PL2573829T3 - Moduł diody elektroluminescencyjnej - Google Patents

Moduł diody elektroluminescencyjnej

Info

Publication number: PL2573829T3
Authority: PL; Poland
Prior art keywords: light emitting; emitting diode; diode module; module; light
Prior art date: 2006-10-20

Application number

PL12198155T

Other languages

English (en)

Inventor

Franz Schrank

Hans Hoschopf

Original Assignee

Tridonic Gmbh & Co. Kg

Lumitech Patentverwertung Gmbh

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2006-10-20

Filing date

2007-10-16

Publication date

2020-11-30

Family has litigation

First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=37846062&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=PL2573829(T3) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.

2007-10-16 Application filed by Tridonic Gmbh & Co. Kg, Lumitech Patentverwertung Gmbh filed Critical Tridonic Gmbh & Co. Kg

2020-11-30 Publication of PL2573829T3 publication Critical patent/PL2573829T3/pl

Links

Classifications

- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/852—Encapsulations
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F77/00—Constructional details of devices covered by this subclass
- H10F77/30—Coatings
- H10F77/306—Coatings for devices having potential barriers
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F77/00—Constructional details of devices covered by this subclass
- H10F77/50—Encapsulations or containers
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/855—Optical field-shaping means, e.g. lenses
- H10H20/856—Reflecting means
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/852—Encapsulations
- H10H20/854—Encapsulations characterised by their material, e.g. epoxy or silicone resins
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

PL12198155T 2006-10-20 2007-10-16 Moduł diody elektroluminescencyjnej PL2573829T3 (pl)

Applications Claiming Priority (4)

Application Number	Priority Date	Filing Date	Title
EP06022064A EP1914809A1 (en)	2006-10-20	2006-10-20	Cover for optoelectronic components
EP12198155.9A EP2573829B8 (en)	2006-10-20	2007-10-16	Light emitting diode module
PCT/EP2007/008960 WO2008046583A1 (en)	2006-10-20	2007-10-16	Cover for optoelectronic components
EP07819030.3A EP2082441B1 (en)	2006-10-20	2007-10-16	Light emitting diode module and method for manufacturing the same

Publications (1)

Publication Number	Publication Date
PL2573829T3 true PL2573829T3 (pl)	2020-11-30

Family

ID=37846062

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
PL12198155T PL2573829T3 (pl)	2006-10-20	2007-10-16	Moduł diody elektroluminescencyjnej

Country Status (6)

Country	Link
EP (4)	EP1914809A1 (pl)
DE (1)	DE202007019330U1 (pl)
HU (1)	HUE048971T2 (pl)
PL (1)	PL2573829T3 (pl)
TW (2)	TWM456497U (pl)
WO (1)	WO2008046583A1 (pl)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US8247827B2 (en) *	2008-09-30	2012-08-21	Bridgelux, Inc.	LED phosphor deposition
EP2448028B1 (en)	2010-10-29	2017-05-31	Nichia Corporation	Light emitting apparatus and production method thereof
US8373183B2 (en)	2011-02-22	2013-02-12	Hong Kong Applied Science and Technology Research Institute Company Limited	LED package for uniform color emission
CN103149648B (zh) *	2011-12-07	2016-03-02	鸿富锦精密工业（深圳）有限公司	光电模组
AT14124U1 (de)	2012-02-13	2015-04-15	Tridonic Jennersdorf Gmbh	LED-Modul mit Flächenverguß
DE102013224600A1 (de) *	2013-11-29	2015-06-03	Osram Opto Semiconductors Gmbh	Verfahren zum Herstellen eines optoelektronischen Bauelements
CN110349510B (zh) *	2018-04-08	2024-07-16	北京环宇蓝博科技有限公司	一种用于led显示屏幕的幕罩
EP3598510B1 (en) *	2018-07-18	2022-02-23	Lumileds LLC	Light emitting diode device and producing methods thereof
CN111477732B (zh)	2019-01-24	2021-10-08	隆达电子股份有限公司	发光装置
DE102019119182A1 (de) *	2019-07-16	2021-01-21	Wobben Properties Gmbh	Verfahren zum Herstellen eines Segmentblechpaketes für einen Stator eines Generators einer Windenergieanlage
CN116449650B (zh) *	2023-04-18	2026-03-13	成都太阳井智能装备有限公司	一种感光性组合物、掩膜图形形成方法及电池片

