PL2464421T3 - Ultracienkie wielowarstwowe opakowywanie - Google Patents

Ultracienkie wielowarstwowe opakowywanie

Info

Publication number
PL2464421T3
PL2464421T3 PL10760419T PL10760419T PL2464421T3 PL 2464421 T3 PL2464421 T3 PL 2464421T3 PL 10760419 T PL10760419 T PL 10760419T PL 10760419 T PL10760419 T PL 10760419T PL 2464421 T3 PL2464421 T3 PL 2464421T3
Authority
PL
Poland
Prior art keywords
ultra
layer packaging
thin multi
thin
packaging
Prior art date
Application number
PL10760419T
Other languages
English (en)
Inventor
Andreas Hogg
Herbert Keppner
Juergen Burger
Thierry Aellen
Original Assignee
Medos International S.A.R.L.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Medos International S.A.R.L. filed Critical Medos International S.A.R.L.
Publication of PL2464421T3 publication Critical patent/PL2464421T3/pl

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09872—Insulating conformal coating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/114—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by a substrate and the encapsulations
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/23—Sheet including cover or casing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/23—Sheet including cover or casing
    • Y10T428/239—Complete cover or casing

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Materials For Medical Uses (AREA)
  • Prostheses (AREA)
  • Chemical Vapour Deposition (AREA)
PL10760419T 2009-08-12 2010-08-12 Ultracienkie wielowarstwowe opakowywanie PL2464421T3 (pl)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US23339509P 2009-08-12 2009-08-12
US12/854,298 US8313819B2 (en) 2009-08-12 2010-08-11 Ultra-thin multi-layer packaging
EP10760419.1A EP2464421B1 (en) 2009-08-12 2010-08-12 Ultra-thin multi-layer packaging

Publications (1)

Publication Number Publication Date
PL2464421T3 true PL2464421T3 (pl) 2017-04-28

Family

ID=43128352

Family Applications (1)

Application Number Title Priority Date Filing Date
PL10760419T PL2464421T3 (pl) 2009-08-12 2010-08-12 Ultracienkie wielowarstwowe opakowywanie

Country Status (6)

Country Link
US (1) US8313819B2 (pl)
EP (1) EP2464421B1 (pl)
AU (1) AU2010283553B2 (pl)
CA (1) CA2770611C (pl)
PL (1) PL2464421T3 (pl)
WO (1) WO2011018709A2 (pl)

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US8313811B2 (en) * 2009-08-12 2012-11-20 Medos International S.A.R.L. Plasma enhanced polymer ultra-thin multi-layer packaging
US8313819B2 (en) 2009-08-12 2012-11-20 Medos International S.A.R.L. Ultra-thin multi-layer packaging
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US9345813B2 (en) * 2012-06-07 2016-05-24 Medos International S.A.R.L. Three dimensional packaging for medical implants
CN107529985B (zh) 2015-03-31 2020-03-31 加州理工学院 用于长期可植入传感器和电子装置的生物相容性封装
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WO2019014926A1 (zh) * 2017-07-21 2019-01-24 深圳先进技术研究院 一种具有封装层的医学植入器件以及一种医学植入器件的封装方法
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US20210307609A1 (en) * 2018-07-25 2021-10-07 Qura, Inc. Implantable intraocular pressure sensors configured as capsular tension rings
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US12178512B2 (en) * 2018-10-17 2024-12-31 Qura, Inc. Implantable devices with embedded pressure sensors
WO2020114617A1 (en) * 2018-12-07 2020-06-11 Pixium Vision Sa Hermetic packaging of electronic components
US11701504B2 (en) 2020-01-17 2023-07-18 California Institute Of Technology Implantable intracranial pressure sensor

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US8313811B2 (en) 2009-08-12 2012-11-20 Medos International S.A.R.L. Plasma enhanced polymer ultra-thin multi-layer packaging

Also Published As

Publication number Publication date
AU2010283553A1 (en) 2012-04-05
US20110039050A1 (en) 2011-02-17
US8313819B2 (en) 2012-11-20
CA2770611C (en) 2019-02-12
AU2010283553B2 (en) 2015-05-07
WO2011018709A8 (en) 2012-04-12
WO2011018709A3 (en) 2011-04-14
WO2011018709A2 (en) 2011-02-17
CA2770611A1 (en) 2011-02-17
EP2464421B1 (en) 2016-10-05
EP2464421A2 (en) 2012-06-20

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