PL2542618T3 - System żywicy termoutwardzalnej o niskiej stracie dielektrycznej przy wysokiej częstotliwości do stosowania w komponentach elektrycznych - Google Patents

System żywicy termoutwardzalnej o niskiej stracie dielektrycznej przy wysokiej częstotliwości do stosowania w komponentach elektrycznych

Info

Publication number
PL2542618T3
PL2542618T3 PL11751252T PL11751252T PL2542618T3 PL 2542618 T3 PL2542618 T3 PL 2542618T3 PL 11751252 T PL11751252 T PL 11751252T PL 11751252 T PL11751252 T PL 11751252T PL 2542618 T3 PL2542618 T3 PL 2542618T3
Authority
PL
Poland
Prior art keywords
high frequency
electrical components
low dielectric
dielectric loss
resin system
Prior art date
Application number
PL11751252T
Other languages
English (en)
Inventor
Roger Tietze
Yen-Loan Nguyen
Original Assignee
Huntsman Advanced Materials Americas Llc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Huntsman Advanced Materials Americas Llc filed Critical Huntsman Advanced Materials Americas Llc
Publication of PL2542618T3 publication Critical patent/PL2542618T3/pl

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/35—Heterocyclic compounds having nitrogen in the ring having also oxygen in the ring
    • C08K5/357—Six-membered rings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
    • B01J31/00—Catalysts comprising hydrides, coordination complexes or organic compounds
    • B01J31/02—Catalysts comprising hydrides, coordination complexes or organic compounds containing organic compounds or metal hydrides
    • B01J31/0234—Nitrogen-, phosphorus-, arsenic- or antimony-containing compounds
    • B01J31/0235—Nitrogen containing compounds
    • B01J31/0237—Amines
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B32B15/092—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising epoxy resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/14—Layered products comprising a layer of metal next to a fibrous or filamentary layer
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/49—Phosphorus-containing compounds
    • C08K5/51—Phosphorus bound to oxygen
    • C08K5/53—Phosphorus bound to oxygen bound to oxygen and to carbon only
    • C08K5/5317—Phosphonic compounds, e.g. R—P(:O)(OR')2
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
    • B32B2260/02—Composition of the impregnated, bonded or embedded layer
    • B32B2260/021—Fibrous or filamentary layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
    • B32B2260/04—Impregnation, embedding, or binder material
    • B32B2260/046—Synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y10T428/31529—Next to metal
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T442/00—Fabric [woven, knitted, or nonwoven textile or cloth, etc.]
    • Y10T442/20—Coated or impregnated woven, knit, or nonwoven fabric which is not [a] associated with another preformed layer or fiber layer or, [b] with respect to woven and knit, characterized, respectively, by a particular or differential weave or knit, wherein the coating or impregnation is neither a foamed material nor a free metal or alloy layer
    • Y10T442/2475—Coating or impregnation is electrical insulation-providing, -improving, or -increasing, or conductivity-reducing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T442/00—Fabric [woven, knitted, or nonwoven textile or cloth, etc.]
    • Y10T442/30—Woven fabric [i.e., woven strand or strip material]
    • Y10T442/3382—Including a free metal or alloy constituent

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Reinforced Plastic Materials (AREA)
  • Epoxy Resins (AREA)
  • Phenolic Resins Or Amino Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Laminated Bodies (AREA)
PL11751252T 2010-03-05 2011-03-02 System żywicy termoutwardzalnej o niskiej stracie dielektrycznej przy wysokiej częstotliwości do stosowania w komponentach elektrycznych PL2542618T3 (pl)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US31091310P 2010-03-05 2010-03-05
PCT/US2011/026786 WO2011109463A1 (en) 2010-03-05 2011-03-02 Low dielectric loss thermoset resin system at high frequency for use in electrical components
EP11751252.5A EP2542618B1 (en) 2010-03-05 2011-03-02 Low dielectric loss thermoset resin system at high frequency for use in electrical components

Publications (1)

Publication Number Publication Date
PL2542618T3 true PL2542618T3 (pl) 2020-08-10

Family

ID=44542555

Family Applications (1)

Application Number Title Priority Date Filing Date
PL11751252T PL2542618T3 (pl) 2010-03-05 2011-03-02 System żywicy termoutwardzalnej o niskiej stracie dielektrycznej przy wysokiej częstotliwości do stosowania w komponentach elektrycznych

Country Status (12)

