PL2457728T3 - Sposób laminowania obrabianych przedmiotów zasadniczo w postaci płyty - Google Patents
Sposób laminowania obrabianych przedmiotów zasadniczo w postaci płytyInfo
- Publication number
- PL2457728T3 PL2457728T3 PL11008212T PL11008212T PL2457728T3 PL 2457728 T3 PL2457728 T3 PL 2457728T3 PL 11008212 T PL11008212 T PL 11008212T PL 11008212 T PL11008212 T PL 11008212T PL 2457728 T3 PL2457728 T3 PL 2457728T3
- Authority
- PL
- Poland
- Prior art keywords
- shaped workpieces
- laminating substantially
- substantially board
- board
- laminating
- Prior art date
Links
- 238000010030 laminating Methods 0.000 title 1
- 238000000034 method Methods 0.000 title 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/0007—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding involving treatment or provisions in order to avoid deformation or air inclusion, e.g. to improve surface quality
- B32B37/003—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding involving treatment or provisions in order to avoid deformation or air inclusion, e.g. to improve surface quality to avoid air inclusion
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
- B32B37/1009—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure using vacuum and fluid pressure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2309/00—Parameters for the laminating or treatment process; Apparatus details
- B32B2309/02—Temperature
- B32B2309/022—Temperature vs pressure profiles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2309/00—Parameters for the laminating or treatment process; Apparatus details
- B32B2309/04—Time
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2309/00—Parameters for the laminating or treatment process; Apparatus details
- B32B2309/12—Pressure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/12—Photovoltaic modules
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
- B32B37/1207—Heat-activated adhesive
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
- B32B37/16—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating
- B32B37/18—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating involving the assembly of discrete sheets or panels only
Landscapes
- Physics & Mathematics (AREA)
- Fluid Mechanics (AREA)
- Engineering & Computer Science (AREA)
- Quality & Reliability (AREA)
- Photovoltaic Devices (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
- Laminated Bodies (AREA)
- Adhesives Or Adhesive Processes (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102010052780A DE102010052780A1 (de) | 2010-11-30 | 2010-11-30 | Verfahren zum Laminieren von im wesentlichen plattenförmigen Werkstücken |
| EP11008212.0A EP2457728B1 (de) | 2010-11-30 | 2011-10-11 | Verfahren zum Laminieren von im wesentlichen plattenförmigen Werkstücken |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| PL2457728T3 true PL2457728T3 (pl) | 2013-10-31 |
Family
ID=44897591
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PL11008212T PL2457728T3 (pl) | 2010-11-30 | 2011-10-11 | Sposób laminowania obrabianych przedmiotów zasadniczo w postaci płyty |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US9023163B2 (pl) |
| EP (1) | EP2457728B1 (pl) |
| JP (1) | JP5799778B2 (pl) |
| CN (1) | CN102529288B (pl) |
| DE (1) | DE102010052780A1 (pl) |
| ES (1) | ES2426028T3 (pl) |
| PL (1) | PL2457728T3 (pl) |
| TW (1) | TWI469877B (pl) |
Families Citing this family (26)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104272048B (zh) * | 2012-02-01 | 2017-01-18 | 振兴电子有限责任公司 | 用于干燥电子装置的方法和设备 |
| US10876792B2 (en) | 2012-02-01 | 2020-12-29 | Revive Electronics, LLC | Methods and apparatuses for drying electronic devices |
| US10690413B2 (en) | 2012-02-01 | 2020-06-23 | Revive Electronics, LLC | Methods and apparatuses for drying electronic devices |
| US12215925B2 (en) | 2020-04-21 | 2025-02-04 | Revive Electronics, LLC | Methods and apparatuses for drying electronic devices |
| US12276454B2 (en) | 2020-04-21 | 2025-04-15 | Revive Electronics, LLC | Methods and apparatuses for drying electronic devices |
| US10240867B2 (en) | 2012-02-01 | 2019-03-26 | Revive Electronics, LLC | Methods and apparatuses for drying electronic devices |
| US9970708B2 (en) | 2012-02-01 | 2018-05-15 | Revive Electronics, LLC | Methods and apparatuses for drying electronic devices |
| US11713924B2 (en) | 2012-02-01 | 2023-08-01 | Revive Electronics, LLC | Methods and apparatuses for drying electronic devices |
| US9644891B2 (en) | 2012-02-01 | 2017-05-09 | Revive Electronics, LLC | Methods and apparatuses for drying electronic devices |
| US12281847B2 (en) | 2020-04-21 | 2025-04-22 | Revive Electronics, LLC | Methods and apparatuses for drying electronic devices |
| WO2014153007A1 (en) | 2013-03-14 | 2014-09-25 | Revive Electronics, LLC | Methods and apparatuses for drying electronic devices |
