PL2596157T3 - Wciskany element stykowy oraz sposób jego wytwarzania - Google Patents

Wciskany element stykowy oraz sposób jego wytwarzania

Info

Publication number
PL2596157T3
PL2596157T3 PL12717606T PL12717606T PL2596157T3 PL 2596157 T3 PL2596157 T3 PL 2596157T3 PL 12717606 T PL12717606 T PL 12717606T PL 12717606 T PL12717606 T PL 12717606T PL 2596157 T3 PL2596157 T3 PL 2596157T3
Authority
PL
Poland
Prior art keywords
press
production
fit contact
fit
contact
Prior art date
Application number
PL12717606T
Other languages
English (en)
Inventor
Uwe Dreissigacker
Original Assignee
Enayati Gmbh&Co Kg Oberflaechen Und Anlagentechnik
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Enayati Gmbh&Co Kg Oberflaechen Und Anlagentechnik filed Critical Enayati Gmbh&Co Kg Oberflaechen Und Anlagentechnik
Publication of PL2596157T3 publication Critical patent/PL2596157T3/pl

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/60—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of tin
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/08—Electroplating with moving electrolyte e.g. jet electroplating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
    • C25D5/611—Smooth layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/615—Microstructure of the layers, e.g. mixed structure
    • C25D5/617—Crystalline layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
    • H01R12/58—Fixed connections for rigid printed circuits or like structures characterised by the terminals terminals for insertion into holes
    • H01R12/585—Terminals having a press fit or a compliant portion and a shank passing through a hole in the printed circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/306—Assembling printed circuits with electric components, e.g. with resistors with lead-in-hole components
    • H05K3/308—Adaptations of leads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/1059—Connections made by press-fit insertion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10742—Details of leads
    • H05K2201/10886—Other details
    • H05K2201/10909—Materials of terminal, e.g. of leads or electrodes of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/325—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by abutting or pinching; Mechanical auxiliary parts therefor

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
PL12717606T 2011-05-13 2012-04-21 Wciskany element stykowy oraz sposób jego wytwarzania PL2596157T3 (pl)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102011101602A DE102011101602A1 (de) 2011-05-13 2011-05-13 Einpresspin und Verfahren zu seiner Herstellung
EP12717606.3A EP2596157B1 (de) 2011-05-13 2012-04-21 Einpresspin und verfahren zu seiner herstellung
PCT/EP2012/001733 WO2012156021A1 (de) 2011-05-13 2012-04-21 Einpresspin und verfahren zu seiner herstellung

Publications (1)

Publication Number Publication Date
PL2596157T3 true PL2596157T3 (pl) 2015-05-29

Family

ID=46022156

Family Applications (1)

Application Number Title Priority Date Filing Date
PL12717606T PL2596157T3 (pl) 2011-05-13 2012-04-21 Wciskany element stykowy oraz sposób jego wytwarzania

Country Status (4)

Country Link
EP (1) EP2596157B1 (pl)
DE (1) DE102011101602A1 (pl)
PL (1) PL2596157T3 (pl)
WO (1) WO2012156021A1 (pl)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102012213505A1 (de) * 2012-07-31 2014-02-06 Tyco Electronics Amp Gmbh Schicht für ein elektrisches Kontaktelement, Schichtsystem und Verfahren zur Herstellung einer Schicht
DE102015003285A1 (de) * 2015-03-14 2016-09-15 Diehl Metal Applications Gmbh Verfahren zur Beschichtung eines Einpresspins und Einpresspin
DE102018109059B4 (de) 2018-01-15 2020-07-23 Doduco Solutions Gmbh Elektrischer Einpress-Kontaktstift
DE102024109322B4 (de) 2024-04-03 2025-10-16 Enayati Oberflächentechnik GmbH Einpresspin, Baugruppe und Verfahren zur Herstellung einer solchen Baugruppe

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19831672B4 (de) 1998-07-15 2005-05-12 Ludger Sorig Einpreßkontakt
US6361823B1 (en) * 1999-12-03 2002-03-26 Atotech Deutschland Gmbh Process for whisker-free aqueous electroless tin plating
JP2006009039A (ja) 2004-06-21 2006-01-12 Rambo Chemicals (Hong Kong) Ltd ウィスカー成長が抑制されたスズ系めっき皮膜及びその形成方法
DE102005055742A1 (de) * 2005-11-23 2007-05-24 Robert Bosch Gmbh Verfahren zum Herstellen einer kontaktgeeigneten Schicht auf einem Metallelement
DE102006057143A1 (de) 2006-12-01 2008-06-05 Tyco Electronics Belgium Ec N.V. Einpressstift für eine elektrisch leitende Verbindung zwischen dem Einpressstift und einer Buchse
DE102007014356A1 (de) * 2007-03-26 2008-10-02 Robert Bosch Gmbh Pin zum Einsetzen in eine Aufnahmeöffnung einer Leiterplatte und Verfahren zum Einsetzen eines Pin in eine Aufnahmeöffnung einer Leiterplatte
US20090239398A1 (en) 2008-03-20 2009-09-24 Interplex Nas, Inc. Press fit (compliant) terminal and other connectors with tin-silver compound
DE102008042824B4 (de) 2008-10-14 2022-01-27 Robert Bosch Gmbh Elektrischer Leiter und Verfahren zur Herstellung eines elektrischen Leiters
US7780483B1 (en) * 2008-12-09 2010-08-24 Anthony Ravlich Electrical press-fit contact

Also Published As

Publication number Publication date
WO2012156021A1 (de) 2012-11-22
DE102011101602A1 (de) 2012-11-15
EP2596157B1 (de) 2014-11-19
EP2596157A1 (de) 2013-05-29

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