Country Link
US (1) US9580577B2 (pl)
EP (1) EP2542618B1 (pl)
JP (1) JP2013521381A (pl)
KR (2) KR20170097233A (pl)
CN (1) CN102782034B (pl)
DK (1) DK2542618T3 (pl)
ES (1) ES2776990T3 (pl)
HU (1) HUE048499T2 (pl)
MY (1) MY169978A (pl)
PL (1) PL2542618T3 (pl)
TW (1) TWI501961B (pl)
WO (1) WO2011109463A1 (pl)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104114526B (zh) * 2012-02-17 2018-09-07 亨斯迈先进材料美国有限责任公司 苯并噁嗪、环氧树脂和酸酐的混合物
WO2014004900A2 (en) * 2012-06-27 2014-01-03 Toray Composites (America), Inc. Benzoxazine resin composition, prepreg, and fiber-reinforced composite material
CN103540101B (zh) * 2012-07-17 2016-01-20 台光电子材料(昆山)有限公司 无卤素树脂组合物及应用其的铜箔基板及印刷电路板
US9850375B2 (en) * 2013-08-23 2017-12-26 Elite Electronic Material (Kunshan) Co. Ltd. Resin composition, copper clad laminate and printed circuit board using same
CN104974520B (zh) * 2014-04-02 2017-11-03 广东生益科技股份有限公司 一种无卤树脂组合物及其用途
DE102014106885B4 (de) * 2014-05-15 2022-01-20 Pictiva Displays International Limited Verfahren zur Herstellung einer Isolatorschicht, Verfahren zur Herstellung eines organischen optoelektronischen Bauelements umfassend eine Isolatorschicht und organisches optoelektronisches Bauelement umfassend eine Isolatorschicht
JP6423316B2 (ja) * 2014-07-04 2018-11-14 群栄化学工業株式会社 新規アルデヒド含有樹脂
JP6555975B2 (ja) * 2015-08-07 2019-08-07 群栄化学工業株式会社 新規イミン基含有樹脂
CN105062066B (zh) * 2015-09-02 2018-07-06 南京安尔泰通信科技有限公司 高频电子介质材料
BR112018073028B1 (pt) * 2016-05-10 2023-04-11 Huntsman Advanced Materials Americas Llc Sistema curável, artigo curado, e, método para produção de um prepreg ou towpreg
KR102338982B1 (ko) * 2016-06-27 2021-12-14 코오롱인더스트리 주식회사 열경화성 수지 조성물, 이를 이용한 프리프레그 및 기판
US11560465B2 (en) * 2017-03-31 2023-01-24 Eneos Corporation Composition for curable resin, cured product of said composition, method of producing said composition and said cured product, and semiconductor device
TWI794178B (zh) * 2017-06-29 2023-03-01 南韓商可隆股份有限公司 可固化組成物以及使用此組成物的預浸料以及印刷電路板
CN109135191B (zh) * 2018-08-14 2020-04-07 苏州德林泰精工科技有限公司 一种用于芯片堆叠封装的树脂垫片及其制备方法
TWI710594B (zh) * 2019-01-09 2020-11-21 大陸商東莞聯茂電子科技有限公司 用於覆銅板的無鹵高耐熱樹脂組合物
CN111662616A (zh) * 2020-07-09 2020-09-15 周红岩 一种热固性树脂组合物及其应用

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001122948A (ja) * 1999-10-28 2001-05-08 Hitachi Chem Co Ltd 難燃性樹脂組成物、プリプレグ及びプリント配線板用積層板
US6743852B2 (en) 2001-11-13 2004-06-01 Henkel Corporation Benzoxazines, thermosetting resins comprised thereof, and methods for use thereof
AU2003290646A1 (en) * 2002-11-08 2004-06-03 Akzo Nobel N.V. Epoxy resin composition containing reactive flame retardant phosphonate oligomer and filler
US20070191555A1 (en) * 2004-03-30 2007-08-16 Hatsuo Ishida Thermosetting resin composition and its article
KR101148353B1 (ko) * 2004-05-28 2012-05-21 다우 글로벌 테크놀로지스 엘엘씨 내인화성 할로겐 무함유 중합체의 제조에 유용한 인 함유화합물
EP1647576A1 (en) * 2005-04-01 2006-04-19 Huntsman Advanced Materials (Switzerland) GmbH Composition comprising benzoxazine and epoxy resin
JP2009001692A (ja) * 2007-06-22 2009-01-08 Akebono Brake Ind Co Ltd 熱硬化性樹脂材料
JP5685189B2 (ja) * 2008-08-12 2015-03-18 ハンツマン・アドヴァンスト・マテリアルズ・（スイッツランド）・ゲーエムベーハー 熱硬化性組成物

Also Published As

Publication number Publication date
WO2011109463A1 (en) 2011-09-09
TWI501961B (zh) 2015-10-01
US9580577B2 (en) 2017-02-28
TW201139428A (en) 2011-11-16
MY169978A (en) 2019-06-19
ES2776990T3 (es) 2020-08-03
EP2542618A4 (en) 2014-03-05
KR20130048209A (ko) 2013-05-09
JP2013521381A (ja) 2013-06-10
CN102782034A (zh) 2012-11-14
EP2542618A1 (en) 2013-01-09
CN102782034B (zh) 2014-08-20
HUE048499T2 (hu) 2020-07-28
KR20170097233A (ko) 2017-08-25
DK2542618T3 (da) 2020-04-06
US20120318571A1 (en) 2012-12-20
HK1177944A1 (en) 2013-08-30
EP2542618B1 (en) 2020-01-01
KR101770579B1 (ko) 2017-08-23

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