| EP3034568A1 (de) | 2014-12-19 | 2016-06-22 | Evonik Degussa GmbH | Covernetzersysteme für Verkapselungsfolien umfassend Triallylisocyanurat und Triallylcyanurat |
| EP3034530A1 (de) | 2014-12-19 | 2016-06-22 | Evonik Degussa GmbH | Covernetzersysteme für Verkapselungsfolien umfassend Diene |
| EP3034567B1 (de) | 2014-12-19 | 2017-06-14 | Evonik Degussa GmbH | Covernetzersysteme für Verkapselungsfolien umfassend Ethylenglykoldi(meth)acrylatverbindungen |
| ES2632783T3 (es) | 2014-12-19 | 2017-09-15 | Evonik Degussa Gmbh | Sistemas de redes de cubierta para láminas de encapsulación que comprenden compuestos de bis-(alquenilamidas) |
| ES2635260T3 (es) | 2014-12-19 | 2017-10-03 | Evonik Degussa Gmbh | Sistemas correticulantes para láminas de encapsulado que comprenden compuestos de urea |
| EP3034525A1 (de) | 2014-12-19 | 2016-06-22 | Evonik Degussa GmbH | Covernetzersysteme für Verkapselungsfolien umfassend Pentaerythritolverbindungen |
| EP3034526B1 (de) | 2014-12-19 | 2017-06-14 | Evonik Degussa GmbH | Covernetzersysteme für Verkapselungsfolien |
| EP3034529B1 (de) | 2014-12-19 | 2017-06-14 | Evonik Degussa GmbH | Covernetzersysteme für verkapselungsfolien umfassend (meth)acrylamidverbindungen |
| EP3034531A1 (de) | 2014-12-19 | 2016-06-22 | Evonik Degussa GmbH | Dispersion zum einfachen Einsatz in der Herstellung von Verkapselungsfolien |
| DE102015115453A1 (de) | 2015-09-14 | 2017-03-16 | Robert Bürkle GmbH | Laminiervorrichtung zum Laminieren eines Schichtenstapels und Anlage zum Herstellen von Photovoltaikmodulen |
| CN107914453B (zh) * | 2017-11-28 | 2020-09-04 | 信利光电股份有限公司 | 一种板材结构及其贴合方法和电子设备 |
| DE102018101470A1 (de) | 2018-01-23 | 2019-07-25 | Robert Bürkle GmbH | Laminiervorrichtung und Verfahren zum Laminieren wenigstens eines Schichtenstapels |
| CN111070852B (zh) * | 2020-01-08 | 2021-09-03 | 中山市大自然格瑞新型材料有限公司 | 一种塑料板材真空覆膜装置 |
| US12510296B2 (en) | 2020-04-21 | 2025-12-30 | Revive Electronics, LLC | Methods and apparatuses for drying electronic devices |
| US12584689B2 (en) | 2020-04-21 | 2026-03-24 | Revive Electronics, LLC | Methods and apparatuses for drying electronic devices |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2034169B1 (pl) * | 1969-02-17 | 1974-02-22 | Saint Gobain Pont A Mousson | |
| US4180426A (en) * | 1969-02-17 | 1979-12-25 | Saint-Gobain Industries | Process and apparatus for making multiply sheets |
| IT1129885B (it) * | 1979-11-27 | 1986-06-11 | Bfg Glassgroup | Procedimento per formare un laminato a piu strati |
| GB2119704B (en) | 1982-04-30 | 1985-09-11 | Glaverbel | Process of forming multi-ply laminates |
| ATE175625T1 (de) * | 1993-06-11 | 1999-01-15 | Isovolta | Verfahren zur herstellung fotovoltaischer module sowie eine vorrichtung zur durchführung dieses verfahrens |
| US5698053A (en) * | 1995-06-16 | 1997-12-16 | Ppg Industries, Inc. | Method of forming a glass and plastic laminate |
| JPH10273213A (ja) * | 1997-03-28 | 1998-10-13 | Shinko Electric Co Ltd | ギヤ状部品の整列装置 |
| DE19903171C2 (de) | 1999-01-27 | 2003-03-20 | Saint Gobain Sekurit D Gmbh | Verfahren und Vorrichtung zum Laminieren von Verbundscheiben |
| JP5279813B2 (ja) * | 2008-03-12 | 2013-09-04 | 京セラ株式会社 | 太陽電池モジュールおよびその製造方法 |
| DE102008025790A1 (de) * | 2008-05-29 | 2009-12-03 | Robert Bürkle GmbH | Presse und Verfahren zum Laminieren von im Wesentlichen plattenförmigen Werkstücken |
| DE102008030927A1 (de) * | 2008-07-02 | 2009-10-22 | Robert Bürkle GmbH | Verfahren und Vorrichtung zum Laminieren von im Wesentlichen plattenförmigen Werkstücken unter Druck- und Wärmeeinwirkung |
| JP2010278147A (ja) * | 2009-05-27 | 2010-12-09 | Kyocera Corp | 太陽電池モジュールの製造方法 |
-
2010
- 2010-11-30 DE DE102010052780A patent/DE102010052780A1/de not_active Withdrawn
-
2011
- 2011-10-11 PL PL11008212T patent/PL2457728T3/pl unknown
- 2011-10-11 ES ES11008212T patent/ES2426028T3/es active Active
- 2011-10-11 EP EP11008212.0A patent/EP2457728B1/de active Active
- 2011-10-25 TW TW100138628A patent/TWI469877B/zh active
- 2011-11-04 CN CN201110346043.1A patent/CN102529288B/zh active Active
- 2011-11-22 US US13/302,293 patent/US9023163B2/en active Active
- 2011-11-30 JP JP2011262266A patent/JP5799778B2/ja active Active
Also Published As
| Publication number | Publication date |
|---|---|
| TWI469877B (zh) | 2015-01-21 |
| TW201233555A (en) | 2012-08-16 |
| JP5799778B2 (ja) | 2015-10-28 |
| US9023163B2 (en) | 2015-05-05 |
| JP2012116190A (ja) | 2012-06-21 |
| US20120132360A1 (en) | 2012-05-31 |
| EP2457728B1 (de) | 2013-07-31 |
| EP2457728A1 (de) | 2012-05-30 |
| CN102529288B (zh) | 2015-01-07 |
| DE102010052780A1 (de) | 2012-05-31 |
| ES2426028T3 (es) | 2013-10-18 |
| CN102529288A (zh) | 2012-07-04 |
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