2414567B1 (pl) |
| JP (1) | JP5810105B2 (pl) |
| DE (1) | DE102010011895B4 (pl) |
| PL (1) | PL2414567T3 (pl) |
| WO (1) | WO2011113605A1 (pl) |
Families Citing this family (28)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4396816B2 (ja) * | 2003-10-17 | 2010-01-13 | 日立電線株式会社 | Iii族窒化物半導体基板およびその製造方法 |
| TWI425666B (zh) * | 2011-04-27 | 2014-02-01 | 國立中央大學 | Growth of semi - polarized nitrides |
| EP2770089B1 (en) * | 2011-10-21 | 2025-03-05 | Mitsubishi Chemical Corporation | Gallium NITRIDE SEMICONDUCTOR CRYSTAL |
| US10435812B2 (en) | 2012-02-17 | 2019-10-08 | Yale University | Heterogeneous material integration through guided lateral growth |
| GB2502818A (en) * | 2012-06-08 | 2013-12-11 | Nanogan Ltd | Epitaxial growth of semiconductor material such as Gallium Nitride on oblique angled nano or micro-structures |
| KR101504731B1 (ko) * | 2012-11-30 | 2015-03-23 | 주식회사 소프트에피 | 3족 질화물 반도체 적층체 |
| WO2014136602A1 (ja) * | 2013-03-08 | 2014-09-12 | 国立大学法人山口大学 | 窒化ガリウム結晶自立基板の製造方法 |
| DE102013208223B4 (de) * | 2013-05-06 | 2021-09-16 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Verfahren zum Herstellen eines optoelektronischen Bauelements |
| KR20150031122A (ko) * | 2013-09-13 | 2015-03-23 | 현대자동차주식회사 | 반도체 소자의 제조 방법 |
| US9978845B2 (en) * | 2014-04-16 | 2018-05-22 | Yale University | Method of obtaining planar semipolar gallium nitride surfaces |
| US9978589B2 (en) | 2014-04-16 | 2018-05-22 | Yale University | Nitrogen-polar semipolar and gallium-polar semipolar GaN layers and devices on sapphire substrates |
| FR3021454B1 (fr) * | 2014-05-20 | 2019-12-13 | Centre National De La Recherche Scientifique (Cnrs) | Procede de fabrication d'un materiau semi-conducteur incluant une couche de nitrure d'element iii semi-polaire |
| JP7344426B2 (ja) * | 2014-11-26 | 2023-09-14 | 株式会社Flosfia | 結晶性積層構造体 |
| JP6945119B2 (ja) * | 2014-11-26 | 2021-10-06 | 株式会社Flosfia | 結晶性積層構造体およびその製造方法 |
| JP2016100593A (ja) * | 2014-11-26 | 2016-05-30 | 株式会社Flosfia | 結晶性積層構造体 |
| JP6638152B2 (ja) * | 2015-02-25 | 2020-01-29 | 株式会社Flosfia | 蛍光体組成物の製造方法および発光装置 |
| DE102015109761B4 (de) | 2015-06-18 | 2022-01-27 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Verfahren zur Herstellung eines Nitrid-Halbleiterbauelements und Nitrid-Halbleiterbauelement |
| FR3037711A1 (fr) * | 2015-06-18 | 2016-12-23 | Commissariat Energie Atomique | Procede permettant d'obtenir sur un substrat cristallin une couche semi-polaire de nitrure obtenu avec l'un au moins parmi les materiaux suivants : gallium (ga), indium (in) et aluminium (al) |
| KR20190038639A (ko) | 2016-08-12 | 2019-04-08 | 예일 유니버시티 | 성장 동안 질소 극성 패시트를 제거함으로써 외래 기판 상에 성장된 적층 무결함 반극성 및 비극성 GaN |
| JP6778579B2 (ja) * | 2016-10-18 | 2020-11-04 | 古河機械金属株式会社 | Iii族窒化物半導体基板、及び、iii族窒化物半導体基板の製造方法 |
| US10697090B2 (en) * | 2017-06-23 | 2020-06-30 | Panasonic Intellectual Property Management Co., Ltd. | Thin-film structural body and method for fabricating thereof |
| EP3556911A1 (fr) * | 2018-04-19 | 2019-10-23 | Comadur S.A. | Procédé de structuration d'un motif décoratif ou technique dans un objet réalisé en un matériau amorphe, semi-cristallin ou cristallin au moins partiellement transparent |
| JP7108783B2 (ja) * | 2019-03-28 | 2022-07-28 | 日本碍子株式会社 | 半導体膜 |
| CN110112266B (zh) * | 2019-05-22 | 2020-04-28 | 湘能华磊光电股份有限公司 | Led外延片衬底结构及制作方法 |
| CN110504301A (zh) * | 2019-09-09 | 2019-11-26 | 南方科技大学 | 一种iii族氮化物晶体管外延结构和晶体管器件 |
| US11145507B2 (en) * | 2019-12-16 | 2021-10-12 | Wafer Works Corporation | Method of forming gallium nitride film over SOI substrate |
| FR3118306B1 (fr) * | 2020-12-22 | 2023-05-05 | Commissariat Energie Atomique | Procédé de réalisation d’un dispositif optoélectronique comportant des LED à base de nitrure |
| CN119789619A (zh) * | 2024-11-18 | 2025-04-08 | 山东大学 | 一种具有倒“v”结构的非极性氮化镓衬底材料及其制备方法和应用 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101845670A (zh) * | 2005-03-10 | 2010-09-29 | 加利福尼亚大学董事会 | 用于生长平坦半极性氮化镓的技术 |
| KR100809209B1 (ko) * | 2006-04-25 | 2008-02-29 | 삼성전기주식회사 | 비극성 m면 질화물 반도체 제조방법 |
| JP5353113B2 (ja) * | 2008-01-29 | 2013-11-27 | 豊田合成株式会社 | Iii族窒化物系化合物半導体の製造方法 |
| JP5392855B2 (ja) * | 2008-08-25 | 2014-01-22 | 国立大学法人山口大学 | 半導体基板及びその製造方法 |
-
2010
- 2010-03-18 DE DE102010011895A patent/DE102010011895B4/de not_active Expired - Fee Related
-
2011
- 2011-03-18 US US13/051,154 patent/US8536030B2/en not_active Expired - Fee Related
- 2011-03-18 WO PCT/EP2011/001339 patent/WO2011113605A1/de not_active Ceased
- 2011-03-18 JP JP2012557448A patent/JP5810105B2/ja not_active Expired - Fee Related
- 2011-03-18 PL PL11709883T patent/PL2414567T3/pl unknown
- 2011-03-18 EP EP11709883.0A patent/EP2414567B1/de not_active Not-in-force
Also Published As
| Publication number | Publication date |
|---|---|
| DE102010011895B4 (de) | 2013-07-25 |
| US8536030B2 (en) | 2013-09-17 |
| EP2414567B1 (de) | 2013-11-20 |
| DE102010011895A1 (de) | 2011-09-22 |
| JP5810105B2 (ja) | 2015-11-11 |
| EP2414567A1 (de) | 2012-02-08 |
| JP2013522152A (ja) | 2013-06-13 |
| US20110227198A1 (en) | 2011-09-22 |
| WO2011113605A1 (de) | 2011-09-22 |
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