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPH07297324A (ja)	1994-04-25	1995-11-10	Sony Corp	半導体装置およびその製造方法
JP3393247B2 (ja) *	1995-09-29	2003-04-07	ソニー株式会社	光学装置およびその製造方法
DE19638667C2 (de)	1996-09-20	2001-05-17	Osram Opto Semiconductors Gmbh	Mischfarbiges Licht abstrahlendes Halbleiterbauelement mit Lumineszenzkonversionselement
NL1004651C2 (nl) *	1996-11-29	1998-06-03	Nedcard	Werkwijze voor het inkapselen van een chip op een drager.
US6274890B1 (en) *	1997-01-15	2001-08-14	Kabushiki Kaisha Toshiba	Semiconductor light emitting device and its manufacturing method
EP1059668A3 (en) *	1999-06-09	2007-07-18	Sanyo Electric Co., Ltd.	Hybrid integrated circuit device
WO2001059851A1 (fr)	2000-02-09	2001-08-16	Nippon Leiz Corporation	Source lumineuse
DE10024336A1 (de) *	2000-05-17	2001-11-22	Heidenhain Gmbh Dr Johannes	Bauelementanordnung und Verfahren zur Herstellung einer Bauelementanordnung
JP4101468B2 (ja)	2001-04-09	2008-06-18	豊田合成株式会社	発光装置の製造方法
DE10153259A1 (de)	2001-10-31	2003-05-22	Osram Opto Semiconductors Gmbh	Optoelektronisches Bauelement
DE10245946C1 (de) *	2002-09-30	2003-10-23	Osram Opto Semiconductors Gmbh	Verfahren zur Herstellung eines Lichtquellenmoduls
DE10310844B4 (de)	2003-03-10	2021-06-10	OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung	Optoelektronisches Bauelement mit einem Gehäusekörper aus Kunststoff
KR101097641B1 (ko) *	2003-11-14	2011-12-22	하리손 도시바 라이팅구 가부시키가이샤	발광 소자의 엔클로저 및 그 제조 방법
EP1751806B1 (de) *	2004-05-31	2019-09-11	OSRAM Opto Semiconductors GmbH	Optoelektronisches halbleiterbauelement und gehäuse-grundkörper für ein derartiges bauelement
US20070289129A1 (en)	2004-08-06	2007-12-20	Wing Kenneth E	Selective Encapsulation of Electronic Components
JP2006066786A (ja) *	2004-08-30	2006-03-09	Seiwa Electric Mfg Co Ltd	発光ダイオード
DE102004053116A1 (de) *	2004-11-03	2006-05-04	Tridonic Optoelectronics Gmbh	Leuchtdioden-Anordnung mit Farbkonversions-Material
US7365371B2 (en) *	2005-08-04	2008-04-29	Cree, Inc.	Packages for semiconductor light emitting devices utilizing dispensed encapsulants

2006
- 2006-10-20 EP EP06022064A patent/EP1914809A1/en not_active Withdrawn
2007
- 2007-10-16 EP EP07819030.3A patent/EP2082441B1/en active Active
- 2007-10-16 EP EP12198155.9A patent/EP2573829B8/en active Active
- 2007-10-16 EP EP10184330.8A patent/EP2290716B1/en active Active
- 2007-10-16 DE DE202007019330U patent/DE202007019330U1/de not_active Expired - Lifetime
- 2007-10-16 HU HUE12198155A patent/HUE048971T2/hu unknown
- 2007-10-16 WO PCT/EP2007/008960 patent/WO2008046583A1/en not_active Ceased
- 2007-10-16 PL PL12198155T patent/PL2573829T3/pl unknown
- 2007-10-19 TW TW101212117U patent/TWM456497U/zh not_active IP Right Cessation
- 2007-10-19 TW TW096139378A patent/TWI435469B/zh active

Also Published As

Publication number	Publication date
TWI435469B (zh)	2014-04-21
EP2573829A2 (en)	2013-03-27
EP2290716A3 (en)	2013-01-23
EP2290716A2 (en)	2011-03-02
WO2008046583A1 (en)	2008-04-24
EP2573829B1 (en)	2020-04-22
EP2573829B8 (en)	2020-06-10
EP2290716B1 (en)	2019-06-12
EP2573829A3 (en)	2017-01-25
TW200834985A (en)	2008-08-16
HUE048971T2 (hu)	2020-09-28
EP1914809A1 (en)	2008-04-23
TWM456497U (zh)	2013-07-01
EP2082441A1 (en)	2009-07-29
DE202007019330U1 (de)	2011-10-27
EP2082441B1 (en)	2013-12-18

Publication	Publication Date	Title
TWI372918B (en)	2012-09-21	Edge lighting light-emitting diode backlight module
GB2447091B (en)	2009-12-23	Vertical light emitting diodes
IL204616A0 (en)	2010-11-30	Light emitting diode recessed light fixture
PL2143303T3 (pl)	2013-01-31	Zasilanie diod emitujących światło
TWI341039B (en)	2011-04-21	Light emitting diode apparatus
EP2264793B8 (en)	2017-11-29	Light emitting diode
EP2347170A4 (en)	2017-12-27	Light emitting diode emergency lighting module
PL2082167T3 (pl)	2017-08-31	Urządzenie oświetlające diodą emitującą światło
PL2573829T3 (pl)	2020-11-30	Moduł diody elektroluminescencyjnej
GB0823453D0 (en)	2009-01-28	Semiconductor light emitting element
GB0818659D0 (en)	2008-12-03	Light emitting element
TWM312020U (en)	2007-05-11	Light emitting diode package structure
TWI319629B (en)	2010-01-11	Light emitting diode module
TWI350600B (en)	2011-10-11	Semiconductor light emitting element
TWI371017B (en)	2012-08-21	Organic light emitting diode display device
TWI383518B (en)	2013-01-21	Light emitting diode
TWI346514B (en)	2011-08-01	Back light module and light emitting diode package structure therefor
GB0617307D0 (en)	2006-10-11	Light emitting diode display device
TWI370298B (en)	2012-08-11	Backlight unit using light emitting diode
TWI330415B (en)	2010-09-11	Light emitting diode and a backlight module using the same
TWI371093B (en)	2012-08-21	Light emitting diode heatsink
TWI366288B (en)	2012-06-11	Light emitting diode
TWI372477B (en)	2012-09-11	Light emitting device
TWI367583B (en)	2012-07-01	Light emitting diode module
GB0815052D0 (en)	2008-09-24	Light emitting diode lamp